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Details, datasheet, quote on part number:430TXPCISET
 
 
Part:430TXPCISET
Category:Communication => Others => Databus ICs
Description:82439tx System Controller (mtxc)
Company:Intel Corporation
Datasheet:Download 430TXPCISET datasheet   File size : 472 kB
Request For quote:  Find where to buy 430TXPCISET
 



Datasheet text preview:
PRELIMINARY

INTEL 430TX PCISET: 82439TX SYSTEM CONTROLLER (MTXC)
Supports Mobile and Desktop ® Supports the Pentium Processor Family Host Bus at 66 MHz and 60 MHz at 3.3V and 2.5V PCI 2.1 Compliant Integrated Data Path Integrated DRAM Controller 4 Mbytes to 256 MBytes main memory 64-Mbit DRAM/SDRAM Technology Support FPM (Fast Page Mode), EDO and SDRAM DRAM Support 6 RAS Lines Available Integrated Programmable Strength for DRAM Interface CAS-Before-RAS Refresh, Extended Refresh and Self Refresh for EDO CAS-Before-RAS and Self Refresh for SDRAM Integrated L2 Cache Controller 64-MB DRAM Cacheability Direct Mapped Organization--Write Back Only Supports 256K and 512K Pipelined Burst SRAM and DRAM Cache SRAM Cache Hit Read/Write Cycle Timings at 3-1-1-1 Back-to-Back Read/Write Cycles at 3-1-1-1-1-1-1-1 64K x 32 SRAM also supported Fully Synchronous, Minimum Latency 30/33-MHz PCI Bus Interface Five PCI Bus Masters (including PIIX4) 10 DWord PCI-to-DRAM Read Prefetch Buffer 18 DWord PCI-DRAM Post Buffer Multi-Transaction Timer to Support Multiple Short PCI Transactions Power Management Features PCI CLKRUN# Support Dynamic Stop Clock Support Suspend to RAM (STR) Suspend to Disk (STD) Power On Suspend (POS) Internal Clock Control SDRAM and EDO Self Refresh During Suspend ACPI Support Compatible SMRAM (C_SMRAM) and Extended SMRAM (E_SMRAM) SMM Writeback Cacheable in E_SMRAM Mode up to 1 MB 3.3/5V DRAM, 3.3/5V PCI 3.3/5V Tag and 3.3/2.5 SRAM Support Test Features NAND Tree Support for all Pins Supports the Universal Serial Bus (USB) 324-Pin MBGA 430TX PCIset Xcelerated Controller (MTXC) with integrated Data Paths

The Intel 430TX PCIset (430TX) consists of the 82439TX System Controller (MTXC) and the 82371AB PCI ISA IDE Xcelerator (PIIX4). The 430TX supports both mobile and desktop architectures. The 430TX forms a Host-toPCI bridge and provides the second level cache control and a full function 64-bit data path to main memory. The MTXC integrates the cache and main memory DRAM control functions and provides bus control to transfers between the CPU, cache, main memory, and the PCI Bus. The second level (L2) cache controller supports a writeback cache policy for cache sizes of 256 Kbytes and 512 Kbytes. Cacheless designs are also supported. The cache memory can be implemented with pipelined burst SRAMs or DRAM cache SRAMs. An external Tag RAM is used for the address tag and an internal Tag RAM for the cache line status bits. For the MTXC DRAM controller, six rows are supported for up to 256 Mbytes of main memory. The MTXC is highly integrated by including the Data Path into the same BGA chip. Using the snoop ahead feature, the MTXC allows PCI masters to achieve full PCI bandwidth. For increased system performance, the MTXC integrates posted write and read prefetch buffers. The 430TX integrates many Power Management features that enable the system to save power when the system resources become idle.
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by the sale of Intel products. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel retains the right to make changes to specifications and product descriptions at any time, without notice. The Intel 430TX PCIset may contain design defects or errors known as errata. Current characterized errata are available on request. Third-party brands and names are the property of their respective owners.

© INTEL CORPORATION 1997

February 1997

Order Number: 290559-001

2

82439TX (MTXC)

H D [63:0] A[31:0] BE[7:0]# ADS# D /C # M /IO# W /R# BRDY# EADS# HITM# BOFF# AHOLD NA# KEN#/INV CACHE# HLOCK# SMIACT# CCS# TWE# COE# GWE# CADS# CADV# TIO[7:0] KRQAK/CS4_64# BWE#

Host Interface

PCI Interface

CLKRUN# AD[31:0] C/BE[3:0]# FRAME# TRDY# IRDY# STOP# PLOCK# DEVSEL# PAR REQ[3:0]# GNT[3:0]# PHLDA# PHLD#

DRAM Interface Cache Interface

MD[63:0] SRAS[A,B]# RAS[5:0]#/CS[5:0]# C A S [7:0]#/DQM[7:0]# MA[11:0] SCAS[A,B]# MWE# MWEB# CKE/MAA0, CKEB/MAA1

Clocks, Reset, Test, and Power Mgnt

HCLKIN PCLKIN RST# TEST# SUSCLK SUSSTAT1#
mtx_blk

MTXC Simplified Block Diagram

PRELIMINARY

82439TX
CONTENTS

(MTXC)

PAGE 1.0. ARCHITECTURE OVERVIEW ......6 2.0. SIGNAL DESCRIPTION ..........8 2.1. MTXC Signals .....8 2.1.1. Host Interface........8 2.1.2. DRAM Interface ..10 2.1.3. Secondary Cache Interface ........12 2.1.4. PCI Interface .......13 2.1.5. Test and Clock ....14 2.1.6. Power Management ...........14 2.1.7. Power and Ground Pins.....14 2.2. MTXC Strapping Options ..........15 2.3. Power Planes....15 2.4. Power Sequencing Requirements .....16 2.5. Signal States During and After a Hard Reset ............17 3.0. REGISTER DESCRIPTION .........18 3.1. I/O Mapped Registers ......18 3.1.1. PM2_CNTRLPM2 Register Block ..........19 3.1.2. CONFADDConfiguration Address Register ....19 3.1.3. CONFDATAConfiguration Data Register........20 PCI Configuration Space Mapped Registers ...........20 3.1.4. VIDVendor Identification Register ..........23 3.1.5. DIDDevice Identification Register ..........23 3.1.6. PCICMDPCI Command Register...........23 3.1.7. PCISTSPCI Status Register ...24 3.1.8. RIDRevision Identification Register........25 3.1.9. CLASSCClass Code Register..........25 3.1.10. MLTMaster Latency Timer Register.....25 3.1.11. HEDTHeader Type Register ..........26 3.1.12. BISTBIST Register.......26 3.1.13. ACONArbitration Control Register .......26 3.1.14. PCONPCI Control Register...27 3.1.15. CCCache Control Register....27 3.1.16. CECExtended Cache Control Register.........29 3.1.17. SDRAMCSDRAM Control Register .....29 3.1.18. DRAMECDRAM Extended Control Register .........31 3.1.19. DRAMCDRAM Control Register ..........32 3.1.20. DRAMTDRAM Timing Register............33

PRELIMINARY

3

4

82439TX (MTXC)
3.1.21. PAMProgrammable Attribute Map Registers (PAM[6:0])......34 3.1.22. DRBDRAM Row Boundary Registers...........38 3.1.23. DRTHDRAM Row Type Register High .........40 3.1.24. DRTL--DRAM Row Type Register Low...........41 3.1.25. MTTMulti-Transaction Timer Register (Reserved Test Mode Register).......41 3.1.26. ESMRAMCExtended System Management RAM Control Register ....42 3.1.27. SMRAMC System Management RAM Control Register.......43 3.1.28. MCTLMiscellaneous Control Register...........45 4.0. FUNCTIONAL DESCRIPTION ....46 4.1. Host Interface....46 4.2. Secondary Cache Interface ......46 4.2.1. Clock Latencies...49 4.2.2. Snoop Cycles......49 4.2.3. DRAM Cache Second Level Cache Mode .........50 4.3. DRAM Interface .........50 4.3.1. DRAM Organization ...........51 4.3.2. Configuration Requirements .......53 4.3.3. DRAM Address Translation ........57 4.3.4. DRAM Paging .....57 4.3.5. DRAM Types.......57 4.3.5.1. FPM Mode....57 4.3.5.2. EDO Mode ...57 4.3.5.3. SDRAM Mode .............57 4.3.6. Auto Detection.....59 4.3.7. DRAM Performance...........59 4.3.8. DRAM Refresh....62 4.4. PCI CLK Control (CLKRUN#)............62 4.4.1. Clocking States ...62 4.4.2. Operation ............62 4.5. SMRAM Memory Space ...........62 4.5.1. Compatible SMRAM (C_SMRAM).............62 4.5.2. Extended SMRAM (E_SMRAM) ..........62 4.5.3. SMRAM Programming Considerations......64 4.6. Low Power States ......64 4.6.1. Chip Standby.......65 4.6.2. Suspend/Resume ..............65 4.6.2.1. Power Transition Changes...66 4.7. PCI Interface .....67 4.8. System Arbitration......68 4.8.1. Priority Scheme and Bus Grant ..68 4.8.2. CPU Policies .......70

PRELIMINARY

82439TX

(MTXC)

5.0. CLOCKS AND RESET ..........70 5.1. Clock Generation and distribution......70 5.2. RESET Sequencing ...70 6.0. PINOUT INFORMATION .............71 7.0. MTXC PACKAGE INFORMATION.......76 8.0. TESTABILITY.......79 8.1. NAND Tree Mode ......79 8.2. NAND Chain Mode ....79

PRELIMINARY

5