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Details, datasheet, quote on part number:GT28F008B3T150
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Datasheet text preview:
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PRELIMINARY
SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE 8-MBIT (1024K x 8), 16-MBIT (2056K x 8) FLASH MEMORY FAMILY
28F008B3, 28F016B3
Flexible SmartVoltage Technology 2.7V3.6V Program/Erase 2.7V3.6V Read Operation 12V VPP Fast Production Programming 2.7V or 1.8V I/O Option Reduces Overall System Power Optimized Block Sizes Eight 8-Kbyte Blocks for Data, Top or Bottom Locations Up to Thirty-One 64-Kbyte Blocks for Code High Performance 2.7V3.6V: 120 ns Max Access Time Block Locking VCC-Level Control through WP# Low Power Consumption 20 mA Maximum Read Current Absolute Hardware-Protection VPP = GND Option VCC Lockout Voltage Extended Temperature Operation 40°C to +85°C Supports Code plus Data Storage Optimized for FDI, Flash Data Integrator Software Fast Program Suspend Capability Fast Erase Suspend Capability
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Extended Cycling Capability 10,000 Block Erase Cycles Automated Byte Program and Block Erase Command User Interface Status Registers SRAM-Compatible Write Interface Automatic Power Savings Feature Reset/Deep Power-Down 1 µA ICCTypical Spurious Write Lockout Standard Surface Mount Packaging 48-Ball µBGA* Package 40-Lead TSOP Package Footprint Upgradeable Upgradeable from 2-, 4- and 8-Mbit Boot Block ETOXTM V (0.4 µ) Flash Technology x8-Only Input/Output Architecture For Space-Constrained 8-bit Applications
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The new Smart 3 Advanced Boot Block, manufactured on Intel's latest 0.4µ technology, represents a featurerich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective, monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Byte-Wide products will be available in 40-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing Intel's WWW page: http://www.intel.com/design/flcomp
May 1997
Order Number: 290605-001
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. The 28F008B3 and 28F016B3 may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. *Third-party brands and names are the property of their respective owners. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 7641 Mt. Prospect, IL 60056-7641 or call 1-800-879-4683 or visit Intel's website at http:\\www.intel.com
COPYRIGHT © INTEL CORPORATION 1996, 1997 *Third-party brands and names are the property of their respective owners. CG-041493
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SMART 3 ADVANCED BOOT BLOCKBYTE-WIDE
CONTENTS
PAGE 1.0 INTRODUCTION ............ 5 1.1 Smart 3 Advanced Boot Block Flash Memory Enhancements ...... 5 1.2 Product Overview........6 2.0 PRODUCT DESCRIPTION......6 2.1 Package Pinouts ......... 7 2.2 Block Organization .... 11 2.2.1 Parameter Blocks ........ 11 2.2.2 Main Blocks ........ 11 3.0 PRINCIPLES OF OPERATION ............ 14 3.1 Bus Operation ........... 14 3.1.1 Read....15 3.1.2 Output Disable....15 3.1.3 Standby ..... 15 3.1.4 Deep Power-Down/Reset ........... 15 3.1.5 Write....15 3.2 Modes of Operation...15 3.2.1 Read Array ......... 16 3.2.2 Read Intelligent Identifier ............ 17 3.2.3 Read Status Register .. 17 3.2.4 Program Mode....18 3.2.5 Erase Mode ........ 19 3.3 Block Locking............26 3.3.1 VPP = VIL for Complete Protection ....... 26 3.3.2 WP# = VIL for Block Locking.......26 3.3.3 WP# = VIH for Block Unlocking ... 26 3.4 VPP Program and Erase Voltages ..... 26 PAGE 3.5 Power Consumption ..26 3.5.1 Active Power ......26 3.5.2 Automatic Power Savings (APS) .........27 3.5.3 Standby Power ...27 3.5.4 Deep Power-Down Mode............27 3.6 Power-Up/Down Operation.......27 3.6.1 RP# Connected to System Reset ........27 3.6.2 VCC, VPP and RP# Transitions ....27 3.7 Power Supply Decoupling ..28 3.7.1 VPP Trace on Printed Circuit Boards ....28 4.0 ABSOLUTE MAXIMUM RATINGS .......29 5.0 OPERATING CONDITIONS (VCCQ = 2.7V3.6V)......29 5.1 DC Characteristics: VCCQ = 2.7V3.6V.......30 6.0 OPERATING CONDITIONS (VCCQ = 1.8V2.2V)......34 6.1 DC Characteristics: VCCQ = 1.8V2.2V.......34 7.0 AC CHARACTERISTICS.......39 7.1 Reset Operations ......43 APPENDIX A: Ordering Information ........45 APPENDIX B: Write State Machine Current/ Next States ........46 APPENDIX C: Access Time vs. Capacitive Load..........47 APPENDIX D: Architecture Block Diagram ......48 APPENDIX E: Additional Information ......49
PRELIMINARY
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