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Details, datasheet, quote on part number:GT28F032C3B110
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Datasheet text preview:
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PRODUCT PREVIEW
3 VOLT ADVANCED+ BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
28F008C3, 28F016C3, 28F032C3 28F800C3, 28F160C3, 28F320C3
Flexible SmartVoltage Technology 2.7 V3.6 V Read/Program/Erase 2.7 V or 1.65 V I/O Option Reduces Overall System Power 12 V for Fast Production Programming High Performance 2.7 V3.6 V: 90 ns Max Access Time 3.0 V3.6 V: 80 ns Max Access Time Optimized Architecture for Code Plus Data Storage Eight 8-Kbyte Blocks, Top or Bottom Locations Up to Sixty-Three 64-KB Blocks Fast Program Suspend Capability Fast Erase Suspend Capability Flexible Block Locking Lock/Unlock Any Block Full Protection on Power-Up WP# Pin for Hardware Block Protection VPP = GND Option VCC Lockout Voltage Low Power Consumption 9 mA Typical Read Power 10 µA Typical Standby Power with Automatic Power Savings Feature Extended Temperature Operation 40 °C to +85 °C
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Easy-12 V Faster Production Programming No Additional System Logic 128-bit Protection Register 64-bit Unique Device Identifier 64-bit User Programmable OTP Cells Extended Cycling Capability Minimum 100,000 Block Erase Cycles Flash Data Integrator Software Flash Memory Manager System Interrupt Manager Supports Parameter Storage, Streaming Data (e.g., voice) Automated Word/Byte Program and Block Erase Command User Interface Status Registers SRAM-Compatible Write Interface Cross-Compatible Command Support Intel Basic Command Set Common Flash Interface x 16 for High Performance 48-Ball µBGA* Package 48-Lead TSOP Package x 8 I/O for Space Savings 48-Ball µBGA* Package 40-Lead TSOP Package 0.25 µ ETOXTM VI Flash Technology
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The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel's latest 0.25 µ technology, represents a feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP, and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing Intel's WWW page: http://www.intel.com/design/flcomp.
May 1998
Order Number: 290645-001
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. The 28F008C3, 28F016C3, 28F032C3, 28F800C3, 28F160C3, 28F320C3 may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call 1-800-548-4725 or visit Intel's website at http:\\www.intel.com
COPYRIGHT © INTEL CORPORATION 1998 *Third-party brands and names are the property of their respective owners. CG-041493
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CONTENTS
PAGE 1.0 INTRODUCTION ............ 5 1.1 3 Volt Advanced+ Boot Block Flash Memory Enhancements ........... 5 1.2 Product Overview........6 2.0 PRODUCT DESCRIPTION......6 2.1 Package Pinouts ......... 6 2.2 Block Organization .... 10 2.2.1 Parameter Blocks ........ 10 2.2.2 Main Blocks ........ 10 3.0 PRINCIPLES OF OPERATION ............ 11 3.1 Bus Operation ........... 11 3.1.1 Read....11 3.1.2 Output Disable....11 3.1.3 Standby ..... 11 3.1.4 Reset.........12 3.1.5 Write....12 3.2 Modes of Operation...12 3.2.1 Read Array ......... 12 3.2.2 Read Configuration......13 3.2.3 Read Status Register .. 13 3.2.3.1 Clearing the Status Register ......... 13 3.2.4 Read Query ........ 13 3.2.5 Program Mode....14 3.2.5.1 Suspending and Resuming Program ...... 14 3.2.6 Erase Mode ........ 14 3.2.6.1 Suspending and Resuming Erase.15 3.3 Flexible Block Locking........19 3.3.1 Locking Operation ....... 19 3.3.2 Locked State ...... 19 3.3.3 Unlocked State ... 19 3.3.4 Lock-Down State ......... 19 3.3.5 Reading a Block's Lock Status ... 20 3.3.6 Locking Operations during Erase Suspend ............ 20 3.3.7 Status Register Error Checking .. 20
3 VOLT ADVANCED+ BOOT BLOCK
PAGE 3.4 128-Bit Protection Register.......21 3.4.1 Reading the Protection Register ..........21 3.4.2 Programming the Protection Register ..21 3.4.3 Locking the Protection Register ..22 3.5 VPP Program and Erase Voltages......22 3.5.1 Easy-12 V Operation for Fast Manufacturing Programming......22 3.5.2 VPP VPPLK for Complete Protection ...22 3.5.3 VPP Usage ..........22 3.6 Power Consumption ..23 3.6.1 Active Power (Program/Erase/Read) ...23 3.6.2 Automatic Power Savings (APS) .........23 3.6.3 Standby Power ...23 3.6.4 Deep Power-Down Mode............24 3.7 Power-Up/Down Operation.......24 3.7.1 RP# Connected to System Reset ........24 3.7.2 VCC, VPP and RP# Transitions ....24 3.8 Power Supply Decoupling ..24 4.0 ABSOLUTE MAXIMUM RATINGS .......25 4.2 Operating Conditions..........25 4.3 Capacitance .....26 4.4 DC Characteristics ....26 4.5 AC Characteristics--Read Operations-- Extended Temperature......30 4.6 AC Characteristics--Write Operations-- Extended Temperature......32 4.7 Erase and Program Timings .....33 4.8 Reset Operations ......35 5.0 ORDERING INFORMATION..36 6.0 ADDITIONAL INFORMATION .....37 APPENDIX A: WSM Current/Next States ..........38 APPENDIX B: Program/Erase Flowcharts ........40 APPENDIX C: Common Flash Interface Query Structure ...... 46 3
PRODUCT PREVIEW
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