|
Details, datasheet, quote on part number:ZT5090
| |
| Part: | ZT5090 |
| Category: | Others => Boards->Desktop |
| Description: | Networking & Communications - Compute Boards & Platforms - CompactPCI* Platforms - Intel Netstructure ZT 5090 |
| Company: | Intel Corporation |
| Datasheet: | Download ZT5090 datasheet File size : 62 kB |
| Request For quote: | Find where to buy ZT5090
|
| |
Datasheet text preview:
Product Brief
Intel NetStructure ZT 5090 4U General Purpose Packet Switched Platform
® TM
Introduction
The Intel® NetStructureTM ZT 5090 4U General Purpose Packet Switched Platform is one of several telecom building blocks from Intel, providing OEM equipment designers with standards-based development solutions built on the PICMG* 2.16 specification. This highdensity CompactPCI* platform features seven node slots and one integrated layer 2/3 Ethernet switch slot, transversely mounted in a 4U enclosure, making it ideal for carrier-grade telecom and Internet applications. The ZT 5090 platform is modular, scalable, and ready for immediate development. It is designed to interoperate with third-party components meeting the PICMG 2.16 specification. Hot-swappable system components provide built-in redundancy to simplify replacement and minimize service time. A chassis management module enables customers to manage multiple SBCs and conduct chassis diagnostics remotely for enhanced system reliability. The ZT 5090 platform routes signals across the backplane without the use of cables, saving time in set-up, maintenance and repair, and reducing the thermal challenges of traditional cabling methods.
I I
Two PCI bus segments (three and four slots) H.110 computer telephony bus on each segment
I
Three N+1 redundant, load-sharing, hotswappable 250W AC or DC 47-pin connector modular power supplies
I
Designed for less than 5 minute MTTR (Mean Time to Replacement) for all components
Backplane Configuration
I
Eight-slot (seven node slots and one dedicated switched fabric slot) backplane designed to the PICMG 2.16 specification
I
Eight slots of rear-panel I/O accept IEEE* 1101.11-style, 80 mm-deep transition cards
Intel in Communications
I I
Integrated 10/100/1000 Ethernet support Configurable for 3.3V or 5V I/O operation
Chassis Management Module
The Intel® NetStructureTM ZT 7102 Chassis Management Module, designed to IPMI 1.0 standards, monitors complete system status, including sensors, fans, temperature and voltage. It communicates using an IPMB bus in a unique star topology to achieve comprehensive, lightsout management. An out-of-band 10/100 Ethernet port dedicates a network exclusively for management, thus avoiding impact to traffic on the primary network. (Please reference additional information at intel.com/design/ network/products/cbp/zt7102.htm)
Highlights
Platform
I I
Rugged 4U, 19-inch rack-mount enclosure Efficient side-to-rear cooling supports high-density computing environments
I
Support for 32-bit/33 MHz or 64-bit/66 MHz single-board computers and peripheral cards
Product Brief
Intel® NetStructureTM Z T 5090 4U General Purpose Packet Switched Platform
Ethernet Switch Board
The ZT 5090 platform supports a switched fabric board designed to the PICMG 2.16 standard such as the Intel NetStructure ZT
® TM
The ZT 5090 platform is designed with the following standards:
I I I
8101 Ethernet (Layer 2-4) Switch. This high-performance Managed Layer 2/3 switch features 24 10/100 Mbps Ethernet ports and two 1 Gigabit Ethernet ports for fast connection speeds. (Please reference additional information at intel.com/design/network/products/cbp/zt8101.htm)
CompactPCI Core Specification, PICMG 2.0 R2.1 CompactPCI Hot Swap, PICMG 2.1 R2.0 CompactPCI Computer Telephony, PICMG 2.5 R1.0 I CompactPCI System Management, PICMG 2.9 I CompactPCI Power Interface, PICMG 2.11 I CompactPCI Packet Switching Backplane Specification, PICMG 2.16 I IPMI 1.0 Specification
Power
I I
Specifications
PICMG 2.16 Specification
The PICMG 2.16 specification simplifies system development by using standards-based modules. All slots are served by redundant fabric connections, allowing for system failover in the event of a fabric failure. Backplane interconnect speeds are userdefinable, scalable from 10 Mbps to 2000 Mbps per node slot, allowing customers to start with a lower cost, lower speed set of components and upgrade as needed. Ideal applications include Web servers, e-mail servers, cache servers, VPN switchers, media gateways, 2.5G and 3G wireless, server clusters, IP DSLAM and voice/video/data servers.
Input: 110 or 220 VAC (50 to 60 Hz) Output*: 80A @ +3.3VDC 80A @ +5VDC 11A @ +12VDC 1A @ -12VDC I Input: 36 to 60 VDC I Output*: 80A @ +3.3VDC 80A @ +5VDC 11A @ +12VDC 1A @ -12VDC * Assumes that two of three power supplies are operating (N+1) Total combined output from 3.3V and 5V not to exceed 80A
Environmental
I I
Temperature (non-operating): -40° C to +70° C Voltage: +/-5% with 50mV max ripple I Temperature: +5° C to +40° C I Radiated and conducted emissions shall not cause the system to fail any tests I Humidity: 95% @ 40° C non-condensing
Physical
I I
Height: 7.0" (178 mm) Width: 17.2" (436 mm) without rack-mount flanges. Rack-mount flanges allow mounting in 19-inch racks. I Depth: 12.25" (311 mm) I Weight: 30.5 lb. in standard configuration
Please reference the most up-to-date Order Configurations and Regulatory Compliance Specifications along with additional product information at developer.intel.com/design/network/products/cbp/zt5090.htm
Intel Access
Developer's Site: Networking and Communications Building Blocks: Other Intel Support: developer.intel.com developer.intel.com/design/network Intel Literature Center developer.intel.com/design/litcentr/ (800) 548-4725 7 a.m. to 7 p.m. CST (U.S. and Canada)
International locations please contact your local sales office.
General Information Hotline:
(800) 628-8686 or (916) 356-3104 5 a.m. to 5 p.m. PST
For more information, visit the Intel Web site at: developer. intel.com
UNITED STATES AND CANADA Intel Corporation Robert Noyce Bldg. 2200 Mission College Blvd. P.O. Box 58119 Santa Clara, CA 95052-8119 USA EUROPE Intel Corporation (UK) Ltd. Pipers Way Swindon Wiltshire SN3 1RJ UK ASIA-PACIFIC Intel Semiconductor Ltd. 32/F Two Pacific Place 88 Queensway, Central Hong Kong, SAR JAPAN Intel Kabushiki Kaisha P.O. Box 115 Tsukuba-gakuen 5-6 Tokodai, Tsukuba-shi Ibaraki-ken 305 Japan SOUTH AMERICA Intel Semicondutores do Brazil Rue Florida, 1703-2 and CJ22 CEP 04565-001 Sao Paulo-SP Brazil
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. * Other names and brands may be claimed as the property of others. Copyright © 2003, Intel Corporation. All rights reserved. Intel, the Intel logo and NetStructure are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Printed in USA. 0203/OC/DC/PP/2.5K Please Recycle 252255-001
|
|
