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Part: IRFS11N50ATRL

Category:
 Discrete

Description: 500V Single N-channel HexFET Power MOSFET in a D2-Pak Package

Company: International Rectifier Corp.

Datasheet: Download IRFS11N50ATRL datasheet     File size : 178 kB

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Datasheet text preview:
PD- 93797
SMPS MOSFET
IRFS11N50A
HEXFET® Power MOSFET
Applications Switch Mode Power Supply ( SMPS ) l Uninterruptable Power Supply l High speed power switching
l
VD S S
500V
Rds(on) max
0.52
ID
11A
Benefits l Low Gate Charge Qg results in Simple Drive Requirement l Improved Gate, Avalanche and dynamic dv/dt Ruggedness l Fully Characterized Capacitance and Avalanche Voltage and Current l Effective Coss Specified ( See AN 1001)
D 2 Pak
Absolute Maximum Ratings
Parameter
ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VGS dv/dt TJ TSTG Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Power Dissipation Linear Derating Factor Gate-to-Source Voltage Peak Diode Recovery dv/dt Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds
Max.
11 7.0 44 170 1.3 ± 30 6.9 -55 to + 150 300 (1.6mm from case )
Units
A W W/°C V V/ns °C
Applicable Off Line SMPS Topologies:
l l l
Two Transistor Forward Half & Full Bridge Power Factor Correction Boost
through are on page 8
Notes
www.irf.com
1
9/13/99
IRFS11N5OA
Static @ TJ = 25°C (unless otherwise specified)
V(BR)DSS
V(BR)DSS/TJ
RDS(on) VGS(th) IDSS IGSS
Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage
Min. 500 ­­­ ­­­ 2.0 ­­­ ­­­ ­­­ ­­­
Typ. ­­­ 0.060 ­­­ ­­­ ­­­ ­­­ ­­­ ­­­
Max. Units ­­­ V ­­­ V / ° C 0.52 4.0 V 25 µA 250 100 nA -100
Conditions VGS = 0V, ID = 250µA Reference to 25°C, ID = 1mA VGS = 10V, ID = 6.6A VDS = VGS, ID = 250µA VDS = 500V, VGS = 0V VDS = 400V, VGS = 0V, TJ = 125°C VGS = 30V VGS = -30V
Dynamic @ TJ = 25°C (unless otherwise specified)
gfs Qg Qg s Qg d t d(on) tr t d(off) tf Ciss C oss Crss C oss C oss Coss eff. Parameter Forward Transconductance Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Output Capacitance Output Capacitance Effective Output Capacitance Min. 6.1 ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ Typ. ­­­ ­­­ ­­­ ­­­ 14 35 32 28 1423 208 8.1 2000 55 97 Max. Units ­­­ S 52 13 nC 18 ­­­ ­­­ ns ­­­ ­­­ ­­­ ­­­ ­­­ pF ­­­ ­­­ ­­­ Conditions VDS = 50V, ID = 6.6A ID = 11A VDS = 400V VGS = 10V, See Fig. 6 and 13 VDD = 250V ID = 11A RG = 9.1 RD = 22,See Fig. 10 VGS = 0V VDS = 25V = 1.0MHz, See Fig. 5 VGS = 0V, VDS = 1.0V, = 1.0MHz VGS = 0V, VDS = 400V, = 1.0MHz VGS = 0V, VDS = 0V to 400V
Avalanche Characteristics
Parameter
EAS IAR E AR Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy
Typ.
­­­ ­­­ ­­­
Max.
275 11 17
Units
mJ A mJ
Thermal Resistance
Parameter
RJC RCS RJA Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge Forward Turn-On Time
Typ.
­­­ 0.50 ­­­
Max.
0.75 ­­­ 62
Units
°C/W
Diode Characteristics
Min. Typ. Max. Units IS
ISM
VSD t rr Qr r ton
Conditions D MOSFET symbol 11 ­­­ ­­­ showing the A G integral reverse ­­­ ­­­ 44 S p-n junction diode. ­­­ ­­­ 1 . 5 V TJ = 25°C, IS = 11A, VGS = 0V ­­­ 510 770 ns TJ = 25°C, IF = 11A ­­­ 3 . 4 5 . 1 µC di/dt = 100A/µs Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
2
www.irf.com
IRFS11N50A
100
VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V B O T T O M 4.5V TOP
100
I D , Drain-to-Source Current (A)
10
I D , Drain-to-Source Current (A)
4.5V 20µs PULSE WIDTH
VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V B O T T O M 4.5V TOP
10
1
0.1 0.1
TJ = 25 °C
1 10 100
4.5V
1 1 10
20µs PULSE WIDTH TJ = 150 °C
100
VDS , Drain-to-Source Voltage (V)
VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100
3.0
I D = 11A
RDS(on) , Drain-to-Source On Resistance (Normalized)
I D , Drain-to-Source Current (A)
2.5
10
2.0
TJ = 150 ° C TJ = 25 ° C
1
1.5
1.0
0.5
0.1 4.0
V DS = 50V 20µs PULSE WIDTH 5.0 6.0 7.0 8.0 9.0
0.0 -60 -40 -20
VGS = 10V
0 20 40 60 80 100 120 140 160
VGS , Gate-to-Source Voltage (V)
TJ , Junction Temperature ( °C)
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance Vs. Temperature
www.irf.com
3


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