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Part: IRFS17N20DTRL

Category:
 Discrete

Description: 200V Single N-channel HexFET Power MOSFET in a D2-Pak Package

Company: International Rectifier Corp.

Datasheet: Download IRFS17N20DTRL datasheet     File size : 178 kB

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Datasheet text preview:
PD- 93902A
SMPS MOSFET
IRFB17N20D IRFS17N20D IRFSL17N20D
HEXFET® Power MOSFET
l
Applications High frequency DC-DC converters
VD S S
200V
RDS(on) max
0.17
ID
16A
Benefits Low Gate-to-Drain Charge to Reduce Switching Losses l Fully Characterized Capacitance Including Effective COSS to Simplify Design, (See App. Note AN1001) l Fully Characterized Avalanche Voltage and Current
l
TO-220AB IRFB17N20D
D2Pak IRFS17N20D
TO-262 IRFSL17N20D
Absolute Maximum Ratings
Parameter
ID @ TC = 25°C ID @ TC = 100°C IDM PD @TA = 25°C PD @TC = 25°C VGS dv/dt TJ TSTG Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Gate-to-Source Voltage Peak Diode Recovery dv/dt Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Mounting torqe, 6-32 or M3 screw
Max.
16 12 64 3.8 140 0.90 ± 30 2.7 -55 to + 175 300 (1.6mm from case ) 10 lbf·in (1.1N·m)
Units
A W W/°C V V/ns °C
Typical SMPS Topologies
l
Telecom 48V input Forward Converter
Notes
through
are on page 11
www.irf.com
1
4/26/00
IRFB/IRFS/IRFSL17N20D
Static @ TJ = 25°C (unless otherwise specified)
Parameter Drain-to-Source Breakdown Voltage V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient RDS(on) Static Drain-to-Source On-Resistance V GS(th) Gate Threshold Voltage V(BR)DSS IDSS IGSS Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Min. 200 ­­­ ­­­ 3.0 ­­­ ­­­ ­­­ ­­­ Typ. ­­­ 0.25 ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ Max. Units ­­­ V ­­­ V/°C 0.17 5.5 V 25 µA 250 100 nA -100 Conditions VGS = 0V, ID = 250µA Reference to 25°C, ID = 1mA VGS = 10V, ID = 9.8A VDS = VGS, ID = 250µA VDS = 200V, VGS = 0V VDS = 160V, VGS = 0V, TJ = 150°C VGS = 30V VGS = -30V
Dynamic @ TJ = 25°C (unless otherwise specified)
gfs Qg Qg s Qg d td(on) tr td(off) tf Ciss Coss Crss Coss Coss Coss eff. Parameter Forward Transconductance Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Output Capacitance Output Capacitance Effective Output Capacitance Min. 5.3 ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ ­­­ Typ. ­­­ 33 8.4 16 11 19 18 6.6 1100 190 44 1340 76 130 Max. Units ­­­ S 50 13 nC 24 ­­­ ­­­ ns ­­­ ­­­ ­­­ ­­­ ­­­ pF ­­­ ­­­ ­­­ Conditions VDS = 50V, ID = 9.8A ID = 9.8A VDS = 160V VGS = 10V, VDD = 100V ID = 9.8A RG = 5.1 VGS = 10V VGS = 0V VDS = 25V = 1.0MHz VGS = 0V, VDS = 1.0V, = 1.0MHz VGS = 0V, VDS = 160V, = 1.0MHz VGS = 0V, VDS = 0V to 160V
Avalanche Characteristics
Parameter
EAS I AR E AR Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy
Typ.
­­­ ­­­ ­­­
Max.
240 9.8 14
Units
mJ A mJ
Thermal Resistance
Parameter
RJC RCS RJA RJA Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient Junction-to-Ambient Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge Forward Turn-On Time
Typ.
­­­ 0.50 ­­­ ­­­
Max.
1.1 ­­­ 62 40
Units
°C/W
Diode Characteristics
Min. Typ. Max. Units IS
ISM
VSD trr Qr r ton
Conditions D MOSFET symbol 16 ­­­ ­­­ showing the A G integral reverse ­­­ ­­­ 64 S p-n junction diode. ­­­ ­­­ 1 . 3 V TJ = 25°C, IS = 9.8A, VGS = 0V ­­­ 160 240 ns TJ = 25°C, IF = 9.8A ­­­ 900 1350 nC di/dt = 100A/µs Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
2
www.irf.com
IRFB/IRFS/IRFSL17N20D
100
VGS 15V 12V 10V 8.0V 7.0V 6.0V 5.5V B O T T O M 5.0V TOP
100
I D , Drain-to-Source Current (A)
10
1
I D , Drain-to-Source Current (A)
VGS 15V 12V 10V 8.0V 7.0V 6.0V 5.5V B O T T O M 5.0V TOP
10
0.1
5.0V
5.0V
20µs PULSE WIDTH TJ = 175 ° C
1 10 100
0.01 0.1
20µs PULSE WIDTH TJ = 25 °C
1 10 100 1 0.1
VDS , Drain-to-Source Voltage (V)
VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100
3.5
I D = 16A
R DS(on) , Drain-to-Source On Resistance (Normalized)
I D , Drain-to-Source Current (A)
3.0
TJ = 175 ° C
10
2.5
2.0
TJ = 25 ° C
1
1.5
1.0
0.5
0.1 5.0
V DS = 50V 20µs PULSE WIDTH 6.0 7.0 8.0 9.0 10.0
0.0 -60 -40 -20
VGS = 10V
0 20 40 60 80 100 120 140 160 180
VGS , Gate-to-Source Voltage (V)
TJ , Junction Temperature ( °C)
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance Vs. Temperature
www.irf.com
3


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