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Details, datasheet, quote on part number:IRMDAC3
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Reference Design Data Sheet (October 1998)
IRMDAC3
IR2233 Reference Design Kit:
Product Description
The IRMDAC3 Reference Design is a kit of parts that work together as an evaluation platform for IR2233 three phase motor control IC and IRPT2062A power module. User connects three phase AC, drive signals, motor and hall sensors to complete the system. Power hook-up is via terminal blocks and control signals are made using a single in line header.
3-Phase 460VAC 3HP Motor Drive
Fig 1: IRMDAC3 Hardware
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How the IR2233 Control IC Adds Value Monolithic HVIC Integrates Control and Drive Yields Compact, Robust, Economical Designs Allows Elegant, Convenient System Partition Compatible with Short Circuit, Ground Fault and Over-Temperature Protection Schemes How the Power Module Adds Value Integration of All Inverter Power Components; Low Parasitic Coupling = High Performance Current Sensing Shunts in DC Feed and Return Onboard Temperature Sensor Easily Mounted Package Short Circuit Rated, Ultrafast IGBT Gen #4 Wide Operating Temperature Range Metal Base gives Excellent Thermal Transfer and Isolation to 2500V RMS
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Kit Content
1 Host PCB for Input Processing and Control 2 IRPT2062A Integrated Power Module 3 IR2233 Three Phase Motor Control IC Technical Contact and License Detail Schematic and PCB Layout Data Bill of Materials and Supplier Information
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System Features
· · · · · · · · 460V Three Phase AC Inlet, 50/60Hz Convenient Signal and Power Terminations Inrush Current Limit and Surge Suppression Integral +15V and +5V Bias Supplies DC Bus Voltage and Current Feedback 150% Overload Capability (1 Minute) Optimized Drive for Power Module Includes Brake Switch and Drive
System Block Diagram Fig 2
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USER KIT Signal Power Physical
Heatsink IGBT P o w e r Module 2
H o s t PCB 1,3
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Fig 3 IRMDAC3 Host PCB Bottom Layer
Control
Rotor Position Sense
Reference Design Data Sheet (October 1998)
IRMDAC3
IRMDAC3 Kit Overview and System Benefits · When furnished with user-provided logic level control signals, the IRMDAC3 forms a complete reference design for a 3HP AC motor. Unlike outdated circuits based upon transformer drive or opto-couplers, the system uses International Rectifier proprietary level-shifting gate drive circuits integrated within the IR2233J Control IC. Separation of gate drive / control and low-voltage circuits from the power module included in the kit results in a compact, effecient system. The user benfits from immediate hands-on experience and may customize at will using shematics and circuit ideas as the basis for production designs. Gate drive, control and protection circuits are designed to closely match the operating characteristics of the power semiconductors. This allows power losses to be minimized and power rating to be enhanced to a greater extent than is possible by designing with individual components.
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1. Host PCB Description The host PCB receives power input from a 3-phase line and control signals provided by the user. In conjuntion with the power module the result is a flexible power conversion system, primarily designed for interface with a 3HP Motor, however other 3-phase loads may also be applied. The host PCB supports soft-start function which reduces inrush current by using an NTC thermistor. Surge suppression is implemented using MOV's as a further degree of protection. Also on-board is a regulated low voltage power supply to provide bias for the IR2233J and other low voltage components. When connected to the power module, the unit is fully protected against overcurrent and ground faults through DC bus voltage and current feedback. Over-temperature is guarded against through feedback from a thermistor embedded within the power module. A 16-pin single in line header connector is provided to interface control signals and two terminal blocks connect 3-phase AC inlet and output to the load. The user provides 5V CMOS / TTL level signals which are then processed by the IR2233J Control IC and delivered to the power module. Signals Available to User In addition to availability of bias supplies derived for the host PCB, signals from the power module circuits and those derived and processed on the host PCB such as fault status are available to the user. Current feedback signal from the low side shunt is available on the IFB pin at 0.025V/A. If filtering of this signal is required to remove noise, a high impedance buffer stage should be inserted between signal and filter. DC bus voltage feedback is provided on the VFB pin. This reference is been scaled down by a factor of 100 and should be protected with a high impedance buffer stage. Fault Behavior. The system is designed to tolerate overload conditions for one minute. The user should prevent such conditions persisting beyond this period. In the event of shutdown initiated by ground-fault, overcurrent or over-temperature, the inverter outputs are terminated and an LED will light to signal this condition. For more information on fault response for IR2233J, please consult the data sheet.
Reference Design Data Sheet (October 1998)
IRMDAC3
Brake Function In order to use the integrated brake switch, an external power resistor should be connected between pins BR and P of terminal block J5. This resistor should be dimensioned for desired braking performance. Carefully choose the value of this component to ensure the brake IGBT integrated within the power module remains below its maximum current capability.
2. Power Module Description The power module integrates all rectifiers, ultra-fast short circuit rated IGBTs, fast recovery commutation diodes , brake IGBT and other processing components needed for a 3HP Motor Drive or other loads requiring a 3-phase variable frequency and/or PWM drive. Semiconductor dice are mounted on a thermally effecient substrate and housed within a convenient, potted module. When connected to the host PCB, the power components become configured as a 3-phase input bridge rectifier, and IGBT inverter with current sensing shunt resistors. An NTC thermistor is bonded to the substrate to furnish the host PCB with accurate temperature reading. A galvanically isolated metal backplate provides excellent thermal coupling to an external heatsink, which is necessary for fullload operation. Circuit Layout within the module is carefully designed to minimize inductance in the power path, reduce noise during inverter operation and to improve inverter efficiency. The IR2233 host board should be soldered to the power module pins to complete the assembly. For detailed electrical specifications, please refer to the power module datasheet.
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