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Details, datasheet, quote on part number:IRPLLNR2E
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Datasheet text preview:
Data Sheet PD No. 60179 Rev.J
IR21571( S)
FULLY INTEGRATED BALLAST CONTROL IC
Features
· Programmable preheat time & frequency · Programmable ignition ramp · Protection from failure-to-strike · Lamp filament sensing & protection · Protection from operation below resonance · Protection from low-line condition · Automatic restart for lamp exchange · Thermal overload protection · Programmable deadtime · Integrated 600V level-shifting gate driver · Inter nal 15.6V zener clamp diode on VCC · Micropower startup (150uA) · Latch immunity protection on all leads · ESD protection on all leads
0.2V CS threshold sync'd to falling edge on LO
Description
The IR21571 is a fully integrated, fully protected 600V ballast control IC designed to drive virtually all types of rapid start fluorescent lamp ballasts. Externally programmable features such as preheat time & frequency, ignition ramp characteristics, and running mode operating frequency provide a high degree of flexibility for the ballast design engineer. Comprehensive protection features such as protection from failure of a lamp to strike, filament failures, low dc bus conditions, thermal overload, or lamp failure during normal operation, as well as an automatic restart function, have been included in the design. The heart of this control IC is a variable frequency oscillator with externally programmable deadtime. Precise control of a 50% duty cycle is accomplished using a T-flip-flop. The IR21571 is available in both 16 pin DIP and 16 pin narrow body SOIC packages.
Packages
16 Lead SOIC (narrow body)
16 Lead PDIP
Typical Connection
+ Rectified AC Line
+ VBUS
R2 R1
VDC
RSupply 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9
HO
C1 CPH CRAMP RT CSTART RSTART CT ROC RDT RPH RRUN
CPH
VS
RGHS CBS DBOOT CVCC D1
CBLOCK
LRES
IR21571
RPH
VB
CSNUBBER
RT
VCC
RUN
COM
CT
LO
D2 R3 RGLS R5 R4
CRES
DT
CS
OC
SD
C2
RCS
VBUS return
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IR21571(S)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol
VB VS VHO VLO IOMAX IRT VCT VDC ICPH IRPH IRUN IDT VCS ICS IOC ISD ICC dV/dt PD RthJA TJ TS TL
Definition
High side floating supply voltage High side floating supply offset voltage High side floating output voltage Low side output voltage Maximum allowable output current (either output) due to external power transistor miller effect RT pin current CT pin voltage VDC pin voltage CPH pin current RPH pin current RUN pin current Deadtime pin current Current sense pin voltage Current sense pin current Over-current threshold pin current Shutdown pin current Supply current (note 1) Allowable offset voltage slew rate Package power dissipation @ TA +25°C PD = (TJMAX-TA)/RthJA Thermal resistance, junction to ambient Junction temperature Storage temperature Lead temperature (soldering, 10 seconds) (16 lead PDIP) (16 lead SOIC) (16 lead PDIP) (16 lead SOIC)
Min.
-0.3 VB - 25 VS - 0.3 -0.3 -500 -5 -0.3 -0.3 -5 -5 -5 -5 -0.3 -5 -5 -5 -20 -50 -- -- -- -- -55 -55 --
Max.
625 VB + 0.3 VB + 0.3 VCC + 0.3 500 5 5.5 VCC + 0.3 5 5 5 5 5.5 5 5 5 20 50 1.60 1.00 75 115 150 150 300
Units
V
mA
V
mA
V
mA
V/ns W ° C/W
°C
Note 1:
This IC contains a zener clamp structure between the chip VCC and COM which has a nominal breakdown voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source greater than the VCLAMP specified in the Electrical Characteristics section.
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IR21571(S)
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions.
Symbol
VBS VS VCC ICC VDC CT RDT ROC IRT IRPH IRUN ISD ICS TJ VBSMIN
Definition
High side floating supply voltage Steady state high side floating supply offset voltage Supply voltage Supply current VDC lead voltage CT lead capacitance Deadtime resistance Over-current (CS+) threshold programming resistance RT lead current (Note 3) RPH lead current (Note 3) RUN lead current (Note 3) Shutdown lead current Current sense lead current Junction temperature Minimum required VBS voltage for proper HO functionality
Min.
VCC - 0.7 -3.0 VCCUV+ Note 2 0 220 1.0
Max.
VCLAMP 600 VCLAMP 10 VCC --
Units
V
mA V pF
--
50 -50 450 450 1 1 125 5
--
-500 0 0 -1 -1 -40 --
k
uA
mA
o
C
V
Electrical Characteristics
VCC = VBS = V BIAS = 14V +/- 0.25V, RT = 40.0k, CT = 470 pF, RPH and RUN leads no connection, VCPH = 0.0V, RD T = 6.1k, ROC = 20.0k, V CS = 0.5V, V SD = 0.0V, CL = 1000pF, T A = 25o C unless otherwise specified.
Supply Characteristics
Symbol Definition
VCC supply undervoltage positive going threshold VUVHYS VCC supply undervoltage lockout hysteresis IQ C C U V UVLO mode quiescent current IQCCFLT Fault-mode quiescent current IQ C C ICC50K V CLAMP Note 2: Note 3: Quiescent VCC supply current VCC supply current, f= 50kHz VCC zener clamp voltage VCCUV+
Min.
10.5 1.5 50 75 2.9 4.0 14.5
Typ.
11.4 1.8 150 200 3.8 5.5 15.6
Max.
12.4
Units
V
Test Conditions
VCC rising from 0V
2.2 300 300 4.3 7.0 16.5
µA
mA V
VCC TSD RT no connection, CT connected to COM RT =36k, RDT = 5.6k, CT=220pF ICC = 10mA
Enough current should be supplied into the VCC lead to keep the internal 15.6V zener clamp diode on this lead regulating its voltage. Due to the fact that the RT input is a voltage-controlled current source, the total RT lead current is the sum of all the parallel current sources connected to that lead. For optimum oscillator current mirror performance, this total current should be kept between 50µA and 500µA. During the preheat mode, the total current flowing out of the RT lead consists of the RPH lead current plus the current due to the RT resistor. During the run mode, the total RT lead current consists of the RUN lead current plus the current due to the RT resistor.
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