Details, datasheet, quote on part number: 5962F9670401VEC
Part5962F9670401VEC
CategoryLogic => Flip-Flops
DescriptionRadiation Hardened Dual J-k Flip-flop
CompanyIntersil Corporation
DatasheetDownload 5962F9670401VEC datasheet
Cross ref.Similar parts: CD54AC112F3A, CD74AC112E, CD74HC112, SN54ALS174, SN54HC259, SN54LS112A, SN54LS174, SN74AHCT174, SN74ALS174, SN74HC109
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Features, Applications

16 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835, DESIGNATOR CDIP2-T16, LEAD FINISH C TOP VIEW
Features

Devices QML Qualified in Accordance with MIL-PRF-38535 Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96704 and Intersil'sIntersil QM Plan 1.25 Micron Radiation Hardened SOS CMOS Total Dose. >300K RAD (Si) Single Event Upset (SEU) Immunity: x 10 (Typ)

Dose Rate Survivability. >1012 RAD (Si)/s, 20ns Pulse Latch-Up Free Under Any Conditions Military Temperature Range. to +125oC Significant Power Reduction Compared to ALSTTL Logic DC Operating Voltage Range. to 5.5V Input Logic Levels - VIL 30% of VCC Max - VIH 70% of VCC Min Input Current 1µA at VOL, VOH Fast Propagation Delay. 21ns (Max), 14ns (Typ)

16 PIN CERAMIC FLATPACK MIL-STD-1835, DESIGNATOR CDFP4-F16, LEAD FINISH C TOP VIEW
Description

The Intersil is a Radiation Hardened Dual J-K Flip-Flop with Set and Reset. The output change states on the negative transition of the clock or CP2N). The ACS112MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of the radiation hardened, high-speed, CMOS/SOS Logic Family. The ACS112MS is supplied a 16 lead Ceramic Flatpack (K suffix) or a Ceramic Dual-In-Line Package (D suffix).

PART NUMBER ACS112K/Sample ACS112HMSR TEMPERATURE RANGE +125oC 25oC SCREENING LEVEL MIL-PRF-38535 Class V MIL-PRF-38535 Class V Sample Die PACKAGE 16 Lead SBDIP 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Die

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com 407-727-9207 | Copyright © Intersil Corporation 1999


 

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