Details, datasheet, quote on part number: 5962F9671501VCC
Part5962F9671501VCC
Category
DescriptionRadiation Hardened Quad Buffer, Three-state
CompanyIntersil Corporation
DatasheetDownload 5962F9671501VCC datasheet
Cross ref.Similar parts: CD54HCT125, CD54HCT126, CD74HCT125, CD74HCT126, SN54ABT125, SN54AHCT125, SN54BCT125A, SN54BCT126A, SN54LS125A, SN64BCT125A
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Features, Applications

14 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C TOP VIEW
Features

Devices QML Qualified in Accordance with MIL-PRF-38535 Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96715 and Intersil' QM Plan 1.25 Micron Radiation Hardened SOS CMOS Total Dose. >300K RAD (Si) Single Event Upset (SEU) Immunity: x 10 (Typ)

SEU LET Threshold. >100 MEV-cm2/mg Dose Rate Upset. >1011 RAD (Si)/s, 20ns Pulse Dose Rate Survivabilty. >1012 RAD (Si)/s, 20ns Pulse Latch-Up Free Under Any Conditions Military Temperature Range. to +125oC Significant Power Reduction Compared to ALSTTL Logic DC Operating Voltage Range. to 5.5V Input Logic Levels - VIL = 0.8V Max - VIH = VCC/2 Min Input Current 1A at VOL, VOH Fast Propagation Delay. 17ns (Max), 11ns (Typ)

14 PIN CERAMIC FLATPACK MIL-STD-1835 DESIGNATOR, CDFP3-F14 LEAD FINISH C TOP VIEW
Description

The Intersil is a Radiation Hardened Quad Buffer with Three-State outputs. Each output has it's own enable input, which when "HIGH" puts the output in a high impedance state. The ACTS125MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. The ACTS125MS is supplied a 14 lead Ceramic flatpack (K suffix) or a Ceramic Dual-In-Line Package (D suffix).

PART NUMBER ACTS125K/Sample ACTS125HMSR TEMPERATURE RANGE +125oC 25oC SCREENING LEVEL MIL-PRF-38535 Class V MIL-PRF-38535 Class V Sample Die PACKAGE 14 Lead SBDIP 14 Lead Ceramic Flatpack 14 Lead SBDIP 14 Lead Ceramic Flatpack Die

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com 407-727-9207 | Copyright Intersil Corporation 1999

NOTE: L = Low, H = High, X = Don't Care, Z = High Impedance

DIE DIMENSIONS: x 88 (mils) x 2.24 (mm) METALLIZATION: Type: AlSi Metal 1 Thickness: 1.125k Metal 2 Thickness: 1k GLASSIVATION: Type: SiO2 Thickness: 1k WORST CASE CURRENT DENSITY: 105 A/cm2 BOND PAD SIZE: x 4.3 (mils) x 110 (m)


 

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