Details, datasheet, quote on part number: 5962F9671501VCC
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| Specifications, Features, Applications |
14 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C TOP VIEW
Features
· Devices QML Qualified in Accordance with MIL-PRF-38535· Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96715 and Intersil' QM Plan· 1.25 Micron Radiation Hardened SOS CMOS· Total Dose. >300K RAD (Si)· Single Event Upset (SEU) Immunity: x 10 (Typ)
· SEU LET Threshold. >100 MEV-cm2/mg· Dose Rate Upset. >1011 RAD (Si)/s, 20ns Pulse· Dose Rate Survivabilty. >1012 RAD (Si)/s, 20ns Pulse· Latch-Up Free Under Any Conditions· Military Temperature Range. to +125oC· Significant Power Reduction Compared to ALSTTL Logic· DC Operating Voltage Range. to 5.5V· Input Logic Levels - VIL = 0.8V Max - VIH = VCC/2 Min· Input Current 1µA at VOL, VOH· Fast Propagation Delay. 17ns (Max), 11ns (Typ)
14 PIN CERAMIC FLATPACK MIL-STD-1835 DESIGNATOR, CDFP3-F14 LEAD FINISH C TOP VIEW
Description
The Intersil is a Radiation Hardened Quad Buffer with Three-State outputs. Each output has it's own enable input, which when "HIGH" puts the output in a high impedance state. The ACTS125MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. The ACTS125MS is supplied a 14 lead Ceramic flatpack (K suffix) or a Ceramic Dual-In-Line Package (D suffix).
PART NUMBER ACTS125K/Sample ACTS125HMSR TEMPERATURE RANGE +125oC 25oC SCREENING LEVEL MIL-PRF-38535 Class V MIL-PRF-38535 Class V Sample Die PACKAGE 14 Lead SBDIP 14 Lead Ceramic Flatpack 14 Lead SBDIP 14 Lead Ceramic Flatpack Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com 407-727-9207 | Copyright © Intersil Corporation 1999
NOTE: L = Low, H = High, X = Don't Care, Z = High Impedance
DIE DIMENSIONS: x 88 (mils) x 2.24 (mm) METALLIZATION: Type: AlSi Metal 1 Thickness: ± 1.125kÅ Metal 2 Thickness: ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: ± 1kÅ WORST CASE CURRENT DENSITY: 105 A/cm2 BOND PAD SIZE: x 4.3 (mils) x 110 (µm)
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