|Category||Logic => Parity Generators/Checkers|
|Description||Radiation Hardened 9-bit Odd/ Even Parity Generator Checker|
|Datasheet||Download 5962F9672001VCC datasheet
|Cross ref.||Similar parts: CD54ACT280F3A, CD74ACT280E, CD54ACT283, CD74ACT283, SN74ALS520, SN74ALS521, SN74ALS688, CD54HCT280, CD74HCT280, SN54180|
Radiation Hardened 9-Bit Odd/ Even Parity Generator Checker
14 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C TOP VIEW
Devices QML Qualified in Accordance with MIL-PRF-38535 Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96720 and Intersil' QM Plan 1.25 Micron Radiation Hardened SOS CMOS Total Dose. >300K RAD (Si) Single Event Upset (SEU) Immunity: x 10-10 Errors/Bit/Day (Typ) SEU LET Threshold. >100 MEV-cm2/mg Dose Rate Upset. >1011 RAD (Si)/s, 20ns Pulse Dose Rate Survivability. >1012 RAD (Si)/s, 20ns Pulse Latch-Up Free Under Any Conditions Military Temperature Range. to +125oC Significant Power Reduction Compared to ALSTTL Logic DC Operating Voltage Range. to 5.5V Input Logic Levels - VIL = 0.8V Max - VIH = VCC/2 Min Input Current 1µA at VOL, VOH Fast Propagation Delay. 24ns (Max), 16ns (Typ)14 PIN CERAMIC FLATPACK MIL-STD-1835 DESIGNATOR, CDFP3-F14 LEAD FINISH C TOP VIEW
The Intersil is a Radiation Hardened 9-bit odd/even parity generator checker device. Both odd and even parity outputs are available for generating or checking parity for words to 9 bits long. Even parity is indicated (EVEN output high) when an even number of data inputs are high. Odd parity is indicated (ODD output high) when an odd number of data inputs are high. Parity checking for larger words can be accomplished by tying EVEN output to any input of an additional ACTS280MS. The ACTS280MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of a radiation hardened, high-speed, CMOS/SOS Logic Family. The ACTS280MS is supplied a 14 lead Ceramic Flatpack (K suffix) or a Ceramic Dual-In-Line Package (D suffix).PACKAGE 14 Lead SBDIP 14 Lead Ceramic Flatpack 14 Lead SBDIP 14 Lead Ceramic Flatpack Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com 407-727-9207 | Copyright © Intersil Corporation 1999
DIE DIMENSIONS: 88 mils x 88 mils x 2.24mm METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125kÅ ±1.125kÅ Metal 2 Thickness: 9kÅ ±1kÅ GLASSIVATION: Type: SiO2 Thickness: 8kÅ ±1kÅ WORST CASE CURRENT DENSITY: 105 A/cm2 BOND PAD SIZE: > 4.3 mils x 4.3 mils x 110µm
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