Details, datasheet, quote on part number: 5962F9862201V9A
Part5962F9862201V9A
CategoryLogic => Gates
DescriptionRadiation Hardened Triple 3-input And Gate
CompanyIntersil Corporation
DatasheetDownload 5962F9862201V9A datasheet
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Features, Applications

The Radiation Hardened is a Triple 3-Input AND Gate. When all three inputs to one of the gates are at a HIGH level, the corresponding Y output will be HIGH. A LOW level on any input will cause the output for that gate to be LOW. All inputs are buffered and the outputs are designed for balanced propagation delay and transition times. The ACS11MS is fabricated on a CMOS Silicon on Sapphire (SOS) process, which provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. These devices offer significant power reduction and faster performance when compared to ALSTTL types. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. Detailed Electrical Specifications for the ACS11MS are contained in SMD 5962-98622. A "hot-link" is provided on our homepage with instructions for downloading. www.intersil.com/spacedefense/newsafclasst.asp

Features

QML Qualified Per MIL-PRF-38535 Requirements 1.25 Micron Radiation Hardened SOS CMOS Radiation Environment - Latch-Up Free Under any Conditions - Total Dose. x 105 RAD (Si) - SEU Immunity. x 10-10 Errors/Bit/Day - SEU LET Threshold. >100MeV/(mg/cm2) Input Logic Levels. VIL = (0.3)(VCC), VIH = (0.7)(VCC) Output Current. 8mA (Min) Quiescent Supply Current. 100A (Max) Propagation Delay. 12ns (Max)

Applications
High Speed Control Circuits Sensor Monitoring Low Power Designs

ORDERING NUMBER ACS11K/SAMPLE-03 5962F9862201V9A INTERNAL MKT. NUMBER ACS11K/SAMPLE-03 ACS11HMSR-03 TEMP. RANGE (oC) 125 25 PACKAGE 14 Ld SBDIP 14 Ld SBDIP 14 Ld Flatpack 14 Ld Flatpack Die DESIGNATOR CDIP2-T14 CDFP4-F14 N/A

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 321-724-7143 | Copyright Intersil Corporation 1999

DIE DIMENSIONS: Size: 2390m (94 mils x 94 mils) Thickness: 25m (20.6 mils 1 mil) Bond Pad: x 4.3 mils) METALLIZATION: AI Metal 1 Thickness: 0.7m 0.1m Metal 2 Thickness: 1.0m 0.1m SUBSTRATE POTENTIAL Unbiased Insulator PASSIVATION: Type: Phosphorous Silicon Glass (PSG) Thickness: 1.30m 0.15m SPECIAL INSTRUCTIONS: Bond VCC First ADDITIONAL INFORMATION: Worst Case Current Density: 105 A/cm2 Transistor Count: 97

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site www.intersil.com

NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: FAX:


 

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