Details, datasheet, quote on part number: 5962F9862501VXC
CategoryLogic => Schmitt Triggers
DescriptionRadiation Hardened Quad 2-input NAND Schmitt Trigger
CompanyIntersil Corporation
DatasheetDownload 5962F9862501VXC datasheet
Cross ref.Similar parts: SN5400, SN54ACT00, SN54AHCT00, SN54ALS00A, SN54F00, SN54LS00, SN54LS00-SP, SN54LS132, SN54LS37, SN54S00
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Features, Applications

Radiation Hardened Quad 2-Input NAND Schmitt Trigger

The Radiation Hardened is a Quad 3-Input NAND Gate with Schmitt Trigger inputs. When any input to one of the gates at a LOW level, the corresponding Y output will be HIGH. A HIGH level on both inputs will cause the output for that gate to be LOW. The Schmitt Trigger input stage provides 400mV (Min) of hysteresis and permits input signals with longer rise times. All inputs are buffered and the outputs are designed for balanced propagation delay and transition times. The ACS132MS is fabricated on a CMOS Silicon on Sapphire (SOS) process, which provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. These devices offer significant power reduction and faster performance when compared to ALSTTL types. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. Detailed Electrical Specifications for the ACS132MS are contained in SMD 5962-98625. A "hot-link" is provided on our homepage with instructions for downloading.


QML Qualified Per MIL-PRF-38535 Requirements 1.25 Micron Radiation Hardened SOS CMOS Radiation Environment - Latch-Up Free Under any Conditions - Total Dose. x 105 RAD (Si) - SEU Immunity. x 10-10 Errors/Bit/Day - SEU LET Threshold. >100MeV/(mg/cm2) Input Logic Levels. VIL = (0.3)(VCC), VIH = (0.7)(VCC) Hysteresis Voltage. 400mV (Min) Output Current. 8mA (Min) Quiescent Supply Current. 100A (Max) Propagation Delay. 12ns (Max)

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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 321-724-7143 | Copyright Intersil Corporation 1999

DIE DIMENSIONS: Size: 2390m (94 mils x 94 mils) Thickness: 25m (20.6 mils 1 mil) Bond Pad: x 4.3 mils) METALLIZATION: AL Metal 1 Thickness: 0.1m Metal 2 Thickness: 0.1m SUBSTRATE POTENTIAL: Unbiased Insulator PASSIVATION Type: Phosphorous Silicon Glass (PSG) Thickness: 0.15m SPECIAL INSTRUCTIONS: Bond VCC First ADDITIONAL INFORMATION: Worst Case Current Density: 105 A/cm2 Transistor Count: 92

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site

NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: FAX:


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