Details, datasheet, quote on part number: HA2-5002/883
PartHA2-5002/883
CategoryAnalog and Digital ICs => Amplifiers and Comparator Chips => Buffer Amplifiers => 6372596
TitleBUFFER AMPLIFIER, MBCY8
Description
CompanyIntersil Corporation
DatasheetDownload HA2-5002/883 datasheet
Cross ref.Similar parts: 5962-8962301GX, EL2003H/883B, ELH0002H/883B, HA2-5002-8, 5962-8963601GC
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Specifications 
Bandwidth110 MHz
Slew Rate1300 V/µs
Supply Voltage (VS)12 volts
Operating Temperature-55 to 125 C (-67 to 257 F)
RoHS CompliantRoHS
Package TypeGREEN, METAL CAN, 8 PIN
Number of Pins8
Number of Devices1

 

Features, Applications

110MHz, High Slew Rate, High Output Current Buffer

The is a monolithic, wideband, high slew rate, high output current, buffer amplifier. Utilizing the advantages of the Intersil D.I. technologies, the HA-5002 current buffer offers 1300V/s slew rate with 110MHz of bandwidth. The 200mA output current capability is enhanced a 3 output impedance. The monolithic HA-5002 will replace the hybrid LH0002 with corresponding performance increases. These characteristics range from the 3000k input impedance to the increased output voltage swing. Monolithic design technologies have allowed a more precise buffer to be developed with more than an order of magnitude smaller gain error. The HA-5002 will provide many present hybrid users with a higher degree of reliability and at the same time increase overall circuit performance. For the military grade product, refer to the HA-5002/883 datasheet.

Features

Voltage Gain. 0.995 High Input Impedance.3000k Low Output Impedance. 3 Very High Slew Rate. 1300V/s Very Wide Bandwidth. 110MHz High Output Current. 200mA Pulsed Output Current. 400mA Monolithic Construction Pb-Free Plus Anneal Available (RoHS Compliant)

Applications

Line Driver Data Acquistion 110MHz Buffer Radara Cable Driver High Power Current Booster High Power Current Source Sample and Holds Video Products

PART NUMBER HA3-5002-5 HA3-5002-5Z (Note) HA4P5002-5 HA4P5002-5Z (Note) HA9P5002-5 HA9P5002-5Z (Note) HA9P5002-9 HA9P5002-9Z (Note) PART MARKING 50029 50029Z TEMP. RANGE (C) to 85 PACKAGE 8 Pin Metal Can 8 Pin Metal Can 8 Ld PDIP 8 Ld PDIP* (Pb-free) 20 Ld PLCC 20 Ld PLCC (Pb-free) 8 Ld SOIC 8 Ld SOIC (Pb-free) 8 Ld SOIC 8 Ld SOIC (Pb-free) PKG. DWG. N20.35 M8.15

*Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2003-2006. All Rights Reserved. All other trademarks mentioned are the property of their respective owners.

Voltage Between V+ and V- Terminals. 44V Input Voltage. to V1Output Current (Continuous). 200mA Output Current (50ms On, 1s Off). 400mA

Thermal Resistance (Typical, Note 2) JA (C/W) JC (C/W) PDIP Package*. 92 N/A Metal Can Package. 155 67 PLCC Package. 74 N/A SOIC Package. 157 N/A Max Junction Temperature (Hermetic Packages, Note 1). 175C Max Junction Temperature (Plastic Packages, Note 1). 150C Max Storage Temperature Range. to 150C Max Lead Temperature (Soldering 10s). 300C (PLCC and SOIC - Lead Tips Only) *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTES: 1. Maximum power dissipation, including load conditions, must be designed to maintain the maximum junction temperature below 175C for the can packages, and below 150C for the plastic packages. JA is measured with the component mounted on an evaluation PC board in free air.

PARAMETER INPUT CHARACTERISTICS Offset Voltage Average Offset Voltage Drift Bias Current Input Resistance Input Noise Voltage TRANSFER CHARACTERISTICS Voltage Gain (VOUT = 10V)

-3dB Bandwidth AC Current Gain OUTPUT CHARACTERISTICS Output Voltage Swing

Output Current Output Resistance Harmonic Distortion TRANSIENT RESPONSE Full Power Bandwidth (Note 3) Rise Time Propagation Delay Overshoot Slew Rate Settling Time


 

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