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Details, datasheet, quote on part number:HCTS373T
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| Part: | HCTS373T |
| Category: | Logic => Bus Transceivers => Bipolar->F Family |
| Description: | Radiation Hardened Octal Transparent Latch, Three-state |
| Company: | Intersil Corporation |
| Datasheet: | Download HCTS373T datasheet File size : 125 kB |
| Request For quote: | Find where to buy HCTS373T
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Datasheet text preview:
TM
HCTS373T
D a t a Sheet J ul y 1999 F N46 28.1
Radiation Hardened Octal Transparent Latch, Three-State
Intersil's Satellite Applications FlowTM (SAF) devices are fully tested and guaranteed to 100kRAD total dose. These QML Class T devices are processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers, while maintaining a high level of reliability. The Intersil HCTS373T is a Radiation Hardened Octal Transparent Three-State Latch with an active-low output enable. The outputs are transparent to the inputs when the Latch Enable (LE) is HIGH. When the Latch Enable (LE) goes LOW, the data is latched. The Output Enable (OE) controls the three-state outputs. When the Output Enable (OE) is HIGH, the outputs are in the high impedance state. The latch operation is independent of the state of the Output Enable.
Features
· QM L Class T, Per MIL-PRF-38535 · Radiation Performance - Gamma Dose () 1 x 105 RAD(Si) - Latch-Up Free Under Any Conditions - SEP Effective LET No Upsets: >100 MEV-cm2/m g - Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/Bit-Day (Typ) · 3 Micron Radiation Hardened CMOS SOS · Fanout (Over Temperature Range) - Bus Driver Outputs - 15 LSTTL Loads · Significant Power Reduction Compared to LSTTL ICs · DC Operating Voltage Range: 4.5V to 5.5V · LSTTL Input Compatibility - VIL = 0.8V Max - VIH = VCC /2 Min · Input Current Levels Ii 5mA at VOL, VOH
Specifications
Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. Detailed Electrical Specifications for the HCTS373T are contained in SMD 5962-95747. A "hot-link" is provided from our website for downloading. www.intersil.com/spacedefense/newsafclasst.asp Intersil's Quality Management Plan (QM Plan), listing all Class T screening operations, is also available on our website. www.intersil.com/quality/manuals.asp
Pinouts
HCTS373T (SBDIP), CDIP2-T20 TOP VIEW
OE Q0 D0 D1 Q1 Q2 D2 1 2 3 4 5 6 7 8 9 20 VCC 19 Q7 18 D7 17 D6 16 Q6 15 Q5 14 D5 13 D4 12 Q4 11 LE
Ordering Information
ORDERING NUMBER 5962R9574701TRC 5962R9574701TX C PART NUMBER HCTS373DTR HCTS373KTR TEMP. RANGE (oC) -55 to 125 -55 to 125
OE Q0 D0 D1 Q1 Q2 D2 D3 Q3 G ND
D3 Q3
GND 10
HCTS373T (FLATPACK), CDFP4-F20 TOP VIEW
1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC Q7 D7 D6 Q6 Q5 D5 D4 Q4 LE
NOTE: Minimum order quantity for -T is 150 units through distribution, or 450 units direct.
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2002. All Rights Reserved Satellite Applications FlowTM (SAF) is a trademark of Intersil Corporation.
HCTS373T Functional Diagram
1 OF 8 (3 , 4, 7, 8, 13, 14, 17, 18) D COMMON CONTROLS LE (11) L AT CH OE D LE Q Q (2, 5, 6, 9, 12, 15 , 16, 19)
OE (1 )
TRUTH TABLE OE L L L L H H = High Level, X = Immaterial, LE H H L L X L = Low Level. Z = High Impedance. D H L I h X Q H L L H Z
I = Low voltage level prior to the high-to-low latch enable transition. h = High voltage level prior to the high-to-low latch enable transition.
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HCTS373T Die Characteristics
DIE DIMENSIONS: (2743µm x 2692µm x 533µm ±51µm) 108 x 106 x 21mils ±2mil METALLIZATION: Type: Al Si Thickness: 11kÅ ±1kÅ SUBSTRATE POTENTIAL: Unbiased (Silicon on Sapphire) BACKSIDE FINISH: Sapphire PASSIVATIO N: Type: Silox (SiO2) Thickness: 13kÅ ±2.6kÅ WORST CASE CURRENT DENSITY: < 2.0e5 A/cm 2 TRANSISTOR COUNT: 376 PROCESS: CMOS SOS
Metallization Mask Layout
H CTS373T
D0 (3) Q0 (2) OE (1 ) V CC (2 0) Q7 (19)
(18) D7
D1 (4) (17) D6 Q1 (5)
(16) Q6 Q2 (6) (15) Q5
D2 (7) (14) D5
(8) D3
(9) Q3
(10 ) G ND
(11) LE
(12) Q4
(13) D4
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS373 is TA14403A.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 3
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