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Details, datasheet, quote on part number:IS61SF12836-8.5TQI
 
 
Part:IS61SF12836-8.5TQI
Category:Memory => SRAM => Sync. SRAM
Description:128K X 36 Synchronous Flow-through Static RAM
Company:Integrated Silicon Solution
Datasheet:Download IS61SF12836-8.5TQI datasheet   File size : 115 kB
Request For quote:  Find where to buy IS61SF12836-8.5TQI
 



Datasheet text preview:
IS61SF12832 IS61SF12836
128K x 32, 128K x 36 SYNCHRONOUS FLOW-THROUGH STATIC RAM
FEATURES
· Fast access times: 7.5 ns, 8 ns, 8.5 ns, 10 ns, and 12 ns · Internal self-timed write cycle · Individual Byte Write Control and Global Write · Clock controlled, registered address, data inputs and control signals · PentiumTM or linear burst sequence control using MODE input · Three chip enables for simple depth expansion and address pipelining · Common data inputs and data outputs · JEDEC 100-Pin TQFP and 119-pin PBGA package · Single +3.3V +10%, ­5% power supply · Power-down snooze mode
ISSI
®
APRIL 2001
DESCRIPTION The ISSI IS61SF12832 and IS61SF12836 are high-speed
synchronous static RAM designed to provide a burstable, high-performance memory for high speed networking and communication applications. It is organized as 131,072 words by 32 bits or 36 bits, fabricated with ISSI's advanced CMOS technology. The device integrates a 2-bit burst counter, high-speed SRAM core, and high-drive capability outputs into a single monolithic circuit. All synchronous inputs pass through registers controlled by a positive-edge-triggered single clock input. Write cycles are internally self-timed and are initiated by the rising edge of the clock input. Write cycles can be from one to four bytes wide as controlled by the write control inputs. Separate byte enables allow individual bytes to be written. BW1 controls DQa, BW2 controls DQb, BW3 controls DQc, BW4 controls DQd, conditioned by BWE being LOW. A LOW on GW input would cause all bytes to be written. Bursts can be initiated with either ADSP (Address Status Processor) or ADSC (Address Status Cache Controller) input pins. Subsequent burst addresses can be generated internally and controlled by the ADV (burst address advance) input pin. The mode pin is used to select the burst sequence order, Linear burst is achieved when this pin is tied LOW. Interleave burst is achieved when this pin is tied HIGH or left floating.
FAST ACCESS TIME
Symbol tKQ tKC Parameter Clock Access Time Cycle Time Frequency 7.5 7.5 8.5 117 8 8 10 100 8.5 8.5 11 90 10 10 15 66 12 12 15 66 Units ns ns MHz
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2001, Integrated Silicon Solution, Inc.
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
1
IS61SF12832 IS61SF12836
BLOCK DIAGRAM
MODE Q0 A0'
ISSI
CLK A0
®
CLK
BINARY COUNTER
ADV ADSC ADSP CE CLR Q1 A1' A1
128K x 32, 128K x 36 MEMORY ARRAY
15 17
A16-A0
17
D
Q
ADDRESS REGISTER
CE CLK 32 or 36 32 or 36
GW BWE BW4
DQd BYTE WRITE REGISTERS
CLK
D
Q
BW3
D DQc Q BYTE WRITE REGISTERS CLK
BW2
DQb BYTE WRITE REGISTERS
CLK
D
Q
BW1
D DQa Q BYTE WRITE REGISTERS CLK
CE CE2 CE2 D Q
4
ENABLE REGISTER
CE CLK
INPUT REGISTERS
CLK OE
32 or 36 DQ[31:0] or DQ[35:0]
D
Q
ENABLE DELAY REGISTER
CLK
OE
2
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
IS61SF12832 IS61SF12836
PIN CONFIGURATION 119-pin PBGA (Top View)
1 A VCCQ B NC C NC D DQc1 E DQc2 F VCCQ G DQc5 H DQc7 J VCCQ K DQd1 L DQd4 M VCCQ N DQd6 P DQd8 R NC T NC U VCCQ NC NC NC NC NC VCCQ NC A10 A11 A14 NC ZZ A5 MODE VCC GND A13 NC NC GND A0 GND NC DQa1 DQd7 GND A1 GND DQa3 DQa2 DQd5 GND DQd3 DQd2 GND BW4 CLK NC BWE GND BW1 GND DQa7 DQa5 DQa4 DQa8 DQa6 VCCQ VCC NC VCC NC VCC VCCQ DQc8 GND DQc6 DQc4 GND BW3 DQc3 GND NC GND NC CE OE ADV GW GND GND GND BW2 GND NC DQb6 DQb5 DQb4 DQb2 DQb8 DQb7 VCCQ DQb3 DQb1 A7 A2 VCC A12 A15 NC CE2 A3 A6 A4 2 3 4 5 6 7
ISSI
100-Pin TQFP
A6 A7 CE CE2 BW4 BW3 BW2 BW1 CE2 VCC GND CLK GW BWE OE ADSC ADSP ADV A8 A9
®
ADSP ADSC
A8 A9
A16 CE2
VCCQ NC
NC DQc1 DQc2 VCCQ GND DQc3 DQc4 DQc5 DQc6 GND VCCQ DQc7 DQc8 NC VCC NC GND DQd1 DQd2 VCCQ GND DQd3 DQd4 DQd5 DQd6 GND VCCQ DQd7 DQd8 NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 1 79 2 78 3 77 4 76 5 75 6 74 7 73 8 72 9 71 10 70 11 69 12 68 13 67 14 66 15 65 16 64 17 63 18 62 19 61 20 60 21 59 22 58 23 57 24 56 25 55 26 54 27 53 28 52 29 51 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
NC DQb8 DQb7 VCCQ GND DQb6 DQb5 DQb4 DQb3 GND VCCQ DQb2 DQb1 GND NC VCC ZZ DQa8 DQa7 VCCQ GND DQa6 DQa5 DQa4 DQa3 GND VCCQ DQa2 DQa1 NC
128K x 32
PIN DESCRIPTIONS
A0, A1 Synchronous Address Inputs. These pins must tied to the two LSBs of the address bus. Synchronous Address Inputs Synchronous Clock Synchronous Processor Address Status Synchronous Controller Address Status Synchronous Burst Address Advance Individual Byte Write Enable Synchronous Byte Write Enable ZZ GW OE DQa-DQd MODE VCC GND VCCQ Synchronous Global Write Enable Output Enable Synchronous Data Input/Output Burst Sequence Mode Selection +3.3V Power Supply Ground Isolated Output Buffer Supply: +3.3V Snooze Enable CE, CE2, CE2 Synchronous Chip Enable
A2-A16 CLK ADSP ADSC ADV BW1-BW4 BWE
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
MODE A5 A4 A3 A2 A1 A0 NC NC GND VCC NC NC A10 A11 A12 A13 A14 A15 A16
3