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Part: FPBGA
Category:
Discrete
-> Diodes & Rectifiers
-> Array Diodes
Description: Flip Chip Ball Grid Array (fpbga) Package Family
Company: LSI Logic Corporation
Datasheet: Download FPBGA datasheet File size : 20 kB
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Datasheet text preview:
Flip Chip Ball Grid Array (FPBGA) Package Family
O v er v i e w LSI Logic's FPBGA packages offer flip chip die interconnect, and support leadcounts in excess of 1700 to target high performance, high pin count applications. LSI Logic is the first company to qualify a flip chip package using organic laminate substrates. Organic laminate substrates have better performance through copper interconnect and also have a lower dielectic constant. The FPBGA is lower in cost than conventional ceramic or the latest glass ceramic materials. Descr iption Flip chip packages differ from the traditional wire bonded packages in that the silicon chip does not have a ring of wire bond pads around its perimeter. Instead, the chip is covered across its top surface by a matrix of solder bumps. The chip is then "flipped" over and attached to the package substrate using solder reflow techniques. FPBGA provides the highest electrical performance available today through the elimination of the wire bond, separate core and I/O power and ground, reference planes, and the lowest available dielectric constant. In addition, this innovative package family has excellent thermal performance. The backside of the flipped die is attached directly to a heatspreader which covers the entire package. If necessary, a heatsink can be added. The organic laminate substrate has a Thermal Coefficient of Expansion (TCE) which is a much closer match to PCB material than glass ceramic substrates. This enables package body sizes of up to 45mm per side to be available to the designer. Conventional ceramic BGA packages are limited to 35mm per side. LSI Logic is offering a choice of two different organic substrate materials, namely BT laminate and MicrolamTM buildup. The Microlam buildup offers the benefit of finer bump and interconnect feature sizes.
Designed for maximum electrical p er f o r m a n c e Fea tur es
· Stripline I/O traces between power and · · · · · ·
ground planes Low inductance power and ground planes Core voltage and ground isolated and routed directly to solder balls under die Segmented power planes 100% differential or single-ended I/Os Ratio of signals:power:ground is 4:1:1 Low dielectric constant in organic laminate materials
Benefits
· Controlled impedance I/O traces · High integrity core power supplies with
thermal path to PCB
· Multiple low inductance I/O voltages · Suited for high-speed differential signals up to
2.4 Gbit/s
· Low power supply noise · Reduced cross-talk · Improved signal propagation delay
Designed for maximum thermal p er f o r m a n c e Fea tur es
· Copper heatspreader covers entire package · Direct thermal contact to flip chip die
Benefits
· Heatsink can be attached for increased performance
· Low thermal impedance path from chip to
ambient surroundings
Flip Chip Ball Grid Array (FPBGA) Package Family
FPBGA Package Family
Ball Count 788 960 1157 1413 1728 Body Size 31 35 40 40 45 #I/O 504 600 720 864 1024 Array 30 x 30 34 x 34 39 x 39 39 x 39 44 x 44 Vss 124 148 176 212 252 Vdd 124 148 180 216 256 VssC 18 32 41 61 98 VddC 18 32 40 60 98
For more information please call: Europe +32.11.300.351 408.433.7700 Dept. JDS www.lsilogic.com LSI Logic Corporation North American Headquarters Milpitas, CA Tel: 408.433.8000 LSI Logic Europe Ltd European Headquarters United Kingdom Tel: 44.1344.426544 Fax: 44.1344.481039 LSI Logic KK Headquarters Tokyo, Japan Tel: 81.3.5463.7821 Fax: 81.3.5463.7820
Complet e Packaging Portfolio The design and construction of LSI's multilayer laminate flip chip package provides superior electrical and thermal characteristics for a wide range of performance leading and high lead count applications in computing, networking and telecommunications.
ISO 9000 Certified
LSI Logic and LSI Logic logo design are registered trademark of LSI Logic Corporation. All other brand and product names may be trademarks of their respective companies. LSI Logic Corporation reserves the right to make changes to any products and services herein at any time without notice. LSI Logic does not assume any responsibility or liability arising out of the application or use of any product or service described herein, except as expressly agreed to in writing by LSI Logic; nor does the purchase, lease, or use of a product or service from LSI Logic convey a license under any patent rights, copyrights, trademark rights, or any other of the intellectual property rights of LSI Logic or of third parties. Copyright ©1999 by LSI Logic Corporation. All rights reserved.
Laminate Flip Chip Materials & Construction
LSI Logic's packaging portfolio offers a wide range of application focused packages ranging from low-cost packages for mainstream applications to Ball Grid Arrays optimized for the most demanding applications. These products are designed to meet a wide variety of thermal and electrical performance requirements with a focus on die size optimization, high I/O utilization, surface mount capability, and high reliability.
Order No. B20022 599.1K.CM.L Printed in USA
Others parts begin by fp
FP-1 FP-2 FP-3
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