|Category||RF & Microwaves => Switches|
|Description||SP4T Pin Diode Switch|
|Datasheet||Download MA4SW410 datasheet
Ultra Broad Bandwidth : 50 MHz to 26 GHz 0.9 Insertion Loss 34 dB Isolation at 20 GHz 50 ns Switching Speed Reliable, Fully Monolithic, Glass Encapsulated ConstructionDescription
The a SP4T Series-Shunt Broad Band Switch made with M/A-COM's Unique HMICTM (Heterolithic Microwave Integrated Circuit) Process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form Series and Shunt diodes or vias by imbedding them in a low loss, low dispersion glass. This hybrid combination of Silicon and Glass gives HMIC Switches exceptional low loss and remarkable high isolation through low millimeter-wave frequencies.Applications
These High Performance Switches are suitable for use in Multi-Band ECM, Radar, and Instrumentation Control Circuits where High Isolation to Insertion Loss Ratios are Required. With a Standard V/-5 V, TTL Controlled PIN Diode Driver, 50 nS Switching Speeds are Achieved.
Parameter Operating Temperature Storage Temperature RF C.W. Incident Power (+/-20 mA) Bias Current Forward Applied Voltage (Reverse) Value + 30 dBm mA 25 Volts1. Exceeding any of these values may result in permanent damage
SP4T PIN Diode Switch Electrical Specifications + 25 °C, 20 mA Bias Current (On-Wafer Measurements)
Insertion Loss Isolation Input Return Loss Output Return Loss Switching Speed1
1. Typical Switching Speed is measured from % of Detected RF Voltage driven by a TTL compatible driver. Driver Output Parallel RC Network uses a Capacitor between 560 pF and a Resistor between 220 Ohms to achieve 50 nS Rise and Fall Times.
2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information.
n North America: Tel. 366-2266 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. 300 020The following precautions should be observed for successful assembly of the die.
An 80/20 Gold-Tin eutectic solder preform is recommended with a work surface temperature 255 oC and a tool tip temperature of 265 oC. When hot gas is applied, the tool tip temperature should be 290 oC. The chip should not be exposed to temperatures greater than 320 oC for more than 20 seconds. No more than three seconds should be required for the attachment.
These chips should be handled in a clean environment. Do not attempt to clean die after installation.
The MA4SW Series PIN switches are ESD, Class 1 sensitive. The proper ESD handling procedures should be used.
Assembly should be preheated to 125-150 oC. A Controlled thickness of 2 mils is recommended for best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after placement. Cure epoxy per manufacturer's schedule.
Thermosonic wedge wire bonding using x 3 mil sq. ribbon or Ball Bonding using 1 mil diameter gold wire is recommended. A stage temperature 150 oC and a force to 22 grams should be used. Ultrasonic energy should be adjusted to the minimum required. RF bonds should be as short as possible.
These chips have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder preform or conductive Ag epoxy. Mounting surface must be clean and flat.
3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information.
n North America: Tel. 366-2266 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. 300 020
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