Details, datasheet, quote on part number: MA4SW410B-1
PartMA4SW410B-1
CategoryRF & Microwaves => Switches
Description SP4T Pin Diode Switch With Integrated Bias Network
CompanyM/A-COM, Inc.
DatasheetDownload MA4SW410B-1 datasheet
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Features, Applications

Features

Broad Bandwith Specified from to 18 GHz Integrated D.C. Bias Network Exceptional Isolation to Loss Ratio Rugged, Fully Monolithic, Glass Encapsulated Construction

Description

The MA4SW410B-1 device a SP4T Series-Shunt Broad Band Switch with an Integrated Bias Network utilizing M/A-COM's HMICTM (Heterolithic Microwave Integrated Circuit) Process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in a low loss, low dispersion glass. This hybrid combination of Silicon and Glass gives HMIC Switches exceptional low loss and remarkable high isolation through Ku Band frequencies.

Applications

These High Performance Switches are suitable for use in Multi-Band ECM, Radar, and Instrumentation Control Circuits where High Isolation to Insertion Loss Ratios are Required. With a Standard V/-5 V, TTL Controlled PIN Diode Driver, 80 nS Switching Speeds are Achieved.

Parameter Operating Temperature Storage Temperature RF C.W. Incident Power (+/-20 mA) DC Bias Current Value + 30 dBm +/-40 mA

1. Exceeding any of these values may result in permanent damage
SP4T PIN Diode Switch with Integrated Bias Network
Electrical Specifications + 25 C, 10 mA Bias Current (On-Wafer Measurements)

1. Typical Switching Speed measured from % of detected RF Voltage driven by TTL compatible drivers using RC Output Spiking Network, where R C pF.

Operation of the MA4SW Series of PIN Switches is achieved by the Simultaneous Application of Negative DC Current to the Low Loss Port and Positive DC current to the Remaining Isolated Switching Ports per the Driver Connections Table. The control currents should be supplied by constant current sources. For Insertion Loss, -10 mA bias results in approximately 2 V, and for Isolation 10 mA yields approximately V at the respective bias nodes. The Backside Area of the Die is the RF and DC Return Ground Plane.

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information.

n North America: Tel. 366-2266 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. 300 020

SP4T PIN Diode Switch with Integrated Bias Network Assembly Considerations
The following precautions should be observed for successful assembly of the die.

These chips have TiPtAu back metal. They can be die mounted with a gold-tin eutectic solder preform or electrically conductive epoxy. Mounting surface must be clean and flat.

These chips should be handled in a clean environment. Do not attempt to clean die after installation.

An 80/20 Gold-Tin eutectic solder preform is recommended with a work surface temperature 255 C and a tool tip temperature of 265 C. When hot gas is applied, the tool tip temperature should be 290 C. The chip should not be exposed to temperatures greater than 320 C for more than 20 seconds. No more than three seconds should be required for the attachment.

The MA4SW410B-1 Series PIN Diode Switch is ESD, Class 1 sensitive. The proper ESD handling procedures should be used.

Thermosonic wedge wire bonding using x 3 mil sq. ribbon or Ball Bonding using 1 mil diameter gold wire is recommended. A stage temperature 150 C and a force to 22 grams should be used. Ultrasonic energy should be adjusted to the minimum required. RF bonds should be as short as possible.

Assembly should be preheated to 125-150 C. A Controlled thickness of 2 mils is recommended for best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after placement. Cure epoxy per manufacturer's schedule.

3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information.

n North America: Tel. 366-2266 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. 300 020


 

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