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Part: CX29503
Category:
Communication
-> Network
-> SONET/SDH/ATM/DS3/PHYs/E3 (T3/E3)
-> Framers/Mappers/PHYs
Description: Broadband Access Multiplexer
Company: Mindspeed Technologies
Datasheet: Download CX29503 datasheet File size : 1379 kB
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Advance Information
This document contains information on a product under development. The parametric information contains target parameters that are subject to change.
CX29503 Broadband Access Multiplexer (BAM)
The CX29503 Broadband Access Multiplexer (BAM) is a highly integrated, cost-effective, monolithic device which performs the mapping, multiplexing, demultiplexing, and framing of three STS-1, AU-3, DS3, E3, or one AU-4 inputs to any valid combination of 84 DS1 or 63 E1 signals. The CX29503 may be used as a SONET/SDH-to-PDH mapper supporting all standard mappings at 51 Mbps, 2 Mbps, and 1.5 Mbps rates, or it may be used as a PDH muldem only. It generates and terminates all Virtual Tributary (VT) and Virtual Container (VC) path overhead. It includes three embedded DS3/E3 framers, three M13/E13 MUX/DEMUX blocks with G.747 support, and 84 embedded DS1 framers and 63 embedded E1 framers. Other features include standards-compliant alarm indicators, status monitoring and error counters for all supported tributaries, and an embedded Command and Status Processor (CSP) that offloads major network maintenance activities from the host processor. The CX29503, in conjunction with Mindspeed's 1,024-channel HDLC Controller device (CX28500) and the STS-12/STM-4 SONET/SDH Framer/Multiplexer device (CX29610), allows equipment suppliers to develop single, high-density, software-configurable system solutions for datacom and IP path terminating applications supporting both North American and European transmission standards. The high level of integration drives down per-port framer cost and dramatically reduces board space requirements. A complete STS-12/STM-4 system channelized down to DS1/E1 for an IP HDLC packet processing solution requires only seven devices from Mindspeed. The CX29503 supports current ANSI, ETSI, ITU, and Telcordia standards with embedded, enhanced network alarming and maintenance features that reduce real-time requirements on the host processor. Physical layer support is provided for alarm generation and detection, error monitoring, and data link maintenance.
Distinguishing Features
· Capacity Three STS-1 or TUG-3 or DS3 or E3 line-side inputs Supports two types of line interfaces: SONET Interleave Bus (SI-Bus) interfaces for a parallel data bus connection to the SONET/SDH multiplexer devices at the STS-1/TUG-3 data rates DS3/E3 serial interfaces for a connection to Line Interface Units (LIU) System Interface Supports three serial Time Slot Bus (TSB) interfaces for a connection to high-density HDLC controller devices. Time slots can be configured to transmit DS3/E3, DS1/E1/J1, STS-1, or VT1.5 payloads Supports the following multiplexing modes: PDH · M13 · E13 · G.747 SONET/SDH · STS-1/VT1.5 · STS-1/VT2.0 · TUG-3/VC-11 · TUG-3/VC-12 Supports the following mapping modes: SONET/PDH · DS3 to STS-1 · E3 to STS-1 · DS1 to VT1.5 · J1 to VT1.5 · E1 to VT2.0 SDH/PDH DS3 to VC-3 · E3 to VC-3 · DS1 to VC-11 · J1 to VC-11 · E1 to VC-12 Embedded PDH framers including: 3 x DS3/E3 framers 21 x DS2/E2 framers 84 x DS1/E1/J1 framers
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Functional Block Diagram
Unchannelized DS3/E3
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Payload TSB
DS3/E3 Serial Interface
DS3/E3 Framer
M13/E13 MUX DEMUX
28xDS1 21xE1 Framers Time Slot Bus Interface Module
STS-1 to DS3/E3 Mapper
DS1/VT1.5, E1/VT2.0, DS1/VC-11, and E1/VC-12 Tributary Mapper Unchannelized STS-1
Overhead TSB
TopSI-Bus Level Interface SI-Bus MUX
SI-Bus I/F
STS-1 to VT1.5/2.0 TUG-2/3 to VC-11/VC-12 MUX
28xVT1.5/VC-11 21xVT2.0/VC-12 Overhead Termination/ Generation
Command and Status Processor E-Bus Processor Interface
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SLICE 1 SLICE 2 SLICE 3 E-Bus Interface To Host Processor (Optional)
100702_010a
500238B
Mindspeed TechnologiesTM
Advance Information
Novem ber 2002
Ordering Information
Model Number CX29503 Package TBGA Operating Temperature -40 °C to 85 °C
© 2002, Mindspeed TechnologiesTM, A Conexant Business
All rights reserved. Infor mation in this document is provided in connection with Mindspeed Technologies ("Mindspeed") products. These materials are provided by Mindspeed as a service to its customers and may be used for informational purposes only. Mindspeed assumes no responsibility for errors or omissions in these materials. Mindspeed may make changes to specifications and product descriptions at any time, without notice. Mindspeed makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Mindspeed's Terms and Conditions of Sale for such products, Mindspeed assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF MINDSPEED PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. MINDSPEED FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. MINDSPEED SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS, WHICH MAY RESULT FROM THE USE OF THESE MATERIALS. Mindspeed products are not intended for use in medical, lifesaving or life sustaining applications. Mindspeed customers using or selling Mindspeed products for use in such applications do so at their own risk and agree to fully indemnify Mindspeed for any damages resulting from such improper use or sale. The following are trademarks of Conexant Systems, Inc.: Mindspeed TechnologiesTM, the MindspeedTM logo, and "Build It First"TM. Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners. For additional disclaimer information, please consult Mindspeed Technologies Legal Information posted at www.mindspeed.com which is incorporated by reference.
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Mindspeed TechnologiesTM
Advance Information
500238B
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Receive and mapping operation using built-in digital jitter attenuators; external PLL not required. Standards-compliant Performance Monitoring (PM) at the DS3/E3, DS1/E1, VT1.5/VT2.0 levels. STS-1-level PM is performed in the accompanying SONET/SDH multiplexer device (CX29610). Standards-compliant network alarm detection and insertion for both SONET/SDH and PDH signals. Dual edge network alarm indicators reporting start and end of an alarm condition with corresponding maskable interrupts. Detects and counts errors for SONET/SDH and PDH signals. Error counter sizes are sufficient to count one second of errors without counter saturation in the presence of up to a 10-3 error rate. Error counters operate in two modes: · one-second mode-counter values are latched on a one-second boundary · count to saturation mode
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Embedded CSP state machine · Performs device access activities by communicating with the host processor via HDLC command/response packets. · Automates device activities by internally responding to network events, reducing real-time requirements on the host processor. Full data link support at the SONET STS-1/VT1.5/VT2.0. SDH VC-11, VC12, and PDH DS3/E3, DS1/E1/J1 levels. Full line and system side loopback support: Line loopbacks: STS-1/TUG-3, DS3/E3, DS2/E2, DS1/E1/J1 System loopbacks: STS-1, DS3/E3 Complies with GR 253-CORE, TR-TSY-000009, T1.105, T1.231, T1.403, T1.404, G.707, G.742, G.743, G.747, G.751, G.752, G.781, G.783, ETS300.147, ETS300.417-1-1 Power Supplies/Power Consumption Requires 3.3 V and 1.8 V power
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supplies · 3.3 V input/output · 1.8 V core · Optional 5 V power supply for 5 V input tolerance Power consumption under 2 Watts Package: 31 mm, 324 ball TPBGA with a heat spreader. Operating temperature: 40 to 85 °C Testing: JTAG boundary scan support
Applications
· · · · Routers Access Concentrators Multiservice Switches T1/T3 Frame Relay Switches
500238B
Mindspeed TechnologiesTM
Advance Information
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500238B
Mindspeed TechnologiesTM
Advance Information
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Contents
Figures Tables
1.1 1.2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xvii . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xix
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Line Side Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.2.1 Line Side Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.2.2 SONET Interleave Bus (SI-Bus) Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 System Side InterfacesTime Slot Bus (TSB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3 Supported Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3 Supported Mapping. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4 Embedded Framers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Supported Through-Paths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6 1.7.1 Commonly Used Through-Paths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8 1.7.2 Other Supported Through-Paths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10 1.8.1 OC-12/STM-4 Path Termination for HDLC Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10 1.8.2 OC-3/STM-1 Path Termination for HDLC Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11 1.8.3 DS3/E3 Path Termination for HDLC Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
1.0 Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.3 1.4 1.5 1.6 1.7
1.8
1.9
2.0 Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1 2.2 2.3 2.4 2.5 CX29503 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 CX29503 Detailed Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Top-Level MUX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 Global Control and Status Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 SONET Interleave Bus (SI-Bus) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5 2.5.1 SI-Bus Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6 2.5.1.1 Transmit Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7 2.5.1.2 Receive Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8 2.5.2 CX29503 Connection to CX29610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9 SONET/SDH Mapper/Multiplexer (MUX) Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10 2.6.1 SONET/SDH Mapper/MUX Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12 2.6.1.1 SI-Bus Receiver Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12 2.6.1.2 STS-1/TUG-3 SPE Extraction Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12
2.6
500238B
Mindspeed TechnologiesTM
Advance Information
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Others parts begin by cx
CX-1 CX-2 CX-3 CX-4 CX-5 CX-6 CX-7 CX-8 CX-9 CX-10 CX-11 CX-12 CX-13 CX-14 CX-15 CX-16
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