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Part: BAT54C
Category: Discrete -> Diodes & Rectifiers -> Schottky Diodes -> Small Signal
Description: Package Type : SOT-23, if : 0.3A, VRM : 30V
Company: Micro Commercial Components
Datasheet: Download BAT54C datasheet File size : 40 kB
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Datasheet text preview:
MCC
Features
· · · Low Forward Voltage Surface Mount device Very small conduction losses MCC Catalog Number BAT54 BAT54A BAT54C BAT54S Device Marking L4P L42 L43 L44
omponents 20736 Marilla Street Chatsworth !"# $
% !"#
BAT54 THRU BAT54S
250mWatt, 30Volt
Schottky Barrier Diode
Type Single Dual Dual Dual
Pin Configuration
(See Page 3)
Figure 1 Figure 2 Figure 3 Figure 4
A D
SOT-23
C
B
Maximum Ratings
Continuos Reverse Voltage Forward Current Non-Repetitive Peak Forward Current t<1s Total Power Dissipation @ TA = 25°C Storage Temperature Range Junction Temperature Soldering temperature during 10s VR IF IFSM PD Tstg Tj Tj 30V 0.3A 1.0A 250mW -55°C to 150°C 150°C 260°C
G
F
E
H
J
K DIMENSIONS INCHES MIN .110 .083 .047 .035 .070 .018 .0005 .035 .003 .015 MM MIN 2.80 2.10 1.20 .89 1.78 .45 .013 .89 .085 .37
Electrical Characteristics @ 25 °C Unless Otherwise Specified
Ratings Forward Voltage at IF = 0.1mA IF = 1mA IF = 10mA IF = 30mA IF = 100mA Reverse Current Reverse Breakdown Voltage Capacitance Reverse Recovery Time Thermal Resistance, Junction to Ambient Symbol VF Max. 240mV 320mV 400mV 500mV 900mV 2.0 uA >30V 10pF 5nS 430 °C/W Notes
DIM A B C D E F G H J K
MAX .120 .098 .055 .041 .081 .024 .0039 .044 .007 .020
MAX 3.04 2.64 1.40 1.03 2.05 .60 .100 1.12 .180 .51
NOTE
Suggested Solder Pad Layout VR = 25V
.035 .900 .031 .800
IR V(BR ) CJ trr RJA
Measured at 1.0MHz, VR=1.0V I F = I R =10mA; I(REC) = 1mA
.079 2.000
inches mm
.037 .950
.037 .950
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Revision: 3 2003/02/21
BAT54 thru BAT54S
MCC
Fig.2 : Average forward current versus ambient temperature ( = 1).
0.35
IF(av)(A)
Fig.1 : Average forward power dissipation versus average forward current.
PF(av)(W) 0.35 0.30 0.25 0.20 0.15 0.10 0.05 IF(av) (A) 0.00 0.00 0.05 0.10 0.15 0.20
=tp/T
tp T
= 0.1 = 0.05
= 0.2
= 0.5
0.30 0.25
=1
0.20 0.15 0.10 0.05
=tp/T
T
tp
Tamb(°C)
0.25
0.30
0.00
0
25
50
75
100
125
150
Fig.3 : Non repetitive surge peak forward current versus overload duration (maximum values).
Fig.4 : Relative variation of thermal impedance junction to ambient versus pulse duration (alumine substrate 10mm x 8mm x 0.5mm).
Zth(j-a)/Rth(j-a)
IM(A) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 IM 0.2 0.1 0.0 1E-3
1.00
= 0.5
= 0.2
Ta=25°C
= 0.1
Ta=50°C
0.10
T
Single pulse
Ta=100°C
t
=0.5
t(s) 1E-2 1E-1 1E+0
tp(s)
=tp/T
tp
0.01 1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
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Revision: 3 2003/02/21
BAT54 thru BAT54S
MCC
Fig.5 : Reverse leakage current versus reverse voltage applied (typical values).
IR(µA) 1E+2
Tj=100°C
Fig.6 : Reverse leakage current versus junction t e m pe r a t ur e.
IR(µA) 1E+4
VR=30V
1E+3 1E+2 1E+1
1E+1 1E+0 1E-1 1E-2
Tj=50°C
1E+0
Tj=25°C
1E-1
VR(V) 0 5 10 15 20 25 30
Tj(°C) 1E-2 0 25 50 75 100 125 150
Fig.7 : Junction capacitance versus reverse vo lt a g e applied (typical values).
C(pF) 10
F=1MHz Tj=25°C
Fig.8 : Forward voltage drop versus forward cu rre nt (typical values).
IFM(A) 5E-1 1E-1
Tj=100°C
5
1E-2
Tj=50°C
2 VR(V) 1 1 2 5 10 20 30
Tj=25°C
1E-3 VFM(V) 1E-4 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Pin Configuration - Top View
3
1
Figure 1
2
Figure 2 Figure 3 Figure 4
BAT54
BAT54A
BAT54C
BAT54S
www.mccsemi.com
Revision: 3 2003/02/21
Others parts begin by ba
BA-1 BA-2 BA-3 BA-4 BA-5 BA-6 BA-7 BA-8 BA-9 BA-10 BA-11 BA-12 BA-13 BA-14 BA-15 BA-16 BA-17 BA-18
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