Details, datasheet, quote on part number: UPGLED525B
PartUPGLED525B
CategoryOptoelectronics => Drivers/Controllers => LEDs
DescriptionLed, Package : (none)
CompanyMicrosemi Corporation
DatasheetDownload UPGLED525B datasheet
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Features, Applications

Microsemi's high brightness UPGLED525B product offers impressive brightness with industry leading thermal resistivity. These products deliver superior thermals that keep junction temperatures low with a remarkable package thermal resistivity of 110 degrees C/Watt. The green packages also deliver a very wide viewing angle able to easily integrate into optical lenses. The Optomite package performs extremely well under extreme temperature conditions with less wavelength shift and intensity degradation seen by many competitors.

IMPORTANT: For the most current data, consult MICROSEMI's website: http://www.microsemi.com

Low Thermal Resistance Rugged Optomite 0603 package High Intensity Wide Viewing Angle High Luminous flux efficacy 6.5 lumens per watt APPLICATIONS/BENEFITS

ABSOLUTE MAXIMUM RATINGS 25º C (UNLESS OTHERWISE SPECIFIED)

Parameters Forward Drive Current Peak Forward Current LED Operating Junction Temperature Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Electrostatic Discharge ESD classification Solder Reflow Peak Temperature (Solder 10") THERMAL CHARACTERISTICS

Signage Backlighting Panel, button, switch indicators Marker lights

DC Drive Current 20mA DC Drive Current 20mA DC Drive Current 30mA DC Drive Current 50mA DC Drive Current 20mA DC Drive Current 20mA DC Drive Current = 20mA

Dominant Wavelength Peak Wavelength Chrom x Chrom y Angle Coverage to 50% points

DC Drive Current 20mA DC Drive Current 20mA DC Drive Current 30mA DC Drive Current = 50mA Reverse Voltage 5 V

Note: Anode is identified by the underside of the LED, (smaller of the two base pads) Mount to circuit boards using Pb/Sn 60/40 or equivalent. Maximum solder temperature exposure is 225°C for 10 seconds.


 

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