|Company||Motorola Semiconductor Products|
|Datasheet||Download MC74HC393AJ datasheet
The MC54/74HC393A is identical in pinout to the LS393. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device consists of two independent 4bit binary ripple counters with parallel outputs from each counter stage. ÷ 256 counter can be obtained by cascading the two binary counters. Internal flipflops are triggered by hightolow transitions of the clock input. Reset for the counters is asynchronous and activehigh. State changes of the Q outputs do not occur simultaneously because of internal ripple delays. Therefore, decoded output signals are subject to decoding spikes and should not be used as clocks or as strobes except when gated with the Clock of the HC393A. Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 6 V Low Input Current: 1 µA High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A Chip Complexity: 236 FETs or 59 Equivalent GatesD SUFFIX SOIC PACKAGE CASE 751A03 DT SUFFIX TSSOP PACKAGE CASE 948G01
ORDERING INFORMATION MC74HCXXXAD MC74HCXXXADT Ceramic Plastic SOIC TSSOP
Inputs Clock H L Reset Outputs L No Change No Change No Change Advance to Next State
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Symbol VCC Vin Parameter Value Unit V DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) 0.5 to VCC to VCC Vout Iin DC Output Voltage (Referenced to GND) DC Input Current, per Pin mA Iout DC Output Current, per Pin ICC PD DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic or Ceramic DIP SOIC Package TSSOP Package Storage Temperature mW Tstg 65 to
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this highimpedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP, SOIC or TSSOP Package (Ceramic DIP)
Symbol VCC Parameter Min 2.0 0 Max 6.0 Unit V DC Supply Voltage (Referenced to GND) Vin, Vout TA DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) VCC
* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating Plastic DIP: 10 mW/_C from to 125_C Ceramic DIP: 10 mW/_C from to 125_C SOIC Package: 7 mW/_C from to 125_C TSSOP Package: 6.1 mW/_C from to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).
Guaranteed Limit 85_C Symbol VOL Parameter Test Conditions VCC 125_C 0.1 Unit V Maximum LowLevel Output Voltage Vin = VIH or VIL |Iout| µA 0.1 Vin = VIH or VIL |Iout| Vin = VCC or GND Vin = VCC or GND Iout 5.2 mA Iin Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) µA ICC NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 3)
Maximum Output Transition Time, Any Output (Figures 1 and 3)
NOTES: 1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D). 2. Information on typical parametric values can be found in Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D). Typical @ 25°C, VCC 5.0 V CPD Power Dissipation Capacitance (Per Counter)* 35
* Used to determine the noload dynamic power consumption: PD = CPD VCC f + ICC VCC. For load considerations, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).
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