200 kPa On-Chip Temperature Compensated Silicon Pressure Sensors
The MPX2200 series devices are silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. They are designed for use in applications such as pump/ motor controllers, robotics, level indicators, medical diagnostics, pressure switching, barometers, altimeters, etc.
· Pump/Motor Control Robotics Level Detectors Medical Diagnostics Pressure Switching Barometers Altimeters
· Temperature Compensated Over ± 0.25% Linearity (MPX2200D) Easy-to-Use Chip Carrier Package Options Absolute, Differential and Gauge Options
Package Case Device Name Options No. Unibody Package (MPX2200 Series) MPX2200A Tray 344 MPX2200D Tray MPX2200AP MPX2200GP Tray 344C 344B None # of Ports Single Dual Gauge Pressure Type Differential Absolute Device Marking MPX2200D MPX2200DP
Table 1. Operating Characteristics (VS = 10 VDC, = 25°C unless otherwise noted, > P2)
Characteristic Differential Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity Pressure to 200 kPa) Temperature Hysteresis(- to +125°C) Temperature Coefficient of Full Scale Span Temperature Coefficient of Offset Input Impedance Output Impedance Response to 90%) Warm-Up Time(6) Offset Stability(7) 1. kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Response Time is defined as the time for the incremental change in the output to go from 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2200D Series MPX2200A Series Symbol POP VS IO VFSS VOFF V/ TCVFSS TCVOFF ZIN ZOUT tR Min Typ Max Units kPa VDC mAdc mV mV/kPa %VFSS mV ms %VFSS
Rating Maximum Pressure > P2) Storage Temperature Operating Temperature Max Value to +125 Unit kPa °C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip.
VS 3 Thin Film Temperature Compensation and Calibration Circuitry 1 GND
Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic