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Details, datasheet, quote on part number:XC68C812A4PV5
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MOTOROLA
Order this document by MC68HC812A4EC/D
7/28/98
SEMICONDUCTOR
TECHNICAL DATA
Technical Supplement MC68C812A4 3.3V Electrical Characteristics
The MC68C812A4 is the low-voltage version of the standard MC68HC812A4 microcontroller unit (MCU), a 16-bit device composed of standard on-chip peripheral modules connected by an intermodule bus. Modules include a 16-bit central processing unit (CPU12), a Lite integration module (LIM), two asynchronous serial communications interfaces (SCI0 and SCI1), a serial peripheral interface (SPI), a timer and pulse accumulation module, an 8-bit analog-to-digital converter (ATD), 1-Kbyte RAM, 4-Kbyte EEPROM, and memory expansion logic with chip selects, key wakeup ports, and a phase-locked loop (PLL). This supplement contains the most accurate electrical information for the MC68C812A4 microcontroller available at the time of publication. The information should be considered preliminary and is subject to change. The following characteristics are contained in this document: Table 1 Maximum Ratings Table 2 Thermal Characteristics Table 3 DC Electrical Characteristics Table 4 Supply Current Table 5 ATD Maximum Ratings Table 6 ATD DC Electrical Characteristics Table 7 Analog Converter Characteristics (Operating) Table 8 ATD AC Characteristics (Operating) Table 9 EEPROM Characteristics Table 10 Control Timing Table 11 Peripheral Port Timing Table 12 Non-Multiplexed Expansion Bus Timing Table 13 SPI Timing
PRELIMINARY
© MOTOROLA INC, 1997, 1998
Table 1 Maximum Ratings1
Rating Supply voltage Input voltage Operating temperature range MC68C812A4PV5 Storage temperature range Current drain per pin3 Excluding VDD and VSS VDD differential voltage
2
Symbol VDD, VDDA, VDDX VIN TA Tstg IIN VDD-VDDX
Value -0.3 to +6.5 -0.3 to +6.5 TL to TH 0 to +70 -55 to +150 ±25 6.5
Unit V V °C °C mA V
PRELIMINARY
NOTES: 1. Permanent damage can occur if maximum ratings are exceeded. Exposures to voltages or currents in excess of recommended values affects device reliability. Device modules may not operate normally while being exposed to electrical extremes. 2. Refer to MC68HC812A4TS/D Technical Summary for complete part numbers. 3. One pin at a time, observing maximum power dissipation limits. Internal circuitry protects the inputs against damage caused by high static voltages or electric fields; however, normal precautions are necessary to avoid application of any voltage higher than maximum-rated voltages to this highimpedance circuit. Extended operation at the maximum ratings can adversely affect device reliability. Tying unused inputs to an appropriate logic voltage level (either GND or VDD) enhances reliability of operation.
Table 2 Thermal Characteristics
Characteristic Average junction temperature Ambient temperature Package thermal resistance (junction-to-ambient) 112-pin thin quad flat pack (TQFP) Symbol TJ TA JA Value TA + (PD × JA) User-determined 39 PINT + PI/O or K ------------------------T J + 273 ° C IDD × VDD User-determined PD × (TA + 273°C) + JA × PD2 Unit °C °C °C/W
Total power dissipation1
PD
W
Device internal power dissipation I/O pin power A constant3 dissipation2
PINT PI/O K
W W W · °C
NOTES: 1. This is an approximate value, neglecting PI/O. 2. For most applications PI/O « PINT and can be neglected. 3. K is a constant pertaining to the device. Solve for K with a known TA and a measured PD (at equilibrium). Use this value of K to solve for PD and TJ iteratively for any value of TA.
MOTOROLA 2
MC68C812A4
Table 3 DC Electrical Characteristics VDD = 3.3 Vdc ± 0.3V, VSS = 0 Vdc, TA = TL to TH, unless otherwise noted
Characteristic Input high voltage, all inputs Input low voltage, all inputs Output high voltage All I/O and output pins Normal drive strength IOH = -10.0 µA IOH = -0.8 mA Reduced drive strength IOH = -4.0 µA IOH = -0.3 mA Output low voltage, All I/O and output pins, normal drive strength IOL = 10.0 µA IOL = 1.6 mA VOL EXTAL, PAD[7:0], VRH, VRL, VFP, XIRQ, reduced drive strength IOL = 3.6 µA IOL = 0.6 mA Input leakage current1 all inputs except IRQ, PAD7, and XFC Vin = VDD or VSS IRQ, PAD7, XFC Three-state leakage, I/O ports, BKGD, and RESET Input capacitance All input pins and ATD pins (non-sampling) ATD pins (sampling) All I/O pins Output load capacitance All outputs except PS[7:4] PS[7:4] Active pull-up, pull-down current IRQ, XIRQ, ECLK, LSTRB, R/W , BKGD, MODA, MODB, ARST Ports A, B, C, D, F, G, H, J, S, T RAM standby voltage, power down RAM standby current Iin IOZ -- -- -- -- -- -- -- -- -- -- 50 2.0 -- VSS+0.2 VSS+0.4 ±1 ±10 ±2.5 10 15 20 90 130 500 -- 1 V V µA µA µA pF pF pF pF pF µA V mA Symbol VIH VIL Min 0.7 × VDD VSS-0.3 Max VDD + 0.3 0.2 × VDD Unit V V
VOH
VDD - 0.2 VDD - 0.8 VDD - 0.2 VDD - 0.8 -- --
-- --
V V
-- -- VSS+0.2 VSS+0.4
V V V V
Cin
CL
IAPU VSB ISB
NOTES: 1. Specification is for parts in the 0 to +70°C range. Higher temperature ranges will result in increased current leakage.
MC68C812A4
MOTOROLA 3
PRELIMINARY
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