|Category||Interface and Interconnect => LVDS (Low Voltage Differential Signaling) => Bus LVDS Tranceivers and Repeaters|
|Title||Bus LVDS Tranceivers and Repeaters|
|Description||DS92LV222A - Two Channel Bus LVDS Muxed Repeater, Package: Soic Narrow, Pin Nb=16|
|Company||National Semiconductor Corporation|
|Datasheet||Download DS92LV222A datasheet
The is a repeater designed specifically for the bridging of multiple backplanes in a rack. The DS92LV222A utilizes low voltage differential signaling to deliver high speed while consuming minimal power with reduced EMI. The RSEL pin and DE pins allow maximum flexibility as to which receiver/driver are used. The DS92LV222A repeats signals between backplanes and accepts or drives signals onto the local bus. It also features a flow through pin out which allows easy PCB routing for short stubs between its pins and the connector. The driver is selectable between mA (100 load) and mA (27 load) output loop currents depending upon the level applied to the ISEL pin. This allows for single termination (point-to-point) and also double termination (multipoint) applications while maintain similar differential levels. The receiver threshold ± 100 mV, while providing ± 1V common mode range.Features
Bus LVDS Signaling (BLVDS) Designed for Double Termination Applications Low power CMOS design High Signaling Rate Capability (above 100 Mbps) Ultra Low Power Dissipation (13.2 mW quiescent) Balanced Output Impedance Lite Bus Loading 5 pF typical Selectable Drive Capability or 8.5 mA) 3.3V operation ± 1V Common Mode Range 100 mV Receiver Sensitivity Available in 16 pin SOIC package.TRI-STATE is a registered trademark of National Semiconductor Corporation.
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) Enable Input Voltage (DE) Current Select Voltage (ISEL) Receiver Select Voltage (RSEL) Bus Pin Voltage (DO/RI ± ) Driver Short Circuit Current ESD (HBM k, 100 pF) Maximum Package Power Dissipation at 25°C SOIC -0.3V to (VCC -0.3V to (VCC -0.3V to (VCC to +3.9V ContinuousDerate SOIC Package above 25°C Storage Temperature Range Lead Temperature (Soldering, 4 sec.)
Min Supply Voltage (VCC) Receiver Input Voltage Operating Free Air Temperature 0.0 -40 Max Units V °C
to +85°C unless otherwise noted, VCC ± 0.3V (Notes 2, 3) Symbol VOD VOS VOD VOS IOZD IOXD IOSD Parameter Output Differential Voltage VOD Magnitude Change Offset Voltage Offset Magnitude Change Output Differential Voltage VOD Magnitude Change Offset Voltage Offset Magnitude Change TRI-STATE
Power-Off Leakage Output Short Circuit Current Input Threshold High Input Threshold Low Input Current
DEVICE CHARACTERISTICS VIH VIL IIH IIL VCL Minimum Input High Voltage Maximum Input Low Voltage Input High Current Input Low Current Input Diode Clamp Voltage VIN = VCC or 2.4V VIN = GND or 0.4V ICLAMP -1.5 2.0 GND VCC µA VSymbol ICCD Parameter Power Supply Current
to +85°C unless otherwise noted, VCC ± 0.3V (Notes 2, 3) Conditions No Load; DE = RSEL = VCC Isel DE = RSEL = VCC Isel 0 V ICCZ Cinput Coutput Capacitance at Capacitance = 0V; RSEL = VCC RO+/RODO+/DOPin VCC Min Typ Max 40 8 Units mA pF DEVICE CHARACTERISTICS
Note 1: "Absolute Maximum Ratings" are these beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. The table of "Electrical Characteristics" provides conditions for actual device operation. Note 2: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. Note 3: All typicals are given for VCC = +3.3V and = +25°C, unless otherwise stated. Note 4: ESD Rating: HBM k, 100 pF) 2 kV EIAJ (0, 200 pF) > 200V Note 5: CL includes probe and fixture capacitance. Note 6: Generator waveforms for all tests unless otherwise specified: ns (0%100%). Note 7: The is a current mode device and only functions datasheet specifications when a resistive load is applied to the drivers outputs. Note 8: During receiver select transition(s), data must be held in a steady state 15 ns before and 15 ns after the RSEL pin changes state. Note 9: Channel-to-channel skew is the measurement between outputs of D0 and D1.
to +85°C, VCC ± 0.3V (Note 6) Symbol tTLH tTHL tPHZ tPLZ tPZH tPZL tPHL_RD tPLH_RD tSK_RD tPLH_R1 Dx Parameter Transition Time Low to High Transition Time High to Low Disable Time High to Z Disable Time Low to Z Enable Time Z to High Enable Time Z to Low Differential Prop. Delay High to Low Differential Prop. Delay Low to High Pulse SKEW |t PHL tPLH| Prop. Delay High to Low Prop. Delay Low to High Channel-to-Channel Skew R Channel-to-Channel Skew R Channel-to-Channel Skew R Channel-to-Channel Skew R
DIFFERENTIAL RECEIVER TO DRIVER TIMING REQUIREMENTS = 27 Figures 10 pF Figures 2, 3 RSEL to Driver Outputs = 27 Figures 10 pF (Note 10 pF (Note
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