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Part: UPC2807
Category:
Optoelectronics
-> Drivers/Controllers
-> Infrared/Remote Control
Description: Preamplifier For Infrared Remote Controller
Company: NEC Electronics Inc.
Datasheet: Download UPC2807 datasheet File size : 7 kB
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Datasheet text preview:
DATA SHEET
BiCMOS INTEGRATED CIRCUIT
µ PC2807,2807A
PREAMPLIFIER FOR INFRARED REMOTE CONTROLLER
DESCRIPTION
The µ PC2807 and 2807A are semiconductors integrated circuit developed as preamplifiers for the receiver module of infrared remote controllers. These preamplifiers can be directly connected to a PIN photodiode, and integrate a high-gain first stage amplifier, limiter, bandpass filter, detector circuit, and waveform-shaping circuit on a single chip.
FEATURES
· Only PIN photodiode required as an external component. · Following carrier frequencies (fO) selectable (five types):
µ PC2807
: fO = 32.7, 36.0, 36.7, 37.9 kHz
µ PC2807A : fO = 40.0 kHz
· Fixed trap frequency fT = 54 kHz · Active-low output · Supplied in form of wafer
APPLICATION
· Receiver module of infrared remote controller
ORDERING INFORMATION
Par t Number Condition in shipment Wafer Wafer
µ PC2807W µ PC2807AW
Contact an NEC sales representative in advance since a memorandum on product quality need to be prepared for shipment in the form of wafer.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. S13198EJ1V0DS00 (1st edition) Date Published May 2000 NS CP (K) Printed in Japan
The mark 5 shows major revised points. 1998, 2000
µ PC2807, 2807A
BLOCK DIAGRAM
VCC 6 ABLC First-stage Limiter amplifier amplifier TRAP BPF Detector PAD1 3 Waveform-shaping circuit 22 k 5 OUT
IN
9
I/V
Carrier elimination TRAP skip Trimming circuit fO setting
13
12
11
10
4 S3
2 S2
1 S1
8
7
PAD6 PAD4 PAD5 PAD3
GND2 GND1
2
Data Sheet S13198EJ1V0DS00
µ PC2807, 2807A
PAD FUNCTION
Symbol VCC Pad No. 6 Function Power pad. Apply a voltage of 5 V ± 10 %. Connect an external smoothing filter if noise on power line is high. GND1 GND2 IN OUT 7 8 9 5 GND pad (for output transistor) GND pad (for circuits excluding output transistor) Input pad. Internal impedance is 190 k TYP. PIN photodiode can be directly connected. Output pad. Open-collector output with pull-up resistor (22 k TYP.) To connect pull-up resistor, use resistor of 10 k or higher. S1 S2 S3 PAD1 1 2 4 3 BPF output pad. Parameters such as voltage gain and BPF bandwidth can be tested. Do not connect this pad to anything on final assembly. PAD3 PAD4 PAD5 PAD6 10 11 12 13 Test and trimming pads. Do not connect these pads to anything. BPF center frequency setting pads. Connect pad corresponding to carrier frequency to be used to GND
Note
.
Note Connect each of BPF center frequency setting pads as follows depending on the carrier frequency.
· µ PC2807
Carrier Frequency 32.7 kHz 36.0 kHz 36.7 kHz 37.9 kHz GND GND Leave unconnected. Leave unconnected. S1 S2 Leave unconnected. GND GND Leave unconnected. S3 Leave unconnected. GND GND Leave unconnected.
· µ PC2807A
Carrier Frequency 40.0 kHz S1 Leave unconnected. S2 Leave unconnected. S3 Leave unconnected.
Data Sheet S13198EJ1V0DS00
3
Others parts begin by up
UP-1 UP-2 UP-3 UP-4 UP-5 UP-6 UP-7 UP-8 UP-9 UP-10 UP-11 UP-12 UP-13 UP-14 UP-15 UP-16 UP-17 UP-18 UP-19 UP-20 UP-21 UP-22 UP-23 UP-24 UP-25 UP-26 UP-27 UP-28
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