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Part: UPD75P0016CU
Category:
Microcontrollers
Description: 4-bit Single-chip Microcontroller
Company: NEC Electronics Inc.
Datasheet: Download UPD75P0016CU datasheet File size : 6486 kB
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DATA SHEET
MOS INTEGRATED CIRCUIT
µPD75P0016
4-BIT SINGLE-CHIP MICROCONTROLLER
The µPD75P0016 replaces the µPD750008's internal mask ROM with a one-time PROM and features expanded ROM capacity. Because the µPD75P0016 supports programming by users, it is suitable for use in prototype testing for system development using the µPD750004, 750006, or 750008 products, and for use in small-lot production. Detailed information about product features and specifications can be found in the following document
µPD750008 User's Manual: U10740E
FEATURES
· Compatible with µPD750008 · Memory capacity: · PROM : 16384 × 8 bits · RAM : 512 × 4 bits · Can operate in same power supply voltage as the mask ROM version µPD750008 · VDD = 2.2 to 5.5 V · Supports QTOPTM microcontroller Remark QTOP Microcontroller is the general name for a total support service that includes imprinting, marking, screening, and verifying one-time PROM single-chip microcontrollers offered by NEC.
ORDERING INFORMATION
Part number Package 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch) 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch) ROM (× 8 bits) 16384 16384
µPD75P0016CU µPD75P0016GB-3BS-MTX
Caution On-chip pull-up resistors by mask option cannot be provided.
The information in this document is subject to change without notice. Document No. U10328EJ3V1DS00 (3rd edition) Date Published August 2000 N CP(K) Printed in Japan
The mark
shows major revised points.
©
1995
µPD75P0016
FUNCTION LIST
Item Instruction execution time Function · 0.95, 1.91, 3.81, 15.3 µs (main system clock: at 4.19 MHz operation) · 0.67, 1.33, 2.67, 10.7 µs (main system clock: at 6.0 MHz operation) · 122 µs (subsystem clock: at 32.768 kHz operation) PROM RAM General register I/O port CMOS input CMOS I/O N-ch open drain I/O Total Timer 16384 × 8 bits 512 × 4 bits · In 4-bit operation: 8 × 4 banks · In 8-bit operation: 4 × 4 banks 8 18 8 34 4 channels · · · · Serial interface 8-bit timer/event counter: 1 channel 8-bit timer counter: 1 channel Basic interval timer/watchdog timer: 1 channel Watch timer: 1 channel Connection of on-chip pull-up resistor specifiable by software: 7 Direct LED drive capability Connection of on-chip pull-up resistor specifiable by software: 18 Direct LED drive capability 13 V withstand voltage
On-chip memory
· 3-wire serial I/O mode ... Switching of MSB/LSB-first · 2-wire serial I/O mode · SBI mode 16 bits · , 524, 262, 65.5 kHz (main system clock: at 4.19 MHz operation) · , 750, 375, 93.8 kHz (main system clock: at 6.0 MHz operation) · 2, 4, 32 kHz (main system clock: at 4.19 MHz operation or subsystem clock: at 32.768 kHz operation) · 2.93, 5.86, 46.9 kHz (main system clock: at 6.0 MHz operation) External: 3 Internal: 4 External: 1 Internal: 1 · Main system clock oscillation ceramic/crystal oscillation circuit · Subsystem clock oscillation crystal oscillation circuit STOP/HALT mode TA = 40 to +85°C VDD = 2.2 to 5.5 V 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch) 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch)
Bit sequential buffer (BSB) Clock output (PCL) Buzzer output (BUZ)
Vectored interrupt Test input System clock oscillation circuit Standby function Operating ambient temperature Supply voltage Package
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Data Sheet U10328EJ3V1DS00
µPD75P0016
TABLE OF CONTENTS 1. 2. 3. PIN CONFIGURATION ...... 4 BLOCK DIAGRAM ........... 6 PIN FUNCTIONS .............. 7
3.1 3.2 3.3 3.4 Port Pins ........... 7 Non-port Pins ............ 8 I/O Circuits for Pins .. 9 Handling of Unused Pins ...... 11
4.
SWITCHING BETWEEN MK I AND MK II MODES ........ 12
4.1 4.2 Differences between Mk I Mode and Mk II Mode .. 12 Setting of Stack Bank Selection (SBS) Register .. 13
5. 6. 7. 8.
DIFFERENCES BETWEEN µPD75P0016 AND µPD750004, 750006, AND 750008 .... 14 MEMORY CONFIGURATION .. 15 INSTRUCTION SET ........ 17 ONE-TIME PROM (PROGRAM MEMORY) WRITE AND VERIFY ......... 28
8.1 8.2 8.3 8.4 Operation Modes for Program Memory Write/Verify .......... 28 Steps in Program Memory Write Operation ......... 29 Steps in Program Memory Read Operation .......... 30 One-Time PROM Screening ........... 31
9.
ELECTRICAL SPECIFICATIONS ........... 32
10. CHARACTERISTIC CURVES (REFERENCE VALUE) ........... 46 11. PACKAGE DRAWINGS ........... 48 12. RECOMMENDED SOLDERING CONDITIONS ........ 50 APPENDIX A. FUNCTION LIST OF µPD75008, 750008, 75P0016 ....... 51 APPENDIX B. DEVELOPMENT TOOLS ....... 53 APPENDIX C. RELATED DOCUMENTS ...... 57
Data Sheet U10328EJ3V1DS00
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