|
|
Part: UPD75P0116GB-3BS-MTX
Category:
Microcontrollers
-> CISC->uPD
Description: 4-bit Single-chip Microcomputer
Company: NEC Electronics Inc.
Datasheet: Download UPD75P0116GB-3BS-MTX datasheet File size : 6486 kB
Request For quote: Find where to buy UPD75P0116GB-3BS-MTX
Datasheet text preview:
DATA SHEET
MOS INTEGRATED CIRCUIT
mPD75P0116
4-BIT SINGLE-CHIP MICROCONTROLLER
DESCRIPTION
The mPD75P0116 replaces the mPD750108's internal mask ROM with a one-time PROM and features expanded ROM capacity. Because the mPD75P0116 supports programming by users, it is suitable for use in prototype testing for system development using the mPD750104, 750106, or 750108 products, and for use in small-lot production. Detailed information about product features and specifications can be found in the following document
mPD750108 User's Manual: U11330E
FEATURES
Ý Compatible with mPD750108 Ý Memory capacity: · PROM : 16384 ¥ 8 bits · RAM : 512 ¥ 4 bits Ý Can operate in same power supply voltage as the mask ROM version mPD750108 · VDD = 1.8 to 5.5 V
ORDERING INFORMATION
Part number Package 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch) 44-pin plastic QFP (10 ¥ 10 mm, 0.8-mm pitch) ROM (¥ 8 bits) 16384 16384
mPD75P0116CU m PD75P0116GB-3BS-MTX
Caution On-chip pull-up resistors by mask option cannot be provided.
The information in this document is subject to change without notice. Document No. U12603EJ1V0DS00 (1st edition) D at e Published June 1997 N P r i nt ed in Japan
©
1997 1996
mPD75P0116
FUNCTION LIST
Item Instruction execution time Function · 4, 8, 16, 64 ms (main system clock: at 1.0 MHz operation) · 2, 4, 8, 32 ms (main system clock: at 2.0 MHz operation) · 122 ms (subsystem clock: at 32.768 kHz operation) PROM RAM General register I/O port CMOS input CMOS I/O N-ch open drain I/O Total Timer 16384 ¥ 8 bits 512 ¥ 4 bits · In 4-bit operation: 8 ¥ 4 banks · In 8-bit operation: 4 ¥ 4 banks 8 18 8 34 4 channels · 8-bit timer/event counter: 1 channel · 8-bit timer counter: 1 channel (with watch timer output function) · Basic interval timer/watchdog timer: 1 channel · Watch timer: 1 channel · 3-wire serial I/O mode ... Switching of MSB/LSB-first · 2-wire serial I/O mode · SBI mode 16 bits · F, 125, 62.5, 15.6 kHz (main system clock: at 1.0 MHz operation) · F, 250, 125, 31.3 kHz (main system clock: at 2.0 MHz operation) · 2, 4, 32 kHz (subsystem clock: at 32.768 kHz operation) · 0.488, 0.977, 7.813 kHz (main system clock: at 1.0 MHz operation) · 0.977, 1.953, 15.625 kHz (main system clock: at 2.0-MHz operation) External: 3 Internal: 4 External: 1 Internal: 1 · Main system clock oscillation RC oscillation circuit (with external resistor and capacitor) · Subsystem clock oscillation crystal oscillation circuit STOP/HALT mode TA = 40 to +85 °C VDD = 1.8 to 5.5 V 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch) 44-pin plastic QFP (10 ¥ 10 mm, 0.8-mm pitch) Connection of on-chip pull-up resistor specifiable by software: 7 Direct LED drive capability Connection of on-chip pull-up resistor specifiable by software: 18 Direct LED drive capability 13 V withstand voltage
On-chip memory
Serial interface
Bit sequential buffer (BSB) Clock output (PCL) Buzzer output (BUZ)
Vectored interrupt Test input System clock oscillation circuit Standby function Operating ambient temperature Supply voltage Package
2
mPD75P0116
TABLE OF CONTENTS 1. 2. 3. PIN CONFIGURATION (Top View) .......... 4 BLOCK DIAGRAM .......... 6 PIN FUNCTIONS ............. 7
3.1 3.2 3.3 3.4 Port Pins ........... 7 Non-port Pins ............ 8 I/O Circuits for Pins .. 9 Handling of Unused Pins ...... 11
4.
SWITCHING BETWEEN MK I AND MK II MODES ........ 12
4.1 4.2 Differences between Mk I Mode and Mk II Mode .. 12 Setting of Stack Bank Selection (SBS) Register .. 13
5. 6. 7. 8.
DIFFERENCES BETWEEN mPD75P0116 AND mPD750104, 750106, AND 750108..... 14 MEMORY CONFIGURATION .. 15 INSTRUCTION SET ........ 17 ONE-TIME PROM (PROGRAM MEMORY) WRITE AND VERIFY ......... 28
8.1 8.2 8.3 8.4 Operation Modes for Program Memory Write/Verify .......... 28 Steps in Program Memory Write Operation ......... 29 Steps in Program Memory Read Operation .......... 30 One-Time PROM Screening ........... 31
9.
ELECTRICAL SPECIFICATIONS .......... 32
10. CHARACTERISTIC CURVES (REFERENCE VALUE) ........... 46 11. RC OSCILLATION FREQUENCY CHARACTERISTICS EXAMPLES (REFERENCE VALUE) ...... 47 12. PACKAGE DRAWINGS .......... 49 13. RECOMMENDED SOLDERING CONDITIONS........ 51 APPENDIX A. FUNCTION LIST OF mPD750008, 750108, AND 75P0116 ............ 52 APPENDIX B. DEVELOPMENT TOOLS ...... 54 APPENDIX C. RELATED DOCUMENTS ...... 58
3
Others parts begin by up
UP-1 UP-2 UP-3 UP-4 UP-5 UP-6 UP-7 UP-8 UP-9 UP-10 UP-11 UP-12 UP-13 UP-14 UP-15 UP-16 UP-17 UP-18 UP-19 UP-20 UP-21 UP-22 UP-23 UP-24 UP-25 UP-26 UP-27 UP-28
|
|
|
