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Details, datasheet, quote on part number:NX25F011A-5V
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Datasheet text preview:
NX25F011A NX25F041A 1M-BIT AND 4M-BIT SERIAL FLASH MEMORIES WITH 4-PIN SPI INTERFACE
FEATURES
ˇ Flash Storage for Resource-Limited Systems Ideal for portable/mobile and microcontroller-based applications that store voice, text, and data ˇ NexFlash Serial Flash Memory Patented single transistor EEPROM technology High-density, low-voltage & power, cost-effective Small 264-byte sectors 10K/100K write cycles, ten years data retention ˇ Ultra-low Power for Battery-Operation Single 5V or 3V supply for read and erase/write 1 ľA standby current, 5 mA active @ 3V (typical) Low frequency read command for very low power No pre-erase. Erase/Write time of 5 ms/sector @ 5V ensures efficient battery use ˇ 4-pin SPI Serial Interface Easily interfaces with popular microcontrollers Clock operation as fast as 16 MHz ˇ On-chip Serial SRAM Dual 264-byte Read/Write SRAM buffers Use in conjunction with or independent of Flash Off-loads RAM-limited microcontrollers ˇ Special Features for Media-Storage Applications Byte-level addressing Transfer and compare sector to SRAM commands Versatile hardware and software write-protection Alternate oscillator frequency for EMI sensitive applications. In-system electronic part number identification Removable Serial Flash Module package option PRELIMINARY JUNE 1999
NX25F011A NX25F041A
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DESCRIPTION
The NX25F011A and NX25F041A Serial Flash memories provide a storage solution for systems limited in power, pins, space, hardware, and firmware resources. They are ideal for applications that store voice, text, and data in a portable or mobile environment. Using NexFlash's patented single transistor EEPROM cell, the devices offer a high-density, low-voltage, low-power, and cost-effective non-volatile memory solution. The devices operate on a single 5V or 3V (2.7V-3.6V) supply for Read and Erase/Write with typical current consumption as low as 5 mA active and less than 1 ľA standby. Sector erase/write speeds as fast as 5 ms increase system performance, minimize power-on time, and maximize battery life. The NX25F011A and NX25F041A provide 1M-bit and 4M-bit of flash memory organized as 512 and 2048 sectors of 264 bytes each. Each sector is individually addressable through basic serial-clocked commands. The 4-pin SPI serial interface works directly with popular microcontrollers. Special features include: on-chip serial SRAM, byte-level addressing, double-buffered sector writes, transfer/compare sector to SRAM, hardware and software write protection, alternate oscillator frequency, electronic part number, and removable Serial Flash Module package option. Developm e n t is supported with the PC-based Serial Flash Development Kit.
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This document contains PRELIMINARY INFORMATION. NexFlash reserves the right to make changes to its product at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. Copyright 1998, NexFlash Technologies, Inc.
NexFlash Technologies, Inc.
PRELIMINARY NXSF014B-0699
06/11/99
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NX25F011A NX25F041A FUNCTIONAL OVERVIEW
An architectural block diagram of the NX25F011A and NX25F041A is shown in Figure 2. Key elements of the architecture include: ˇ ˇ ˇ ˇ ˇ ˇ SPI Interface and Command Set Logic Serial Flash Memory Array Serial SRAM and Program Buffer Write Protection Logic Configuration and Status Registers Device Information Sector
DEVICE INFORMATION SECTOR (READ ONLY)
ROW DECODE (512 AND 2048 SECTORS)
WRITE PROTECT LOGIC
NexFlash
1 AND 4 MEGABIT SERIAL FLASH MEMORY ARRAY
512 AND 2048 BYTE-ADDRESSABLE SECTORS OF 264 BYTES EACH
WRITE CONTROL LOGIC
16
HOLD OR READ/BUSY LOGIC
CONFIGURATION REGISTER STATUS REGISTER
2112 PROGRAM BUFFER (264 BYTES) 2112 SRAM (264 BYTES) 8 8 8
HIGH-VOLTAGE GENERATORS
SPI COMMAND AND CONTROL LOGIC
SECTOR-ADDRESS LATCH
9/10/11
DATA
COLUMN DECODE, SENSE AMP LATCH AND DATA COMPARE LOGIC
BYTE-ADDRESS LATCH/COUNTER
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Figure 2. NX25F011A and NX25F041A Architectural Block Diagram
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NexFlash Technologies, Inc.
PRELIMINARY NXSF014B-0699
06/11/99
NX25F011A NX25F041A Pin Descriptions
Package The NX25F011A and NX25F041A are available in a 28-pin TSOP (Type I) surface mount package. See Figure 3 and Table 1 for pin assignments. All interface and supply pins ar e on one side of the package. The "No Connect" (NC) pins are not connected to the device, allowing the pads and the area around them to be used for routing PCB system traces. The devices are also available in a cost-effective and space-efficient removable Serial Flash Module package (see NX25Mxxx data sheet). Serial Data Input (SI) The SPI bus Serial Data Input (SI) provides a means for data to be written to (shifted into) the device. Serial Data Output (SO) The SPI bus Serial Data Output (SO) provides a means for data to be read from (shifted out of) the device during a read operation. When the device is deselected (CS=1 or HOLD=0) the SO pin is in a high-impedance state. Serial Clock (SCK) All commands and data written to the Serial Input (SI) are clocked relative to the rising edge of the Serial Clock (SCK). By default all data read from the Serial Data Output (SO) is clocked relative to the falling edge of SCK, allowing compatibility with standard SPI systems. The user may specify reading relative to the rising edge of SCK by changing the setting of the RCE bit in the Configuration Register (see Figure 6). Clock rates of up to 16 MHz for 5V devices and up to 8 MHz for 3V devices are supported. Chip Select (CS) CS The NX25F011A and NX25F041A are selected for operation when the Chip Select input (CS) is asserted low. Upon power-up, an initial low-to-high transition of CS is required before any command sequence will be acknowledged. The device can be deselected to a non-active state when CS is brought high. Once deselected, the SO pin will enter a h ig h - im p e d a n c e state and power consumption will decrease to standby levels unless programming is in process, in which case standby will resume when programming is complete. Write Protect (WP) WP The Write Protect input (WP) works in conjunction with the write protect range set in the configuration register bits. When WP is asserted (active low) the entire Flash memory array is write protected. When high, any Flash memory sector can be written to unless its address is within the write protect range that is set in the configuration register. Hold or Ready/Busy (HOLD or R/B) HOLD B T h i s multi-function pin can serve either as a Hold input (HOLD) or as a Ready-Busy output (R/B). Factory-programmed as a no connect, the pin can be reconfigured as a Ready-Busy output or as a Hold input by setting the configuration register. Warning: this pin is tied low in the Serial Flash Module and must be left as a no connect (NC). Power Supply Pins (Vcc and GND) The NX25F011A and NX25F041A support single power supply Read and Erase/Write operations in 5V and 3V versions. Typical active power is as low as 5 mA for the 3V version with standby current less than 1 ľA.
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Table 1. Pin Descriptions
HOLD-R/B NC WP NC NC VCC GND NC NC NC CS SCK SI SO 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
SI SO SCK CS WP Hold, R/B Vcc GND
Serial Data Input Serial Data Output Serial Clock Input Chip Select Input Write Protect Input Hold Input or Read Busy Output Power Supply Ground
Figure 3. NX25F011A and NX25F041A Pin Assignments, 28-Pin TSOP (Type I)
NexFlash Technologies, Inc.
PRELIMINARY NXSF014B-0699
06/11/99
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