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Part: 1PMT33AT1
Category:
Discrete
-> TVS (Transient Transient Voltage Suppressors)
Description: Zener Transient Voltage Suppressor POWERMITE® Package , Package: Powermite, Pins=2
Company: ON Semiconductor
Datasheet: Download 1PMT33AT1 datasheet File size : 116 kB
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Datasheet text preview:
1PMT5.0AT3 Series
Zener Transient Voltage Suppressor POWERMITE® Package
The 1PMT5.0AT3 Series is designed to protect voltage sensitive components from high voltage, high energy transients. Excellent clamping capability, high surge capability, low zener impedance and fast response time. The advanced packaging technique provides for a highly efficient micro miniature, space saving surface mount with its unique heat sink design. The POWERMITE has the same thermal performance as the SMA while being 50% smaller in footprint area, and delivering one of the lowest height profiles (1.1 mm) in the industry. Because of its small size, it is ideal for use in cellular phones, portable devices, business machines, power supplies and many other industrial/consumer applications.
Specification Features: http://onsemi.com
PLASTIC SURFACE MOUNT ZENER OVERVOLTAGE TRANSIENT SUPPRESSOR 5 58 VOLTS 175 WATT PEAK POWER
· · · · · · · · · · · · ·
Standoff Voltage: 5 58 Volts Peak Power 175 Watts @ 1 ms Maximum Clamp Voltage @ Peak Pulse Current Low Leakage Response Time is Typically 16 kV) per Human Body Model Low Profile Maximum Height of 1.1 mm Integral Heat Sink/Locking Tabs Full Metallic Bottom Eliminates Flux Entrapment Small Footprint Footprint Area of 8.45 mm2 Supplied in 12 mm Tape and Reel 12,000 Units per Reel POWERMITE is JEDEC Registered as DO216AA Cathode Indicated by Polarity Band
1 1: CATHODE 2: ANODE
2
1
2 POWERMITE CASE 457 PLASTIC
MARKING DIAGRAM
D 2 ANODE
Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are
1 CATHODE Mxx xx D
Mxx
readily solderable
MOUNTING POSITION: Any MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
= Specific Device Code = 5 58 = (See Table Next Page) = Date Code
ORDERING INFORMATION
Device 1PMTxxAT3 Package POWERMITE Shipping 12,000/Tape & Reel
LEAD ORIENTATION IN TAPE: Cathode (Short) Lead to Sprocket Holes
© Semiconductor Components Industries, LLC, 2001
1
May, 2001 Rev. 4
Publication Order Number: 1PMT5.0AT3/D
1PMT5.0AT3 Series
MAXIMUM RATINGS
Rating Maximum Ppk Dissipation @ TA = 25°C, (PW10/1000 ms) (Note 1.) Maximum Ppk Dissipation @ TA = 25°C, (PW8/20 ms) (Note 1.) DC Power Dissipation @ TA = 25°C (Note 2.) Derate above 25°C Thermal Resistance from Junction to Ambient Thermal Resistance from Junction to Lead (Anode) Maximum DC Power Dissipation (Note 3.) Thermal Resistance from Junction to Tab (Cathode) Operating and Storage Temperature Range 1. Nonrepetitive current pulse at TA = 25°C. 2. Mounted with recommended minimum pad size, DC board FR4. 3. At Tab (Cathode) temperature, Ttab = 75°C Symbol Ppk Ppk °PD° R J A R J a n o d e °PD° R J c a t h o d e TJ, Tstg Value 175 1000 500 4.0 248 35 3.2 23 55 to +150 Unit W W °mW mW/°C °C/W °C/W W °C/W °C
I IF
ELECTRICAL CHARACTERISTICS (TA = 25°C unless
otherwise noted, VF = 3.5 V Max. @ IF (Note 4.) = 35 A) Symbol IPP VC VRWM IR VBR IT IF VF Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Forward Current Forward Voltage @ IF VC VBR VRWM
IR VF IT
V
IPP
UniDirectional TVS
ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.25 Volts @ 200 mA)
VRWM Device 1PMT5.0AT3 1PMT7.0AT3 1PMT12AT3 1PMT16AT3 1PMT18AT3 1PMT22AT3 1PMT24AT3 1PMT26AT3 1PMT28AT3 1PMT30AT3 1PMT33AT3 1PMT36AT3 1PMT40AT3 1PMT48AT3 1PMT51AT3 Marking MKE MKM MLE MLP MLT MLX MLZ MME MMG MMK MMM MMP MMR MMX MMZ (Note 5.) 5.0 7.0 12 16 18 22 24 26 28 30 33 36 40 48 51 VBR @ IT (V) (Note 6.) Min 6.4 7.78 13.3 17.8 20.0 24.4 26.7 28.9 31.1 33.3 36.7 40.0 44.4 53.3 56.7 Nom 6.7 8.2 14.0 18.75 21.0 25.6 28.1 30.4 32.8 35.1 38.7 42.1 46.8 56.1 59.7 Max 7.0 8.6 14.7 19.7 22.1 26.9 29.5 31.9 34.4 36.8 40.6 44.2 49.1 58.9 62.7 IT (mA) 10 10 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 IR @ VRWM (mA) 800 500 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 VC @ IPP (V) 9.2 12 19.9 26 29.2 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 77.4 82.4 IPP (A) (Note 7.) 19 14.6 8.8 7.0 6.0 4.9 4.5 4.2 3.9 3.6 3.3 3.0 2.7 2.3 2.1
1PMT58AT3 MNG 58 64.4 67.8 71.2 1.0 5.0 93.6 1.9 4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. 5. A transient suppressor is normally selected according to the Working Peak Reverse Voltage (VRWM) which should be equal to or greater than the DC or continuous peak operating voltage level. 6. VBR measured at pulse test current IT at ambient temperature of 25°C. 7. Surge current waveform per Figure 2 and derate per Figure 4.
http://onsemi.com
2
1PMT5.0AT3 Series
TYPICAL PROTECTION CIRCUIT
Zin
Vin
LOAD
VL
10,000 tr PP, PEAK POWER (WATTS) 1000 100 VALUE (%) PEAK VALUE - IRSM
PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr 10 µs
100
50 tP
I HALF VALUE - RSM 2
10
1.0
10
100 tP, PULSE WIDTH (ms)
1000
10,000
0
0
1
2 t, TIME (ms)
3
4
Figure 1. Pulse Rating Curve
Figure 2. 10 X 1000 ms Pulse Waveform
100 90 % OF PEAK PULSE CURRENT 80 70 60 50 40 30 20 10 0 0
PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ T = 25° C A
tr
PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms
160 140 120 100 80 60 40 20 0 0 25 50 75 100 125 150
tP
20
40 t, TIME (ms)
60
80
TA, AMBIENT TEMPERATURE (°C)
Figure 3. 8 X 20 ms Pulse Waveform
Figure 4. Pulse Derating Curve
http://onsemi.com
3
1PMT5.0AT3 Series
P D , MAXIMUM POWER DISSIPATION (W) 1 0.7 0.5 DERATING FACTOR 0.3 0.2 0.1 0.07 0.05 0.03 0.02 10 µs 0.01 0.1 0.2 0.5 1 2 5 10 20 50 100 100 µs PULSE WIDTH 10 ms 3.5 3 2.5 2 TL 1.5 1 0.5 0 25 50 75 100 125 150 175 T, TEMPERATURE (°C)
1 ms
D, DUTY CYCLE (%)
Figure 5. Typical Derating Factor for Duty Cycle
Figure 6. Steady State Power Derating
V F, TYPICAL FORWARD VOLTAGE (VOLTS)
1.2 1.0
10,000
C, CAPACITANCE (pF)
0.8 0.6 0.4 0.2 0 55 25 85 150 T, TEMPERATURE (°C)
1000 MEASURED @ ZERO BIAS
100
MEASURED @ 50% VRWM
10 1 10 WORKING PEAK REVERSE VOLTAGE (VOLTS) 100
Figure 7. Forward Voltage
Figure 8. Capacitance versus Working Peak Reverse Voltage
http://onsemi.com
4
1PMT5.0AT3 Series
TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 9 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems, but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time.
STEP 1 PREHEAT ZONE 1 RAMP" 200°C STEP 2 STEP 3 VENT HEATING SOAK" ZONES 2 & 5 RAMP"
The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints.
STEP 5 HEATING ZONES 4 & 7 SPIKE" 170°C STEP 6 VENT STEP 7 COOLING 205° TO 219°C PEAK AT SOLDER JOINT
STEP 4 HEATING ZONES 3 & 6 SOAK" 160°C
DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150°C
150°C 100°C 100°C DESIRED CURVE FOR LOW MASS ASSEMBLIES 50°C 140°C
SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY)
TIME (3 TO 7 MINUTES TOTAL)
TM A X
Figure 9. Typical Solder Heating Profile
http://onsemi.com
5
Others parts begin by 1p
1P-1 1P-2 1P-3
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