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Details, datasheet, quote on part number:1PMT5923B
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Datasheet text preview:
1PMT5920B Series 3.2 Watt Plastic Surface Mount POWERMITE® Package
This complete new line of 3.2 Watt Zener Diodes are offered in highly efficient micro miniature, space saving surface mount with its unique heat sink design. The POWERMITE package has the same thermal performance as the SMA while being 50% smaller in footprint area and delivering one of the lowest height profiles (1.1 mm) in the industry. Because of its small size, it is ideal for use in cellular phones, portable devices, business machines and many other industrial/consumer applications.
Specification Features: http://onsemi.com
PLASTIC SURFACE MOUNT 3.2 WATT ZENER DIODES 6.2 - 47 VOLTS
· · · · · · · · ·
Zener Breakdown Voltage: 6.2 - 47 Volts DC Power Dissipation: 3.2 Watts with Tab 1 (Cathode) @ 75°C Low Leakage 16 kV) per Human Body Model Low Profile - Maximum Height of 1.1 mm Integral Heat Sink/Locking Tabs Full Metallic Bottom Eliminates Flux Entrapment Small Footprint - Footprint Area of 8.45 mm2 Supplied in 12 mm Tape and Reel T1 = 3,000 Units per Reel T3 = 12,000 Units per Reel · POWERMITE is JEDEC Registered as DO-216AA · Cathode Indicated by Polarity Band
Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are
1 1: CATHODE 2: ANODE
2
1
2 POWERMITE CASE 457 PLASTIC
MARKING DIAGRAM
D 2 ANODE
readily solderable
MOUNTING POSITION: Any MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
1 CATHODE xxB xx D
xxB
260°C for 10 Seconds
= Specific Device Code = 20 - 41 = (See Table Next Page) = Date Code
ORDERING INFORMATION
Device Package Shipping
1PMT59xxBT1 POWERMITE 3,000/Tape & Reel 1PMT59xxBT3 POWERMITE 12,000/Tape & Reel
LEAD ORIENTATION IN TAPE: Cathode (Short) Lead to Sprocket Holes
© Semiconductor Components Industries, LLC, 2003
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July, 2003 - Rev. 0
Publication Order Number: 1PMT5920B/D
1PMT5920B Series
MAXIMUM RATINGS
Rating DC Power Dissipation @ TA = 25°C (Note 1) Derate above 25°C Thermal Resistance from Junction to Ambient Thermal Resistance from Junction to Lead (Anode) Maximum DC Power Dissipation (Note 2) Thermal Resistance from Junction to Tab (Cathode) Operating and Storage Temperature Range 1. Mounted with recommended minimum pad size, PC board FR-4. 2. At Tab (Cathode) temperature, Ttab = 75°C Symbol °PD° Rq J A Rq J a n o d e °PD° Rq J c a t h o d e TJ, Tstg Value 500 4.0 248 35 3.2 23 -55 to +150 Unit °mW mW/°C °C/W °C/W W °C/W °C
ELECTRICAL CHARACTERISTICS (TL = 25°C unless otherwise noted, VF = 1.5 V Max. @ IF = 200 mAdc for all types)
Symbol VZ IZT ZZT IZK ZZK IR VR IF VF Parameter Reverse Zener Voltage @ IZT Reverse Current Maximum Zener Impedance @ IZT Reverse Current Maximum Zener Impedance @ IZK Reverse Leakage Current @ VR Reverse Voltage Forward Current Forward Voltage @ IF VZ VR
I IF
IR VF IZT
V
Zener Voltage Regulator
ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.25 Volts @ 200 mA)
Zener Voltage (Note 3) Device Marking 20B 21B 22B 23B 24B 25B 27B 29B 30B 31B 33B 34B 35B 36B 39B 41B VZ @ IZT (Volts) Min 5.89 6.46 7.12 7.79 8.64 9.5 11.4 14.25 15.2 17.1 20.9 22.8 25.65 28.5 37.05 44.65 Nom 6.2 6.8 7.5 8.2 9.1 10 12 15 16 18 22 24 27 30 39 47 Max 6.51 7.14 7.88 8.61 9.56 10.5 12.6 15.75 16.8 18.9 23.1 25.2 28.35 31.5 40.95 49.35 IZT (mA) 60.5 55.1 50 45.7 41.2 37.5 31.2 25 23.4 20.8 17 15.6 13.9 12.5 9.6 8.0 IR @ VR (mA) 5.0 5.0 5.0 5.0 5.0 5.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 VR (V) 4.0 5.2 6.0 6.5 7.0 8.0 9.1 11.4 12.2 13.7 16.7 18.2 20.6 22.8 29.7 35.8 ZZT @ IZT (Note 4) (W) 2.0 2.5 3.0 3.5 4.0 4.5 6.5 9.0 10 12 17.5 19 23 28 45 67 ZZK @ IZK (Note 4) (W) 200 200 400 400 500 500 550 600 600 650 650 700 700 750 900 1000
IZK (mA) 1.0 1.0 0.5 0.5 0.5 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25
Device 1PMT5920BT1, T3 1PMT5921BT1, T3 1PMT5922BT1, T3 1PMT5923BT1, T3 1PMT5924BT1, T3 1PMT5925BT1, T3 1PMT5927BT1, T3 1PMT5929BT1, T3 1PMT5930BT1, T3 1PMT5931BT1, T3 1PMT5933BT1, T3 1PMT5934BT1, T3 1PMT5935BT1, T3 1PMT5936BT1, T3 1PMT5939BT1, T3 1PMT5941BT1, T3
3. Zener voltage is measured with the device junction in thermal equilibrium with an ambient temperature of 25°C. 4. Zener Impedance Derivation ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for IZ(ac) = 0.1 IZ(dc) with the ac frequency = 60 Hz.
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1PMT5920B Series
TYPICAL CHARACTERISTICS
P D , MAXIMUM POWER DISSIPATION (W) 3.5 3 2.5 2 1.5 1 0.5 0 25 50 75 100 125 150 175 T, TEMPERATURE (°C) 0.1 5 6 7 8 9 10 VZ, ZENER VOLTAGE (VOLTS) 11 TL 100 IZ, ZENER CURRENT (mA)
10
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Figure 1. Steady State Power Derating
qVZ, TEMPERATURE COEFFICIENT (mV/°C) 100 IZ , ZENER CURRENT (mA) 50 30 20 10 5 3 2 1 0.5 0.3 0.2 0.1 0 10 20 30 40 50 60 70 80 VZ, ZENER VOLTAGE (VOLTS) 90 100 10 8 6 4 2 0 -2 -4 2 4 VZ @ IZT
Figure 2. VZ to 10 Volts
6 8 10 VZ, ZENER VOLTAGE (VOLTS)
12
Figure 3. VZ = 12 thru 47 Volts
qVZ, TEMPERATURE COEFFICIENT (mV/°C) 200 ZZ , DYNAMIC IMPEDANCE (OHMS) VZ @ IZT 100 70 50 30 20
Figure 4. Zener Voltage - To 12 Volts
200 IZ(dc) = 1mA 100 70 50 30 20 10 7 5 3 2 5 7 10 mA
20 mA
iZ(rms) = 0.1 IZ(dc) 70 100
10 10 20 30 50 70 100 VZ, ZENER VOLTAGE (VOLTS) 200
10 20 30 50 VZ, ZENER VOLTAGE (VOLTS)
Figure 5. Zener Voltage - 14 To 47 Volts
Figure 6. Effect of Zener Voltage
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1PMT5920B Series
Z Z , DYNAMIC IMPEDANCE (OHMS) 1k 500 200 100 50 20 10 5 2 1 0.5 1 22 V 6.8 V 2 5 10 20 50 100 200 500 IZ, ZENER TEST CURRENT (mA) 12 V TJ = 25°C iZ(rms) = 0.1 IZ(dc)
Figure 7. Effect of Zener Current
10,000
C, CAPACITANCE (pF)
1000 MEASURED @ 0 V BIAS MEASURED @ 50% VR 100
10 1 10 VZ, REVERSE ZENER VOLTAGE (VOLTS) 100
Figure 8. Capacitance versus Reverse Zener Voltage
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1PMT5920B Series
TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 9 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems, but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time.
STEP 1 PREHEAT ZONE 1 RAMP" 200°C STEP 2 STEP 3 VENT HEATING SOAK" ZONES 2 & 5 RAMP"
The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177 -189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints.
STEP 6 VENT STEP 7 COOLING 205° TO 219°C PEAK AT SOLDER JOINT
STEP 4 STEP 5 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 SOAK" SPIKE" 170°C 160°C
DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150°C
150°C 100°C 100°C DESIRED CURVE FOR LOW MASS ASSEMBLIES 50°C 140°C
SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY)
TIME (3 TO 7 MINUTES TOTAL)
TM A X
Figure 9. Typical Solder Heating Profile
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