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Part: BAV99RWT1
Category:
Discrete
-> Diodes & Rectifiers
-> Schottky Diodes
Description: Reverse Dual Diode , Package: SC-70 (SOT-323), Pins=3
Company: ON Semiconductor
Datasheet: Download BAV99RWT1 datasheet File size : 65 kB
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BAV99WT1, BAV99RWT1
Preferred Devices
Dual Series Switching Diodes
The BAV99WT1 is a smaller package, equivalent to the BAV99LT1.
Suggested Applications
· · · · ·
ESD Protection Polarity Reversal Protection Data Line Protection Inductive Load Protection Steering Logic
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ANODE 1 3 CATHODE/ANODE Symbol VR IF IFM(surge) VRRM IF(AV) Value 70 215 500 70 715 Unit Vdc mAdc mAdc V mA 3 CATHODE/ANODE 450 2.0 1.0 0.5 mA A BAV99RWT1 CASE 41902, STYLE 10 SC70/SOT323 BAV99WT1 CASE 41902, STYLE 9 SC70/SOT323 CATHODE 1 ANODE 2 CATHODE 2
MAXIMUM RATINGS (Each Diode)
Rating Reverse Voltage Forward Current Peak Forward Surge Current Repetitive Peak Reverse Voltage Average Rectified Forward Current (Note 1.) (averaged over any 20 ms period) Repetitive Peak Forward Current NonRepetitive Peak Forward Current t = 1.0 ms t = 1.0 ms t = 1.0 S 1. FR5 = 1.0 0.75 0.062 in.
IFRM IFSM
3 1
2
SC70 CASE 419
MARKING DIAGRAM
x7
A7 = BAV99WT1 F7 = BAV99RWT1
ORDERING INFORMATION
Device BAV99WT1 BAV99RWT1 Package SC70 SC70 Shipping 3000/Tape & Reel 3000/Tape & Reel
Preferred devices are recommended choices for future use and best overall value.
© Semiconductor Components Industries, LLC, 2001
1
November, 2001 Rev. 2
Publication Order Number: BAV99WT1/D
BAV99WT1, BAV99RWT1
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation FR5 Board, (Note 1.) TA = 25°C Derate above 25°C Thermal Resistance Junction to Ambient Total Device Dissipation Alumina Substrate, (Note 2.) TA = 25°C Derate above 25°C Thermal Resistance Junction to Ambient Junction and Storage Temperature Symbol PD Max 200 1.6 Rq J A PD 625 300 2.4 Rq J A TJ, Tstg 417 65 to +150 Unit mW mW/°C °C/W mW mW/°C °C/W °C
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Each Diode)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage (I(BR) = 100 µA) Reverse Voltage Leakage Current (VR = 70 Vdc) (VR = 25 Vdc, TJ = 150°C) (VR = 70 Vdc, TJ = 150°C) Diode Capacitance (VR = 0, f = 1.0 MHz) Forward Voltage (IF = 1.0 mAdc) (IF = 10 mAdc) (IF = 50 mAdc) (IF = 150 mAdc) V(BR) IR 70 2.5 30 50 1.5 715 855 1000 1250 6.0 1.75 Vdc mAdc
CD VF
pF mVdc
Reverse Recovery Time (IF = IR = 10 mAdc, iR(REC) = 1.0 mAdc) (Figure 1) RL = 100 W Forward Recovery Voltage (IF = 10 mA, tr = 20 ns) 1. FR5 = 1.0 0.75 0.062 in. 2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.
trr VFR
ns V
820 +10 V 2k 100 µH 0.1 µF DUT 50 OUTPUT PULSE GENERATOR 50 INPUT SAMPLING OSCILLOSCOPE IF 0.1 µF tr 10% tp t IF trr t
90% VR IR INPUT SIGNAL
iR(REC) = 1 mA OUTPUT PULSE (IF = IR = 10 mA; measured at iR(REC) = 1 mA)
Notes: (a) A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: (b) Input pulse is adjusted so IR(peak) is equal to 10 mA. Notes: (c) tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
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BAV99WT1, BAV99RWT1
CURVES APPLICABLE TO EACH DIODE
100 IF, FORWARD CURRENT (mA) I R, REVERSE CURRENT ( µA) 10 TA = 150°C 1.0 TA = 125°C
10 TA = 85°C 1.0 TA = 25°C TA = -40°C 0.1 0.2 0.4 0.6 0.8 1.0 VF, FORWARD VOLTAGE (VOLTS) 1.2
0.1
TA = 85°C TA = 55°C
0.01 TA = 25°C 0 10 20 30 40 VR, REVERSE VOLTAGE (VOLTS) 50
0.001
Figure 2. Forward Voltage
Figure 3. Leakage Current
0.68 CD , DIODE CAPACITANCE (pF)
0.64
0.60
0.56
0.52
0
2
4
6
8
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
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BAV99WT1, BAV99RWT1 INFORMATION FOR USING THE SC70/SOT323 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
0.025 0.65
interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.025 0.65
0.075 1.9 0.035 0.9 0.028 0.7 inches mm
SC70/SOT323 POWER DISSIPATION The power dissipation of the SC70/SOT323 is a function of the pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows.
PD = TJ(max) TA R J A
the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 200 milliwatts.
PD = 150°C 25°C 0.625°C/W = 200 milliwatts
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into
The 0.625°C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 200 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, a higher power dissipation of 300 milliwatts can be achieved using the same footprint.
SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. · Always preheat the device. · The delta temperature between the preheat and soldering should be 100°C or less.* · When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C. 260°C for more than 10 seconds. · When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less. · After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. · Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
· The soldering temperature and time should not exceed
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BAV99WT1, BAV99RWT1
SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 7 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints.
STEP 1 PREHEAT ZONE 1 RAMP" 200°C
STEP 2 STEP 3 VENT HEATING SOAK" ZONES 2 & 5 RAMP"
STEP 5 STEP 4 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 SPIKE" SOAK" 170°C 160°C
STEP 6 STEP 7 VENT COOLING 205° TO 219°C PEAK AT SOLDER JOINT
DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150°C
150°C
100°C 100°C
140°C
SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY)
50°C
DESIRED CURVE FOR LOW MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 5. Typical Solder Heating Profile
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