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Part: DTC114TE
Category:
Discrete
-> Transistors
-> Bipolar
-> General Purpose
-> NPN
-> SOT/Surface Mount
Description: Bias Resistor Transistor NPN
Company: ON Semiconductor
Datasheet: Download DTC114TE datasheet File size : 104 kB
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Datasheet text preview:
ON Semiconductort
Product Preview Bias Resistor Transistor
NPN Silicon Surface Mount Transistor with Monolithic Bias Resistor Network
The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a baseemitter resistor. These digital transistors are designed to replace a single device and its external resistor bias network. The BRT eliminates these individual components by integrating them into a single device. The DTC114YE is housed in the SOT416/SC90 package which is ideal for low power surface mount applications where board space is at a premium.
DTC114YE
3 2 1
CASE 46301, STYLE 1 SOT416/SC90
· · · ·
Simplifies Circuit Design Reduces Board Space Reduces Component Count Available in 8 mm, 7 inch/3000 Unit Tape and Reel.
IN (1)
R1 R2
OUT (3)
R1 = 10 k R2 = 47 k
GND (2)
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Output Voltage Input Voltage Output Current Symbol VO VI IO Value 50 40 100 Unit Vdc Vdc mAdc
DEVICE MARKING
DTC114YE = 69
THERMAL CHARACTERISTICS
Power Dissipation @ TA = 25°C(1) Operating and Storage Temperature Range Junction Temperature PD TJ, Tstg TJ *125 55 to +150 150 mW °C °C
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic Input Off Voltage (VO = 5.0 Vdc, IO = 100 µAdc) Input On Voltage (VO = 0.3 Vdc, IO = 1.0 mAdc) Output On Voltage (IO = 5.0 mAdc, II = 0.25 mAdc) Input Current (VI = 5.0 Vdc) Output Cutoff Current (VO = 50 Vdc) DC Current Gain (VO = 5.0 Vdc, IO = 5.0 mAdc) Input Resistance Resistance Ratio Symbol VI(off) VI(on) VO(on) II IO(off) GI R1 R1/R2 Min -- 1.4 -- -- -- 68 7.0 0.17 Typ -- -- -- -- -- -- 10 0.21 Max 0.3 -- 0.3 0.88 500 -- 13 0.25 Unit Vdc Vdc Vdc mAdc nAdc -- kOhms
1. Device mounted on a FR4 glass epoxy printed circuit board using the minimum recommended footprint.
This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2001
1
March, 2001 Rev. 2
Publication Order Number: DTC114YE/D
DTC114YE
TYPICAL ELECTRICAL CHARACTERISTICS
1 TA = -25°C 25°C 75°C G I , DC CURRENT GAIN (NORMALIZED) VO(on), OUTPUT VOLTAGE (V) IO/II = 10 300 250 200 150 100 50 0 1 2 4 6 8 10 15 20 40 50 60 70 80 IO, OUTPUT CURRENT (mA) 90 100 VO(on) = 10 TA = 75°C 25°C -25°C
0.1
0.01
0.001
0
20
40 60 IO, OUTPUT CURRENT (mA)
80
Figure 1. VO(on) versus IO
Figure 2. GI, DC Current Gain
100 TA = 75°C IO, OUTPUT CURRENT (mA) 25°C V I , INPUT VOLTAGE (VOLTS)
10 VO = 0.2 V TA = -25°C 25°C 75°C
-25°C 10
1
VO = 5 V 1 0 2 4 6 VI, INPUT VOLTAGE (V) 8 10
0.1
0
10
20 30 IO, OUTPUT CURRENT (mA)
40
50
Figure 3. Output Current versus Input Voltage
Figure 4. Input Voltage versus Output Current
4 3.5 Cob , CAPACITANCE (pF) 3 2.5 2 1.5 1 0.5 0 0 2 4 6 8 10 15 20 25 30 35 VR, REVERSE BIAS VOLTAGE (VOLTS) 40 45 50 f = 1 MHz lE = 0 V TA = 25°C
Figure 5. Output Capacitance
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DTC114YE
TYPICAL APPLICATIONS FOR NPN BRTs
+12 V
ISOLATED LOAD
FROM µP OR OTHER LOGIC
Figure 6. Level Shifter: Connects 12 or 24 Volt Circuits to Logic
+12 V
VCC
OUT IN LOAD
Figure 7. Open Collector Inverter: Inverts the Input Signal
Figure 8. Inexpensive, Unregulated Current Source
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DTC114YE
MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.5 min. (3x)
Unit: mm
0.5 min. (3x)
1.4
SOT416/SC90 POWER DISSIPATION The power dissipation of the SOT416/SC90 is a function of the pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows:
PD = TJ(max) TA RJA
the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 125 milliwatts.
PD = 150°C 25°C = 125 milliwatts 1000°C/W
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into
The 1000°C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 125 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, a higher power dissipation can be achieved using the same footprint.
SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. · Always preheat the device. · The delta temperature between the preheat and soldering should be 100°C or less.* · When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C.
· The soldering temperature and time should not exceed
260°C for more than 10 seconds. · When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less. · After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. · Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration.
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TYPICAL SOLDERING PATTERN
ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ
0.5
ÉÉÉ ÉÉÉ ÉÉÉ
DTC114YE
TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 9 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints.
STEP 1 PREHEAT ZONE 1 RAMP" 200°C
STEP 2 STEP 3 VENT HEATING SOAK" ZONES 2 & 5 RAMP"
STEP 5 STEP 4 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 SPIKE" SOAK" 170°C 160°C
STEP 6 STEP 7 VENT COOLING 205° TO 219°C PEAK AT SOLDER JOINT
DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150°C
150°C
100°C 100°C
140°C
SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY)
50°C
DESIRED CURVE FOR LOW MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
TM A X
Figure 9. Typical Solder Heating Profile
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