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Details, datasheet, quote on part number:MTB30P06VT4
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| Part: | MTB30P06VT4 |
| Category: | Discrete => Transistors => FETs (Field Effect Transistors) => MOSFETs => Power MOSFETs |
| Description: | Power MOSFET 30 Amps, 60 Volts, Package: D2PAK, Pins=3 |
| Company: | ON Semiconductor |
| Datasheet: | Download MTB30P06VT4 datasheet File size : 102 kB |
| Request For quote: | Find where to buy MTB30P06VT4
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Datasheet text preview:
MTB30P06V
Preferred Device
Power MOSFET 30 Amps, 60 Volts
PChannel D2PAK
This Power MOSFET is designed to withstand high energy in the avalanche and commutation modes. Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients. · Avalanche Energy Specified · IDSS and VDS(on) Specified at Elevated Temperature
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating DraintoSource Voltage DraintoGate Voltage (RGS = 1.0 M) GatetoSource Voltage Continuous Nonrepetitive (tp 10 ms) Drain Current Continuous @ 25°C Drain Current Continuous @ 100°C Drain Current Single Pulse (tp 10 µs) Total Power Dissipation @ 25°C Derate above 25°C Total Power Dissipation @ TA = 25°C (Note 1.) Operating and Storage Temperature Range Single Pulse DraintoSource Avalanche Energy Starting TJ = 25°C (VDD = 25 Vdc, VGS = 10 Vdc, Peak IL = 30 Apk, L = 1.0 mH, RG = 25 ) Thermal Resistance Junction to Case Junction to Ambient Junction to Ambient (Note 1.) Maximum Lead Temperature for Soldering Purposes, 1/8 from Case for 10 seconds Symbol VDSS VDGR VGS VGSM ID ID IDM PD Value 60 60 ± 15 ± 25 30 19 105 125 0.83 3.0 55 to 175 450 Unit Vdc Vdc Vdc Vpk Adc 4 Apk Watts W/°C 1 2 3 °C mJ D2PAK CASE 418B STYLE 2 G S
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30 AMPERES 60 VOLTS RDS(on) = 80 m
PChannel D
TJ, Tstg EAS
MARKING DIAGRAM & PIN ASSIGNMENT
4 Drain
°C/W RJC RJA RJA TL 1.2 62.5 50 260 °C 1 Gate
MTB30P06V YWW
2 Drain
3 Source
1. When surface mounted to an FR4 board using the minimum recommended pad size.
MTB30P06V Y WW
= Device Code = Year = Work Week
ORDERING INFORMATION
Device MTB30P06V MTB30P06VT4 Package D2PAK D2PAK Shipping 50 Units/Rail 800/Tape & Reel
Preferred devices are recommended choices for future use and best overall value.
© Semiconductor Components Industries, LLC, 2000
1
November, 2000 Rev.2
Publication Order Number: MTB30P06V/D
MTB30P06V
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic OFF CHARACTERISTICS DrainSource Breakdown Voltage (VGS = 0 Vdc, ID = 0.25 mAdc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current (VDS = 60 Vdc, VGS = 0 Vdc) (VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150°C) GateBody Leakage Current (VGS = ± 15 Vdc, VDS = 0 Vdc) ON CHARACTERISTICS (Note 2.) Gate Threshold Voltage (VDS = VGS, ID = 250 µAdc) Threshold Temperature Coefficient (Negative) Static DrainSource OnResistance (VGS = 10 Vdc, ID = 15 Adc) DrainSource OnVoltage (VGS = 10 Vdc, ID = 30 Adc) (VGS = 10 Vdc, ID = 15 Adc, TJ = 150°C) Forward Transconductance (VDS = 8.3 Vdc, ID = 15 Adc) DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Transfer Capacitance SWITCHING CHARACTERISTICS (Note 3.) TurnOn Delay Time Rise Time TurnOff Delay Time Fall Time Gate Charge (See Fi Figure 8) 8) (VDS = 48 Vdc, ID = 30 Adc, VGS = 10 Vdc) (VDD = 30 Vdc, ID = 30 Adc, VGS = 10 Vdc, 10 Vdc RG = 9.1 ) td(on) tr td(off) tf QT Q1 Q2 Q3 SOURCEDRAIN DIODE CHARACTERISTICS Forward OnVoltage (IS = 30 Adc, VGS = 0 Vdc) (IS = 30 Adc, VGS = 0 Vdc, TJ = 150°C) VSD trr (IS = 30 Adc, VGS = 0 Vdc, 30 Adc Vdc dIS/dt = 100 A/µs) Reverse Recovery Stored Charge INTERNAL PACKAGE INDUCTANCE Internal Drain Inductance (Measured from contact screw on tab to center of die) (Measured from the drain lead 0.25 from package to center of die) Internal Source Inductance (Measured from the source lead 0.25 from package to source bond pad) 2. Pulse Test: Pulse Width 300 µs, Duty Cycle 2%. 3. Switching characteristics are independent of operating junction temperature. LD LS 3.5 4.5 7.5 nH nH ta tb Q RR 2.3 1.9 175 107 68 0.965 3.0 µC ns Vdc 14.7 25.9 98 52.4 54 9.0 26 20 30 50 200 100 80 nC ns (VDS = 25 Vd VGS = 0 Vdc, 25 Vdc, Vd f = 1.0 MHz) Ciss Coss Cr s s 1562 524 154 2190 730 310 pF VGS(th) 2.0 RDS(on) VDS(on) gFS 5.0 7.9 2.0 2.9 2.8 Mhos 2.6 5.3 0.067 4.0 0.08 Vdc mV/°C Ohm Vdc V(BR)DSS 60 IDSS IGSS 10 100 100 nAdc 62 Vdc mV/°C µAdc Symbol Min Typ Max Unit
Reverse Recovery Time
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MTB30P06V
TYPICAL ELECTRICAL CHARACTERISTICS
60 I D , DRAIN CURRENT (AMPS) 50 40 30 20 10 0 0 2 4 6 8 10 5V 4V 12 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) 6V 60 8V I D , DRAIN CURRENT (AMPS) 9V 7V 50 40 30 20 10 0 TJ = -55°C
TJ = 25°C VGS = 10V
VDS 10 V
100°C 25°C
0
1
2
3
4
5
6
7
8
VGS, GATE-TO-SOURCE VOLTAGE (VOLTS)
Figure 1. OnRegion Characteristics
R DS(on) , DRAIN-TO-SOURCE RESISTANCE (OHMS) R DS(on) , DRAIN-TO-SOURCE RESISTANCE (OHMS)
Figure 2. Transfer Characteristics
0.12 0.1 0.08 0.06
VGS = 10 V
0.08
TJ = 100°C
TJ = 25°C VGS = 10 V 15 V
0.07
25°C -55°C
0.06
0.04 0.02 0
0.05
0
10
20 30 40 ID, DRAIN CURRENT (AMPS)
50
60
0.04
0
10
20 30 40 ID, DRAIN CURRENT (AMPS)
50
60
Figure 3. OnResistance versus Drain Current and Temperature
1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -50 -25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) 150 175 1 0 VGS = 10 V ID = 15 A I DSS , LEAKAGE (nA) 100
Figure 4. OnResistance versus Drain Current and Gate Voltage
RDS(on) , DRAIN-TO-SOURCE RESISTANCE (NORMALIZED)
VGS = 0 V TJ = 125°C
10
100°C
50 60 10 20 30 40 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
70
Figure 5. OnResistance Variation with Temperature
Figure 6. DrainToSource Leakage Current versus Voltage
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