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Details, datasheet, quote on part number:MTY14N100E
 
 
Part:MTY14N100E
Category:Discrete => Transistors => FETs (Field Effect Transistors) => MOSFETs => Power MOSFETs => N-Channel
Description:N-channel Enhancement-mode Silicon Gate
Company:ON Semiconductor
Datasheet:Download MTY14N100E datasheet   File size : 238 kB
Request For quote:  Find where to buy MTY14N100E
 



Datasheet text preview:
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by MTY14N100E/D
TM Data Sheet TMOS E-FET.TM Power Field Effect Transistor
Designer's
MTY14N100E
Motorola Preferred Device
N­Channel Enhancement­Mode Silicon Gate
This advanced TMOS power FET is designed to withstand high energy in the avalanche and commutation modes. This new energy eff ic ient design also offers a drain­to­source diode with fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters, PWM motor controls, and other inductive loads. The avalanche energy capability is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients. · Avalanche Energy Specified · Diode is Characterized for Use in Bridge Circuits · IDSS and VDS(on) Specified at Elevated Temperature
G S D
TMOS POWER FET 14 AMPERES 1000 VOLTS RDS(on) = 0.80 OHM
®
CASE 340G­02, STYLE 1 TO­264
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating Drain­to­Source Voltage Drain­to­Gate Voltage (RGS = 1.0 M) Gate­to­Source Voltage -- Continuous -- Single Pulse (tp 50 µs) Drain Current -- Continuous -- Continuous @ TC = 100°C -- Single Pulse (tp 10 µs) Total Power Dissipation Derate above 25°C Operating and Storage Temperature Range Single Pulse Drain­to­Source Avalanche Energy -- Starting TJ = 25°C (VDD = 100 Vdc, VGS = 10 Vdc, Peak IL = 14 Apk, L = 10 mH, RG = 25 ) Thermal Resistance -- Junction to Case Thermal Resistance -- Junction to Ambient Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds Symbol VDSS VDGR VGS VGSM ID ID IDM PD TJ, Tstg EAS RJC RJA TL Value 1000 1000 ± 20 ± 40 14 8.7 49 300 2.4 ­ 55 to 150 980 0.42 30 260 Unit Vdc Vdc Vdc Vpk Adc Apk Watts W/°C °C mJ °C/W °C
Designer's Data for "Worst Case" Conditions -- The Designer's Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves -- representing boundaries on device characteristics -- are given to facilitate "worst case" design.
E­FET and Designer's are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
©Motorola TMOS Power MOSFET Transistor Device Data Motorola, Inc. 1996
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MTY14N100E
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic OFF CHARACTERISTICS Drain­to­Source Breakdown Voltage (VGS = 0, ID = 0.250 mAdc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current (VDS = 1000 Vdc, VGS = 0 Vdc) (VDS = 1000 Vdc, VGS = 0 Vdc, TJ = 125°C) Gate­Body Leakage Current (VGS = ± 20 Vdc, VDS = 0 Vdc) ON CHARACTERISTICS (1) Gate Threshold Voltage (VDS = VGS, ID = 0.250 mAdc) Threshold Temperature Coefficient (Negative) Static Drain­Source On­Resistance (VGS = 10 Vdc, ID = 7.0 Adc) Drain­to­Source On­Voltage (VGS = 10 Vdc, ID = 14 Adc) (VGS = 10 Vdc, ID = 7.0 Adc, TJ = 125°C) Forward Transconductance (VDS 15 Vdc, ID = 7.0 Adc) DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance SWITCHING CHARACTERISTICS (2) Turn­On Delay Time Rise Time Turn­Off Delay Time Fall Time Gate Charge (See Figure 8) (VDS = 500 Vdc, ID = 14 Adc, VGS = 10 Vdc) (VDD = 500 Vdc, ID = 14 Adc, VGS = 10 Vdc, RG = 9.1 ) td(on) tr td(off) tf QT Q1 Q2 Q3 SOURCE­DRAIN DIODE CHARACTERISTICS Forward On­Voltage (IS = 14 Adc, VGS = 0 Vdc) (IS = 14 Adc, VGS = 0 Vdc, TJ = 125°C) VSD -- -- trr (IS = 14 Adc, VGS = 0 Vdc, dIS/dt = 100 A/µs) Reverse Recovery Stored Charge INTERNAL PACKAGE INDUCTANCE Internal Drain Inductance (Measured from the drain lead 0.25 from package to center of die) Internal Source Inductance (Measured from the source lead 0.25 from package to source bond pad) (1) Pulse Test: Pulse Width 300 µs, Duty Cycle 2%. (2) Switching characteristics are independent of operating junction temperature. LD -- LS -- 13 -- 4.5 -- nH nH ta tb Q RR -- -- -- -- 1.36 1.26 831 364 467 15.3 1.5 -- -- -- -- -- µC ns Vdc -- -- -- -- -- -- -- -- 49 98 132 83 142 34 46 56 -- -- -- nC ns (VDS = 25 Vdc, VGS = 0 Vdc, f = 1.0 MHz) Ciss Coss Crss -- -- -- 7230 462 61 pF VGS(th) 2.0 -- RDS(on) VDS(on) -- -- gFS 10 12.3 -- 12 13.4 11.8 -- mhos -- 3.3 9.0 0.67 4.0 -- 0.8 Vdc mV/°C Ohm Vdc V(BR)DSS 1000 -- IDSS -- -- IGSS -- -- -- -- 10 100 100 nAdc -- 1.0 -- -- Vdc V/°C µAdc Symbol Min Typ Max Unit
Reverse Recovery Time (See Figure 14)
2
Motorola TMOS Power MOSFET Transistor Device Data
MTY14N100E
TYPICAL ELECTRICAL CHARACTERISTICS
20 18 I D , DRAIN CURRENT (AMPS) 16 14 12 10 8 6 4 2 0 0 2 4 6 8 10 12 14 16 18 20 0 2 3 4 5 6 5V 8V TJ = 25°C VGS = 10 V 6V I D , DRAIN CURRENT (AMPS) 25 20 15 100°C 10 5 30 VDS 10 V TJ = ­55°C
25°C
VDS, DRAIN­TO­SOURCE VOLTAGE (VOLTS)
VGS, GATE­TO­SOURCE VOLTAGE (VOLTS)
Figure 1. On­Region Characteristics
RDS(on) , DRAIN­TO­SOURCE RESISTANCE (OHMS) RDS(on) , DRAIN­TO­SOURCE RESISTANCE (OHMS)
Figure 2. Transfer Characteristics
1.6 VGS = 10 V 1.2 TJ = 100°C
0.85 TJ = 25°C 0.8
0.75 VGS = 10 V 0.7 15 V 0.65 0.6
0.8
25°C
0.4
­55°C
0
0
4
8
12
16
20
24
28
0
4
8
12
16
20
24
28
ID, DRAIN CURRENT (AMPS)
ID, DRAIN CURRENT (AMPS)
Figure 3. On­Resistance versus Drain Current and Temperature
Figure 4. On­Resistance versus Drain Current and Gate Voltage
RDS(on) , DRAIN­TO­SOURCE RESISTANCE (NORMALIZED)
2.5
VGS = 10 V ID = 7 A
100000 VGS = 0 V 10000 I DSS , LEAKAGE (nA) TJ = 125°C 100°C
2.0
1.5
1000
1.0
100
25°C
0.5
10
0 ­ 50
­ 25
0
25
50
75
100
125
150
1
0
100
200
300
400
500
600
700
800
900 1000
TJ, JUNCTION TEMPERATURE (°C)
VDS, DRAIN­TO­SOURCE VOLTAGE (VOLTS)
Figure 5. On­Resistance Variation with Temperature
Figure 6. Drain­To­Source Leakage Current versus Voltage
Motorola TMOS Power MOSFET Transistor Device Data
3