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Details, datasheet, quote on part number:NTHD5903T1
 
 
Part:NTHD5903T1
Category:Discrete => Transistors => FETs (Field Effect Transistors) => MOSFETs => Power MOSFETs
Description:Dual P Channel 2.5 V (G-S) MOSFET, Package: ChipFET, Pins=8
Company:ON Semiconductor
Datasheet:Download NTHD5903T1 datasheet   File size : 59 kB
Request For quote:  Find where to buy NTHD5903T1
 



Datasheet text preview:
NTHD5903T1 Power MOSFET Dual P-Channel ChipFETE
2.1 Amps, 20 Volts
Features
· Low RDS(on) for Higher Efficiency · Logic Level Gate Drive · Miniature ChipFET Surface Mount Package Saves Board Space
Applications
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· Power Management in Portable and Battery­Powered Products; i.e.,
Cellular and Cordless Telephones and PCMCIA Cards
DUAL P­CHANNEL 2.1 AMPS, 20 VOLTS RDS(on) = 155 mW
S1 S2
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Drain­Source Voltage Gate­Source Voltage Continuous Drain Current (TJ = 150°C) (Note 1) TA = 25°C TA = 85°C Pulsed Drain Current Continuous Source Current (Diode Conduction) (Note 1) Maximum Power Dissipation (Note 1) TA = 25°C TA = 85°C Operating Junction and Storage Temperature Range Symbol VDS VGS ID "2.9 "2.1 IDM IS PD 2.1 1.1 TJ, Tstg 1.1 0.6 °C ­1.8 "10 ­0.9 "2.1 "1.5 A A W ChipFET CASE 1206A STYLE 2 5 secs Steady State Unit V V A D1 P­Channel MOSFET D2 P­Channel MOSFET G1 G2
­20 "12
­55 to +150
1. Surface Mounted on 1 x 1 FR4 Board.
PIN CONNECTIONS
MARKING DIAGRAM
1 2 3 4 A7 8 7 6 5
D1 D1 D2 D2
8 7 6 5
1 2 3 4
S1 G1 S2 G2
A7 = Specific Device Code
ORDERING INFORMATION
Device NTHD5903T1 Package ChipFET Shipping 3000/Tape & Reel
© Semiconductor Components Industries, LLC, 2002
1
March, 2002 ­ Rev. 2
Publication Order Number: NTHD5903T1/D
NTHD5903T1
THERMAL CHARACTERISTICS
Characteristic Maximum Junction­to­Ambient (Note 2) t v 5 sec Steady State Maximum Junction­to­Foot (Drain) Steady State Symbol Rt h J A 50 90 Rt h J F 30 60 110 40 °C/W Typ Max Unit °C/W
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic Static Gate Threshold Voltage Gate­Body Leakage Zero Gate Voltage Drain Current VGS(th) IGSS IDSS VDS = VGS, ID = ­250 mA VDS = 0 V, VGS = "12 V VDS = ­16 V, VGS = 0 V VDS = ­16 V, VGS = 0 V, TJ = 85°C On­State Drain Current (Note 3) Drain­Source On­State Resistance (Note 3) ID(on) rD S ( o n ) VDS v ­5.0 V, VGS = ­4.5 V VGS = ­4.5 V, ID = ­2.1 A VGS = ­3.6 V, ID = ­2.0 A VGS = ­2.5 V, ID = ­1.7 A Forward Transconductance (Note 3) Diode Forward Voltage (Note 3) Dynamic (Note 4) Total Gate Charge Gate­Source Charge Gate­Drain Charge Turn­On Delay Time Rise Time Turn­Off Delay Time Fall Time Source­Drain Reverse Recovery Time Qg Qgs Qgd td(on) tr td(off) tf trr IF = ­0.9 A, di/dt = 100 A/ms VDD = ­10 V, RL = 10 W ID ^ ­1.0 A, VGEN = ­4 5 V ­1 0 A ­4.5 V, RG = 6 W VDS = ­10 V VGS = ­4.5 V 10 V, 4 5 V, ID = ­2.1 A ­ ­ ­ ­ ­ ­ ­ ­ 3.0 0.9 0.6 13 35 25 25 40 6.0 ­ ­ 20 55 40 40 80 ns nC gfs VSD VDS = ­10 V, ID = ­2.1 A IS = ­0.9 A, VGS = 0 V ­0.6 ­ ­ ­ ­10 ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ 0.130 0.150 0.215 5.0 ­0.8 ­ "100 ­1.0 ­5.0 ­ 0.155 0.180 0.260 ­ ­1.2 S V A W V nA mA Symbol Test Condition Min Typ Max Unit
2. Surface Mounted on 1 x 1 FR4 Board. 3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%. 4. Guaranteed by design, not subject to production testing.
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NTHD5903T1
TYPICAL ELECTRICAL CHARACTERISTICS
10 VGS = 4 V ­ 10 V ID, DRAIN CURRENT (AMPS) 8 TJ = 25°C 6 3.6 V ID, DRAIN CURRENT (AMPS) 3.4 V 3V 2.8 V 4 VGS = 1.4 V 2 0 0 1 2 3 4 5 6 ­VDS, DRAIN­TO­SOURCE VOLTAGE (VOLTS) 2.6 V 2.4 V 2.2 V 1.8 V 8 25°C 10 125°C
TC = ­55°C
6
4
2 0 0 2 3 4 1 VGS, GATE­TO­SOURCE VOLTAGE (VOLTS) 5
Figure 1. On­Region Characteristics
RDS(on), DRAIN­TO­SOURCE RESISTANCE (W) RDS(on), DRAIN­TO­SOURCE RESISTANCE (W) 4 ID = ­2.1 A TJ = 25°C 3 0.4
Figure 2. Transfer Characteristics
TJ = 25°C 0.35 0.3 VGS = ­2.5 V 0.25 0.2 0.15 0.1 0.05 1 2 3 4 5 6 7 8 9 10 ­ID, DRAIN CURRENT (AMPS) VGS = ­4.5 V
2
VGS = ­3.6 V
1
0 0 1 3 2 4 ­VGS, GATE­TO­SOURCE VOLTAGE (VOLTS) 5
Figure 3. On­Resistance vs. Gate­to­Source Voltage
1.6 RDS(on), DRAIN­TO­SOURCE RESISTANCE (NORMALIZED) ID = ­2.1 A VGS = ­4.5 V 1.4 1.0E­7 IDSS, LEAKAGE (A) 1.0E­6
Figure 4. On­Resistance vs. Drain Current and Gate Voltage
VGS = 0 V TJ = 150°C TJ = 100°C
1.2
1.0E­8 1.0E­9 TJ = 25°C
1
0.8 0.6 ­50
1.0E­10 1.0E­11 ­25 0 25 50 75 100 125 150 0 4 8
12
16
20
TJ, JUNCTION TEMPERATURE (°C)
­VDS, DRAIN­TO­SOURCE VOLTAGE (VOLTS)
Figure 5. On­Resistance Variation with Temperature
Figure 6. Drain­to­Source Leakage Current vs. Voltage
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