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Details, datasheet, quote on part number:NTHD5904T1
 
 
Part:NTHD5904T1
Category:Discrete => Transistors => FETs (Field Effect Transistors) => MOSFETs => Power MOSFETs
Description:Dual N Channel 2.5 V (G-S) MOSFET, Package: ChipFET, Pins=8
Company:ON Semiconductor
Datasheet:Download NTHD5904T1 datasheet   File size : 53 kB
Request For quote:  Find where to buy NTHD5904T1
 



Datasheet text preview:
NTHD5904T1 Power MOSFET Dual N-Channel
3.1 Amps, 20 Volts
Features
· Low RDS(on) for Higher Efficiency · Logic Level Gate Drive · Miniature ChipFETt Surface Mount Package Saves Board Space
Applications
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· Power Management in Portable and Battery­Powered Products; i.e.,
Cellular and Cordless Telephones and PCMCIA Cards
DUAL N­CHANNEL 3.1 AMPS, 20 VOLTS RDS(on) = 75 mW
D1 D2
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Drain­Source Voltage Gate­Source Voltage Continuous Drain Current (TJ = 150°C) (Note 1) TA = 25°C TA = 85°C Pulsed Drain Current Continuous Source Current (Diode Conduction) (Note 1) Maximum Power Dissipation (Note 1) TA = 25°C TA = 85°C Operating Junction and Storage Temperature Range Symbol VDS VGS ID "4.2 "3.0 IDM IS PD 2.1 1.1 TJ, Tstg 1.1 0.6 °C 1.8 "10 0.9 "3.1 "2.2 A A W ChipFET CASE 1206A STYLE 2 5 secs 20 "12 Steady State Unit V V A N­Channel MOSFET N­Channel MOSFET S1 S2 G1 G2
­55 to +150
1. Surface Mounted on 1 x 1 FR4 Board.
PIN CONNECTIONS
MARKING DIAGRAM
1 2 3 4 A1 8 7 6 5
D1 D1 D2 D2
8 7 6 5
1 2 3 4
S1 G1 S2 G2
A1 = Specific Device Code
ORDERING INFORMATION
Device NTHD5904T1 Package ChipFET Shipping 3000/Tape & Reel
© Semiconductor Components Industries, LLC, 2002
1
March, 2002 ­ Rev. 3
Publication Order Number: NTHD5904T1/D
NTHD5904T1
THERMAL CHARACTERISTICS
Characteristic Maximum Junction­to­Ambient (Note 2) t v 5 sec Steady State Maximum Junction­to­Foot (Drain) Steady State Symbol Rt h J A 50 90 Rt h J F 30 60 110 40 °C/W Typ Max Unit °C/W
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic Static Gate Threshold Voltage Gate­Body Leakage Zero Gate Voltage Drain Current VGS(th) IGSS IDSS VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "12 V VDS = 16 V, VGS = 0 V VDS = 16 V, VGS = 0 V, TJ = 85°C On­State Drain Current (Note 3) Drain­Source On­State Resistance (Note 3) ID(on) rD S ( o n ) VDS w 5.0 V, VGS = 4.5 V VGS = 4.5 V, ID = 3.1 A VGS = 2.5 V, ID = 2.3 A Forward Transconductance (Note 3) Diode Forward Voltage (Note 3) Dynamic (Note 4) Total Gate Charge Gate­Source Charge Gate­Drain Charge Turn­On Delay Time Rise Time Turn­Off Delay Time Fall Time Source­Drain Reverse Recovery Time Qg Qgs Qgd td(on) tr td(off) tf trr IF = 0.9 A, di/dt = 100 A/ms VDD = 10 V, RL = 10 W ID ^ 1.0 A, VGEN = 4 5 V 10A 4.5 V, RG = 6 W VDS = 10 V VGS = 4 5 V 10 V, 4.5 V, ID = 3.1 A ­ ­ ­ ­ ­ ­ ­ ­ 4.0 0.6 1.3 12 35 19 9.0 40 6.0 ­ ­ 18 55 30 15 80 ns nC gfs VSD VDS = 10 V, ID = 3.1 A IS = 0.9 A, VGS = 0 V 0.6 ­ ­ ­ 10 ­ ­ ­ ­ ­ ­ ­ ­ ­ 0.065 0.115 8.0 0.8 ­ "100 1.0 5.0 ­ 0.075 0.143 ­ 1.2 S V A W V nA mA Symbol Test Condition Min Typ Max Unit
2. Surface Mounted on 1 x 1 FR4 Board. 3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%. 4. Guaranteed by design, not subject to production testing.
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NTHD5904T1
TYPICAL ELECTRICAL CHARACTERISTICS
10 VGS = 5 thru 3 V 8 ID,Drain Current (A) 2.5 V D,Drain Current (A) 8 10 TC = ­55°C 25°C
6
6
125°C
4 2V 2 1.5 V 0 0 0.5 1.0 1.5 2.0 2.5 VDS, Drain­to­Source Voltage (V) 3.0
4
I 2 0 0
0.5
1.0 1.5 2.0 2.5 3.0 VGS, Gate­to­Source Voltage (V)
3.5
Figure 1. Output Characteristics
Figure 2. Transfer Characteristics
0.30 r DS(on),On­Resistance ( ) 0.25 C, Capacitance (pF) 0.20 0.15 0.10 0.05 0 0 2 4 6 8 10 ID, Drain Current (A) VGS = 2.5 V
600 500 Ci s s 400 300 200 100 0 0 4 8 12 16 VDS, Drain­to­Source Voltage (V) 20 Co s s Crss
VGS = 4.5 V
Figure 3. On­Resistance vs. Drain Current
Figure 4. Capacitance
5 VGS,Gate­to­Source Voltage (V) VDS = 10 V ID = 3.1 A r DS(on),On­Resistance ( ) (Normalized)
1.6 VGS = 4.5 V ID = 3.1 A
4
1.4
3
1.2
2
1.0
1
0.8
0
0
1 2 3 Qg, Total Gate Charge (nC)
4
0.6 ­50
­25
0 25 50 75 100 TJ, Junction Temperature (°C)
125
150
Figure 5. Gate Charge
Figure 6. On­Resistance vs. Junction Temperature
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