Digchip : Database on electronics components
 
Member, Distributor  
Log In
Email:
Password:


Part: NTHS5443T1

Category:
 Discrete
   -> Transistors
     -> FETs (Field Effect Transistors)
       -> MOSFETs
         -> Power MOSFETs

Description: P Channel 2.5 V (G-S) MOSFET, Package: ChipFET, Pins=8

Company: ON Semiconductor

Datasheet: Download NTHS5443T1 datasheet     File size : 624 kB

Request For quote: Find where to buy NTHS5443T1



Datasheet text preview:
NTHS5443T1 Power MOSFET P-Channel ChipFETE
3.6 Amps, 20 Volts
Features
· Low RDS(on) for Higher Efficiency · Logic Level Gate Drive · Miniature ChipFET Surface Mount Package Saves Board Space
Applications
http://onsemi.com
· Power Management in Portable and Battery­Powered Products; i.e.,
Cellular and Cordless Telephones and PCMCIA Cards
3.6 AMPS 20 VOLTS RDS(on) = 65 mW
S
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Drain­Source Voltage Gate­Source Voltage Continuous Drain Current (TJ = 150°C) (Note 1.) TA = 25°C TA = 85°C Pulsed Drain Current Continuous Source Current (Note 1.) Maximum Power Dissipation (Note 1.) TA = 25°C TA = 85°C Operating Junction and Storage Temperature Range Symbol VDS VGS ID "4.9 "3.5 IDM IAS PD 2.5 1.3 TJ, Tstg 1.3 0.7 °C ­2.1 "15 ­1.1 "3.6 "2.6 A A W ChipFET CASE 1206A STYLE 1 5 secs Steady State G Unit V V A P­Channel MOSFET D
­20 "12
­55 to +150
1. Surface Mounted on 1 x 1 FR4 Board.
PIN CONNECTIONS
MARKING DIAGRAM
1 2 3 4 A4 8 7 6 5
D D D S
8 7 6 5
1 2 3 4
D D D G
A4 = Specific Device Code
ORDERING INFORMATION
Device NTHS5443T1 Package ChipFET Shipping 3000/Tape & Reel
© Semiconductor Components Industries, LLC, 2001
1
May, 2001 ­ Rev. 2
Publication Order Number: NTHS5443T1/D
NTHS5443T1
THERMAL CHARACTERISTICS
Characteristic Maximum Junction­to­Ambient (Note 2.) t v 5 sec Steady State Maximum Junction­to­Foot (Drain) Steady State Symbol Rt h J A 40 80 Rt h J F 15 50 95 20 °C/W Typ Max Unit °C/W
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic Static Gate Threshold Voltage Gate­Body Leakage Zero Gate Voltage Drain Current VGS(th) IGSS IDSS VDS = VGS, ID = ­250 µA VDS = 0 V, VGS = "12 V VDS = ­16 V, VGS = 0 V VDS = ­16 V, VGS = 0 V, TJ = 85°C On­State Drain Current (Note 3.) Drain­Source On­State Resistance (Note 3.) ID(on) rD S ( o n ) VDS v ­5.0 V, VGS = ­4.5 V VGS = ­4.5 V, ID = ­3.6 A VGS = ­3.6 V, ID = ­3.3 A VGS = ­2.5 V, ID = ­2.7 A Forward Transconductance (Note 3.) Diode Forward Voltage (Note 3.) Dynamic (Note 4.) Total Gate Charge Gate­Source Charge Gate­Drain Charge Turn­On Delay Time Rise Time Turn­Off Delay Time Fall Time Source­Drain Reverse Recovery Time Qg Qgs Qgd td(on) tr td(off) tf trr IF = ­1.1 A, di/dt = 100 A/µs VDD = ­10 V, RL = 10 ID ^ ­1.0 A, VGEN = ­4 5 V ­1 0 A ­4.5 V, RG = 6 VDS = ­10 V VGS = ­4.5 V 10 V, 4 5 V, ID = ­3.6 A ­ ­ ­ ­ ­ ­ ­ ­ 9.0 2.2 2.2 15 30 50 35 30 14 ­ ­ 25 45 75 50 60 ns ms nC gfs VSD VDS = ­10 V, ID = ­3.6 A IS = ­1.1 A, VGS = 0 V ­0.6 ­ ­ ­ ­15 ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ 0.056 0.065 0.095 10 ­0.8 ­ "100 ­1.0 ­5.0 ­ 0.065 0.074 0.110 ­ ­1.2 S V A V nA µA Symbol Test Condition Min Typ Max Unit
2. Surface Mounted on 1 x 1 FR4 Board. 3. Pulse Test: Pulse Width v 300 µs, Duty Cycle v 2%. 4. Guaranteed by design, not subject to production testing.
http://onsemi.com
2
NTHS5443T1
TYPICAL ELECTRICAL CHARACTERISTICS
10 ­ID, DRAIN CURRENT (AMPS)
­6 V
­2.4 V
10 ­2.2 V ­ID, DRAIN CURRENT (AMPS) TJ = 25°C ­2 V 8 VDS ­10 V
­5 V 8 ­4 V 6 ­3.4 V ­2.8 V ­2.6 V
6
4
­1.8 V ­1.6 V VGS = ­1.4 V
4 125°C 25°C TJ = ­55°C 0.5 1 1.5 2 2.5 3 ­VGS, GATE­TO­SOURCE VOLTAGE (VOLTS)
2 0 0 0.5 1 1.5 2
2 0
2.5
3
­VDS, DRAIN­TO­SOURCE VOLTAGE (VOLTS)
Figure 1. On­Region Characteristics
RDS(on), DRAIN­TO­SOURCE RESISTANCE () RDS(on), DRAIN­TO­SOURCE RESISTANCE () 0.2 ID = ­3.6 A TJ = 25°C 0.15 0.08
Figure 2. Transfer Characteristics
TJ = 25°C
0.06 VGS = ­4.5 V VGS = ­6 V 0.04
0.1
0.05
0 0 1 2 3 4 5 6 ­VGS, GATE­TO­SOURCE VOLTAGE (VOLTS)
0.02 1 2 3 4 5 6 7 8 9 10 ­ID, DRAIN CURRENT (AMPS)
Figure 3. On­Resistance versus Gate­to­Source Voltage
1.6 RDS(on), DRAIN­TO­SOURCE RESISTANCE (NORMALIZED) ID = ­3.6 A VGS = ­4.5 V ­IDSS , LEAKAGE (nA) 1.4 1000 10,000
Figure 4. On­Resistance versus Drain Current and Gate Voltage
VGS = 0 V TJ = 150°C
1.2
1
100 TJ = 100°C
0.8 0.6 ­50
10 ­25 0 25 50 75 100 125 150 0 4 8 12 16 20 TJ, JUNCTION TEMPERATURE (°C) ­VDS, DRAIN­TO­SOURCE VOLTAGE (VOLTS)
Figure 5. On­Resistance Variation with Temperature
Figure 6. Drain­to­Source Leakage Current versus Voltage
http://onsemi.com
3


Others parts begin by nt
NT-1   NT-2   NT-3   NT-4   NT-5   NT-6   NT-7   NT-8   NT-9   NT-10   NT-11   NT-12   NT-13   NT-14   NT-15   NT-16   NT-17   NT-18   NT-19   NT-20   NT-21