|Category||Discrete => Transistors => Bipolar => RETs (Resistor Equipped transistors)|
|Title||RETs (Resistor Equipped transistors)|
|Description||Marking = ;; V<SUB>CEO</SUB>(V) = 20 ;; I<SUB>C</SUB>(A) = 0.7 ;; P<SUB>T</SUB>(W) = 0.01 ;; R<SUB>1</SUB>(kW ) = 1 ;; R<SUB>2</SUB>(kW ) = 0.021 ;; Package = M-A1|
|Company||Panasonic Industrial Company/Electronic Components|
|Datasheet||Download UN1231 datasheet
Parameter Collector to base voltage UNR1231 UNR1231A Symbol VCBO VCEO IC ICP PT* Tj Tstg
UNR1231 Collector to emitter voltage UNR1231A Collector current Peak collector current Total power dissipation Junction temperature Storage temperature
* Printed circuit board: Copper foil area 1cm2 or more and thickness of 1.7mm for the collector portion.
Parameter Collector cutoff current Emitter cutoff current Collector to base voltage UNR1231 UNR1231A
Symbol ICBO ICEO IEBO VCBO VCEO hFE VCE(sat) R1 R1/R2 Conditions VCB = 0 VCE = 0 VEB = 0 VCE 1 0.021 *Pulse measurement V k min typ max 10 0.5 Unit mA V
Forward current transfer ratio Collector to emitter saturation voltage Input resistance Resistance ratioNote) The part numbers in the parenthesis show conventional part number.
High forward current transfer ratio hFE M type mold package Costs can be reduced through downsizing of the equipment and reduction of the number of parts.Copper foil area 1cm2 or more and thickness of 1.7mm for the collector portion.
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(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
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|UN1231A Marking = ;; VCEO(V) = 20 ;; IC(A) = 0.7 ;; PT(W) = 0.01 ;; R1(kW ) = 1 ;; R2(kW ) = 0.021 ;; Package = M-A1|
|UN206 VCEO(V) = 18 ;; IC(A) = 1 ;; PT(W) = 0.5 ;; Package = SO10-G1|
|UN2110 Marking = 6L ;; VCEO(V) = -50 ;; IC(A) = -0.1 ;; PT(W) = 0.2 ;; R1(kW ) = 47 ;; R2(kW ) = ;; Package = Mini3-G1|
|UN2121 Marking = 7A ;; VCEO(V) = -50 ;; IC(A) = -0.5 ;; PT(W) = 0.2 ;; R1(kW ) = 2.2 ;; R2(kW ) = 2.2 ;; Package = Mini3-G1|
|UN2154 Marking = ev ;; VCEO(V) = -30 ;; IC(A) = -0.1 ;; PT(W) = 0.2 ;; R1(kW ) = 10 ;; R2(kW ) = 47 ;; Package = Mini3-G1|
|UN216 VCEO(V) = -10/10 ;; IC(A) = -3/3 ;; PT(W) = 0.5 ;; Package = SO14-G1|
|UN217 VCEO(V) = -10/10 ;; IC(A) = -1/1 ;; PT(W) = 0.5 ;; Package = SO10-G1|
|UN2210 Marking = 8L ;; VCEO(V) = 50 ;; IC(A) = 0.1 ;; PT(W) = 0.2 ;; R1(kW ) = 47 ;; R2(kW ) = ;; Package = Mini3-G1|
|UN222 VCEO(V) = -10/10 ;; IC(A) = -3/3 ;; PT(W) = 0.5 ;; Package = SO14-G1|
|UN2221 Marking = 9A ;; VCEO(V) = 50 ;; IC(A) = 0.5 ;; PT(W) = 0.2 ;; R1(kW ) = 2.2 ;; R2(kW ) = 2.2 ;; Package = Mini3-G1|
|UN2225 Marking = FZ ;; VCEO(V) = 20 ;; IC(A) = 0.6 ;; PT(W) = 0.2 ;; R1(kW ) = 10 ;; R2(kW ) = ;; Package = Mini3-G1|
|UN225 VCEO(V) = -10/10 ;; IC(A) = -0.5/0.5 ;; PT(W) = 0.5 ;; Package = SO16-G1|
|UN227 VCEO(V) = -10/10 ;; IC(A) = -1.5/1.5 ;; PT(W) = 0.5 ;; Package = SO16-G1|
|UN228 VCEO(V) = -10/10 ;; IC(A) = -1/1 ;; PT(W) = 0.5 ;; Package = SO10-G1|
|UN230 VCEO(V) = -10/10 ;; IC(A) = -3/3 ;; PT(W) = 0.5 ;; Package = SO10-G1|
|UN4110 Marking = ;; VCEO(V) = -50 ;; IC(A) = -0.1 ;; PT(W) = 0.3 ;; R1(kW ) = 47 ;; R2(kW ) = ;; Package = NS-A1NS-B1|
|UN4121 Marking = ;; VCEO(V) = -50 ;; IC(A) = -0.5 ;; PT(W) = 0.3 ;; R1(kW ) = 2.2 ;; R2(kW ) = 2.2 ;; Package = NS-A1NS-B1|
|UN4210 Marking = ;; VCEO(V) = 50 ;; IC(A) = 0.1 ;; PT(W) = 0.3 ;; R1(kW ) = 47 ;; R2(kW ) = ;; Package = NS-A1NS-B1|
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