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Details, datasheet, quote on part number:1N4007ID/EB
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Datasheet text preview:
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D119
1N4001ID to 1N4007ID Rectifiers
Product specification Supersedes data of April 1992 1996 Jun 10
Philips Semiconductors
Product specification
Rectifiers
FEATURES · Glass passivated · High maximum operating temperature · Low leakage current · Excellent stability · Available in ammo-pack.
handbook, 4 columns
1N4001ID to 1N4007ID
DESCRIPTION Cavity free cylindrical glass package through ImplotecTM(1) technology.
(1) Implotec is a trademark of Philips.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
k
a
MAM123
Fig.1 Simplified outline (SOD81) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM PARAMETER repetitive peak reverse voltage 1N4001ID 1N4002ID 1N4003ID 1N4004ID 1N4005ID 1N4006ID 1N4007ID VR continuous reverse voltage 1N4001ID 1N4002ID 1N4003ID 1N4004ID 1N4005ID 1N4006ID 1N4007ID IF(AV) average forward current averaged over any 20 ms period; Tamb = 75 °C; see Fig.2 averaged over any 20 ms period; Tamb = 100 °C; see Fig.2 IFRM IFSM Tstg Tj repetitive peak forward current non-repetitive peak forward current storage temperature junction temperature half sinewave; 60 Hz - - - - - - - - - - - -65 -65 50 100 200 400 600 800 1 000 V V V V V V V - - - - - - - 50 100 200 400 600 800 1 000 V V V V V V V CONDITIONS MIN. MAX. UNIT
1.00 A 0.75 A 10 20 +175 +175 A A °C °C
1996 Jun 10
2
Philips Semiconductors
Product specification
Rectifiers
ELECTRICAL CHARACTERISTICS Tj = 25 °C; unless otherwise specified. SYMBOL VF VF(AV) IR IR(AV) PARAMETER forward voltage full-cycle average forward voltage reverse current full-cycle average reverse current IF(AV) = 1 A VR = VRmax VR = VRmax; Tamb = 100 °C
1N4001ID to 1N4007ID
CONDITIONS IF = 1 A; see see Fig.3
MAX. 1.1 0.8 10 50 30 V V
UNIT
µA µA µA
VR = VRRMmax; Tamb = 75 °C
THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 40 µm, see Fig.4. For more information please refer to the "General Part of associated Handbook". PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS lead length = 10 mm VALUE 60 120 UNIT K/W K/W
1996 Jun 10
3
Philips Semiconductors
Product specification
Rectifiers
GRAPHICAL DATA
1N4001ID to 1N4007ID
handbook, halfpage
1.5
MBH386
handbook, halfpage
10
MBH385
IF (A) 1
IF (A)
1
0.5
(1) (2) (3)
0 0 100 Tamb (°C) 200
10-1 0 0.5 1 VF (V) 1.5
(1) Tamb = 100 °C. (2) Tamb = 20 °C. (3) Tamb = -50 °C.
Fig.2
Maximum forward current as a function of ambient temperature.
Fig.3
Forward current as a function of forward voltage; typical values.
handbook, halfpage
50 25
7 50
2 3
MGA200
Dimensions in mm.
Fig.4 Device mounted on a printed-circuit board.
1996 Jun 10
4
Philips Semiconductors
Product specification
Rectifiers
PACKAGE OUTLINE
1N4001ID to 1N4007ID
handbook, full pagewidth
5 max 0.81 max 2.15 max
MBC051
28 min
3.8 max
28 min
Dimensions in mm.
Fig.5 SOD81.
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1996 Jun 10
5
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