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Details, datasheet, quote on part number:74AVC16835DGG
 
 
Part:74AVC16835DGG
Category:Logic => Buffers/Inverters => 3-State
Description:18-bit Registered Driver 3-state
Company:Philips Semiconductors
Datasheet:Download 74AVC16835DGG datasheet   File size : 92 kB
Request For quote:  Find where to buy 74AVC16835DGG
 



Datasheet text preview:
INTEGRATED CIRCUITS

74AVC16835 18-bit registered driver (3-State)
Preliminary specification
Replaces datasheet 74AVC16835/74AVCH16835 dated 1998 Dec 07

1999 Jul 23

Philips Semiconductors

Philips Semiconductors

Preliminary specification

18-bit Registered Driver (3-State)

74AVC16835

FEATURES

· Wide supply voltage range of 1.2 V to 3.6 V · Complies with JEDEC standard no. 8-1A/5/7. · CMOS low power consumption · Input/output tolerant up to 3.6 V · DCO (Dynamic Controlled Output) circuit dynamically changes
output impedance, resulting in noise reduction without speed degradation

PIN CONFIGURATION
NC NC Y0 GND Y1 Y2 VCC Y3 Y4 Y5 GND Y6 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 GND NC A0 GND A1 A2 VCC A3 A4 A5 GND A6 A7 A8 A9 A10 A11 GND A12 A13 A14 VCC A15 A16 GND A17 CP GND

· Low inductance multiple VCC and GND pins for minimum noise
and ground bounce

· Power off disables 74AVC16835 outputs, permitting Live Insertion
DESCRIPTION
The 74AVC16835 is a 18-bit universal bus driver. Data flow is controlled by output enable (OE), latch enable (LE) and clock inputs (CP). This product is designed to have an extremely fast propagation delay and a minimum amount of power consumption. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor (Live Insertion). A Dynamic Controlled Output (DCO) circuitry is implemented to support termination line drive during transient. See the graphs on page 8 for typical curves.

Y7 Y8 Y9 Y10 Y11 GND Y12 Y13 Y14 VCC Y15 Y16 GND Y17 OE LE

SH00130

QUICK REFERENCE DATA
GND = 0 V; Tamb = 25°C; tr = tf 2.0 ns; CL = 30 pF. PARAMETER SYMBOL tPHL/tPLH Propagation delay An to Yn Propagation delay LE to Yn; CP to Yn Input capacitance Power dissipation capacitance per buffer dissi ca er buffer VI = GND to VCC1 GND to Outputs enabled Output disabled VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V CONDITIONS TYPICAL 2.6 2.0 1.7 2.8 2.2 1.8 5.0 25 6 UNIT ns

tPHL/tPLH CI CP D

ns pF pF

NOTES: 1. CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi + S (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in V; S (CL × VCC2 × fo) = sum of outputs.

ORDERING INFORMATION
PACKAGES 56-Pin Plastic Thin Shrink Small Outline (TSSOP) Type II TEMPERATURE RANGE ­40°C to +85°C ORDER CODE 74AVC16835 DGG DRAWING NUMBER SOT364-1

1999 Jul 23

2

Philips Semiconductors

Preliminary specification

18-bit Registered Driver (3-State)

74AVC16835

PIN DESCRIPTION
PIN NUMBER 1, 2, 55 3, 5, 6, 8, 9, 10, 12, 13, 14, 15, 16, 17, 19, 20, 21, 23, 24, 26 4, 11, 18, 25, 32, 39, 46, 53, 56 7, 22, 35, 50 27 28 30 54, 52, 51, 49, 48, 47, 45, 44, 43, 42, 41, 40, 38, 37, 36, 34, 33, 31 SYMBOL NC Y0 to Y17 NAME AND FUNCTION No connection Data outputs

LOGIC SYMBOL (IEEE/IEC)
OE CP LE 27 30 28 C3 G2 EN1 2C3

GND VCC OE LE CP A0 to A17

Ground (0V) Positive supply voltage Output enable input (active LOW) Latch enable input (active HIGH) Clock input Data inputs

Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 Y11

3 5 6 8 9 10 12 13 14 15 16 17 19 20 21 23 24 26 1 1 3D

54 52 51 49 48 47 45 44 43 42 41 40 38 37 36 34 33 31

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17

LOGIC SYMBOL

Y12 Y13 Y14

OE

Y15 Y16

CP

Y17

SH00154
LE

A0

FUNCTION TABLE
D LE CP Y0

INPUTS OE H L L L L
SH00138

LE X H H L L L L

CP X X X H L

A X L H L H X X

OUTPUTS Z L H L H Y01 Y02

TO THE 17 OTHER CHANNELS

L L H L X Z = = = = =

HIGH voltage level LOW voltage level Don't care High impedance "off" state LOW-to-HIGH level transition

NOTES: 1. Output level before the indicated steady-state input conditions were established, provided that CP is high before LE goes low. 2. Output level before the indicated steady-state input conditions were established.

1999 Jul 23

3

Philips Semiconductors

Preliminary specification

18-bit Registered Driver (3-State)

74AVC16835

168-pin SDR SDRAM DIMM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM

BACK SIDE

SDRAM

SDRAM

SDRAM

SDRAM

SDRAM

SDRAM

SDRAM

SDRAM

FRONT SIDE AVC16835 AVC16835 AVC16835 PCK2509S or PCK2510S

The PLL clock distribution device and AVC registered drivers reduce signal loads on the memory controller and prevent timing delays and waveform distortions that would cause unreliable operation

RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER DC supply voltage (according to JEDEC Low Voltage Standards) VCC DC supply voltage (for low voltage applications) VI VO Tamb tr, tf DC Input voltage range DC output voltage range; output 3-State DC output voltage range; output HIGH or LOW state Operating free-air temperature range Input rise and fall times VCC = 1.65 to 2.3 V VCC = 2.3 to 3.0 V VCC = 3.0 to 3.6 V CONDITIONS MIN 1.65 2.3 3.0 1.2 0 0 0 ­40 0 0 0 MAX 1.95 2.7 3.6 3.6 3.6 3.6 V VCC +85 30 20 10 °C ns/V V UNIT

SDRAM

SW00408

V

1999 Jul 23

4

Philips Semiconductors

Preliminary specification

18-bit Registered Driver (3-State)

74AVC16835

ABSOLUTE MAXIMUM RATINGS
In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V) SYMBOL PARAMETER VCC IIK VI IOK VO VO IO IGND, ICC Tstg PTOT DC supply voltage DC input diode current DC input voltage DC output diode current DC output voltage; output 3-State DC output voltage; output HIGH or LOW state DC output source or sink current DC VCC or GND current Storage temperature range Power dissipation per package ­plastic thin-medium-shrink (TSSOP) For temperature range: ­40 to +125 °C above +55°C derate linearly with 8 mW/K VI t0 For all inputs1 VO uVCC or VO t 0 Note 1 Note 1 VO = 0 to VCC CONDITIONS RATING ­0.5 to +4.6 ­50 ­0.5 to 4.6 "50 ­0.5 to 4.6 ­0.5 to VCC +0.5 "50 "100 ­65 to +150 600 UNIT V mA V mA V V mA mA °C mW

NOTE: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V). LIMITS SYMBOL PARAMETER VCC = 1.2 V VIH HIGH level Input voltage level In voltage VCC = 1.65 to 1.95 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 1.2 V VIL LOW level Input voltage level In voltage VCC = 1.65 to 1.95 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 1.65 to 3.6 V; VI = VIH or VIL; IO = ­100 µA VOH HIGH level output voltage VCC = 1.65 V; VI = VIH or VIL; IO = ­4 mA VCC = 2.3 V; VI = VIH or VIL; IO = ­8 mA VCC = 3.0 V; VI = VIH or VIL; IO = ­12 mA VCC = 1.65 to 3.6 V; VI = VIH or VIL; IO = 100 µA VOL LOW level output voltage VCC = 1.65 V; VI = VIH or VIL; IO = 4 mA VCC = 2.3 V; VI = VIH or VIL; IO = 8 mA VCC = 3.0 V; VI = VIH or VIL; IO = 12 mA II IOFF IIHZ/IILZ IOZ Input leakage current g 3-State output OFF-state current 3-State output OFF-state current VCC = 1.65 to 3.6 V; 1 65 to 3 6 VI = VCC or GND or GND VCC = 0 V; VI or VO = 3.6 V VCC = 1.65 to 3.6 V; VI = VCC or GND VCC = 1.65 to 2.7 V; VI = VIH or VIL; VO = VCC or GND VCC = 3.0 to 3.6 V; VI = VIH or VIL; VO = VCC or GND VCC = 1.65 to 2.7 V; VI = VCC or GND; IO = 0 VCC = 3.0 to 3.6 V; VI = VCC or GND; IO = 0 TEST CONDITIONS Temp = -40°C to +85°C MIN VCC 0.65VCC 1.7 2.0 ­ ­ ­ ­ VCC*0.20 VCC*0.45 VCC*0.55 VCC*0.70 ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ TYP1 ­ 0.9 1.2 1.5 ­ 0.9 1.2 1.5 VCC VCC*0.10 VCC*0.28 VCC*0.32 GND 0.10 0.26 0.36 0.1 0.1 0.1 0.1 0.1 0.1 0.2 MAX ­ ­ ­ ­ GND 0.35VCC 0.7 0.8 ­ ­ ­ ­ 0.20 0.45 0.55 0.70 2.5 "10 12.5 5 µA 10 20 40 µA µA µA µA V V V V UNIT

out OFF-state current 3-State output OFF-state current

ICC

Quiescent supply current su current

NOTES: 1. All typical values are at Tamb = 25°C. 1999 Jul 23 5