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Part: 74LVC1GX04GW
Category:
Logic
-> Buffers/Drivers
Description: The 74LVC1GX04 is a High-performance, Low-power, Low-voltage, Si-gate CMOS Device And Superior to MOSt Advanced CMOS Compatible TTL Families. <<<>>>Features Wide Supply Voltage Range From 1.65 to 5.5 V <<<>>>5 V Tolerant Input And a 5 V Overvoltage Tolerant Powered Down Output. <<<>>>High Noise Immunity <<<>>>Complies With Jedec Standard: <<<>>>JESD8-7 (1.65 to 1.95 V) <<<>>>JESD8-5 (2.3 to 2.7 V) <<<>>>JESD8B/JESD36 (2.7 to 3.6 V). <<<>>>+-24 ma Output Drive (VCC = 3.0 V) <<<>>>CMOS Low Power Consumption <<<>>>Latch-up Performance Exceeds 250 ma <<<>>>Direct Interface With TTL Levels <<<>>>SOT363 And SOT457 Package <<<>>>ESD Protection: <<<>>>HBM EIA/JESD22-A114-A Exceeds 2000 V <<<>>>MM EIA/JESD22-A115-A Exceeds 200 V. <<<>>>Specified From -40 to +85 Cel And -40 to +125 Cel.
Company: Philips Semiconductors
Datasheet: Download 74LVC1GX04GW datasheet File size : 132 kB
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INTEGRATED CIRCUITS
DATA SHEET
74LVC1GX04 X-tal driver
Product specification 2003 Aug 13
Philips Semiconductors
Product specification
X-tal driver
FEATURES · Wide supply voltage range from 1.65 to 5.5 V · 5 V tolerant input and a 5 V overvoltage tolerant powered down output. · High noise immunity · Complies with JEDEC standard: JESD8-7 (1.65 to 1.95 V) JESD8-5 (2.3 to 2.7 V) JESD8B/JESD36 (2.7 to 3.6 V). · ±24 mA output drive (VCC = 3.0 V) · CMOS low power consumption · Latch-up performance exceeds 250 mA · Direct interface with TTL levels · SOT363 and SOT457 package · ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. · Specified from -40 to +85 °C and -40 to +125 °C. DESCRIPTION
74LVC1GX04
The 74LVC1GX04 is a high-performance, low-power, low-voltage, Si-gate CMOS device and superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3 or 5 V devices. This feature allows the use of this device as translator in a mixed 3.3 and 5 V environment. This device is fully specified for partial power-down applications using Ioff at output Y. The Ioff circuitry disables the output Y, preventing the damaging backflow current through the device when it is powered down. The 74LVC1GX04 combines the functions of the 74LVC1GU04 and 74LVC1G04 to provide a device optimized for use in crystal oscillator applications. The integration of the two devices into the 74LVC1GX04 produces the benefits of a compact footprint, lower power dissipation and stable operation over a wide range of frequency and temperature.
2003 Aug 13
2
Philips Semiconductors
Product specification
X-tal driver
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C. SYMBOL tPHL/tPLH PARAMETER propagation delay input X1 to output X2 CONDITIONS VCC = 1.8 V; CL = 30 pF; RL = 1 k VCC = 2.5 V; CL = 30 pF; RL = 500 VCC = 2.7 V; CL = 50 pF; RL = 500 VCC = 3.3 V; CL = 50 pF; RL = 500 VCC = 5.0 V; CL = 50 pF; RL = 500 propagation delay input X1 to output Y VCC = 1.8 V; CL = 30 pF; RL = 1 k VCC = 2.5 V; CL = 30 pF; RL = 500 VCC = 2.7 V; CL = 50 pF; RL = 500 VCC = 3.3 V; CL = 50 pF; RL = 500 VCC = 5.0 V; CL = 50 pF; RL = 500 CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; (CL × VCC2 × fo) = sum of outputs. 2. The condition is VI = GND to VCC. FUNCTION TABLE See note 1. INPUT X1 H L Note 1. H = HIGH voltage level; L = LOW voltage level. X2 L H OUTPUT input capacitance power dissipation capacitance per buffer output enabled; notes 1 and 2
74LVC1GX04
TYPICAL 2.1 1.7 2.5 2.1 1.6 4.4 2.9 3.0 2.8 2.3 5 35
UNIT ns ns ns ns ns ns ns ns ns ns pF pF
Y H L
2003 Aug 13
3
Philips Semiconductors
Product specification
X-tal driver
ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE 74LVC1GX04GW 74LVC1GX04GV PINNING PIN 1 2 3 4 5 6 n.c. GND X1 X2 VCC Y SYMBOL not connected ground (0 V) data input data output supply voltage data output DESCRIPTION -40 to +125 °C -40 to +125 °C PINS 6 6 PACKAGE MATERIAL TSSOP6 TSSOP6 plastic plastic
74LVC1GX04
CODE SOT363 SOT457
MARKING VX VX4
handbook, halfpage
handbook, halfpage
n.c. 1 GND 2 X1 3
MNB097
6Y
Y
6
X04
5 VCC 4 X2 3 X1 X2 4
MNB098
Fig.1 Pin configuration.
Fig.2 Logic symbol.
2003 Aug 13
4
Philips Semiconductors
Product specification
X-tal driver
RECOMMENDED OPERATING CONDITIONS SYMBOL VCC VI VO PARAMETER supply voltage input voltage output voltage note 2 active mode Power-down mode; VCC = 0 V Tamb tr, tf operating ambient temperature input rise and fall times VCC = 1.65 to 2.7 V VCC = 2.7 to 5.5 V Notes 1. For use of a regular crystal oscillator, the recommended minimum VCC should be 2.0 V. 2. Only for output Y. 0 0 -40 0 0 note 1 CONDITIONS 0 MIN. 1.65
74LVC1GX04
MAX. 5.5 5.5 VCC 5.5 +125 20 10 V V V V
UNIT
°C ns/V ns/V
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO IO ICC, IGND Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. PARAMETER supply voltage input diode current input voltage output diode current output voltage output source or sink current VCC or GND current storage temperature power dissipation Tamb = -40 to +125 °C VI VCC or VO < 0 active mode; notes 1 and 2 VO = 0 to VCC CONDITIONS - -0.5 - -0.5 - - -65 - MIN. -0.5 MAX. +6.5 -50 +6.5 ±50 +6.5 ±50 ±100 +150 300 V mA V mA V mA mA °C mW UNIT
VCC + 0.5 V
Power-down mode; notes 1 and 2 -0.5
2003 Aug 13
5
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