|Category||RF & Microwaves => RFID (RF Identification Device)|
|Description||MIFARE Ultralight C
NXP Semiconductors has developed MIFARE MF0ICU2 - MIFARE Ultralight C - to be used with Proximity Coupling Devices (PCD) according to ISO/IEC 14443A (see Ref. 1 \"ISO/IEC\"). The communication layer (MIFARE RF Interface) complies to parts 2 and 3 of the ISO/IEC 14443A standard. The MF0ICU2 is primarily designed for limited use applications such as public transportation, event ticketing and NFC Forum Tag Type 2 applications.
|Company||Philips Semiconductors (Acquired by NXP)|
|Datasheet||Download MF0ICU2 datasheet
|Rev. 3.2 19 May 2009 171432 Product short data sheet PUBLIC
NXP Semiconductors has developed MIFARE MF0ICU2 - MIFARE Ultralight to be used with Proximity Coupling Devices (PCD) according to ISO/IEC 14443A (see Ref. 1 "ISO/IEC"). The communication layer (MIFARE RF Interface) complies to parts 2 and 3 of the ISO/IEC 14443A standard. The MF0ICU2 is primarily designed for limited use applications such as public transportation, event ticketing and NFC Forum Tag Type 2 applications.
In the MIFARE system, the MF0ICU2 is connected to a coil with a few turns. The MF0ICU2 fits for the TFC.0 (Edmonson) and TFC.1 ticket formats as defined 753-2. TFC.1 ticket formats are supported by the MF0xxU20 chip featuring an on-chip resonance capacitor of 16.9 pF. The smaller TFC.0 tickets are supported by the MFxxU21 chip holding an on-chip resonance capacitor of 50 pF. When the ticket is positioned in the proximity of the coupling device (PCD) antenna, the high speed RF communication interface allows the transmission of the data with a baud rate of 106 kbit/s.
An intelligent anticollision function according to ISO/IEC 14443 allows to operate more than one card in the field simultaneously. The anticollision algorithm selects each card individually and ensures that the execution of a transaction with a selected card is performed correctly without data corruption resulting from other cards in the field.
The anticollision function is based an IC individual serial number called Unique IDentification. The UID of the is 7 bytes long and supports cascade level 2 according to ISO/IEC 14443-3.
3DES Authentication Anti-cloning support by unique 7-byte serial number for each device 32-bit user programmable OTP area Field programmable read-only locking function per page for first 512-bit Read-only locking per block for rest of memory
I Contactless transmission of data and supply energy (no battery needed) I Operating distance: 100 mm (depending on field strength and antenna geometry) I Operating frequency: 13.56 MHz I Fast data transfer: 106 kbit/s I High data integrity: 16-bit CRC, parity, bit coding, bit counting I True anticollision I 7-byte serial number (cascade level 2 according to ISO/IEC 14443-3) I Typical ticketing transaction: ms I Fast counter transaction: 10 ms
1536-bit total memory 1184-bit user memory 36 pages user r/w area 512-bit compatible to MF0ICU1 Field programmable read-only locking function per page for first 512-bit Field programmable read-only locking function per block 32-bit user definable One-Time Programmable (OTP) area 16-bit counter Data retention of 5 years Write endurance 10000 cycles
Public transport Event ticketing Prepaid applications Loyalty schemes NFC Forum Tag Type 2 Toy and amusement
Table 1. Symbol fi Ci Quick reference data Parameter input frequency input capacitance 17 pF version (bare silicon and 50 pF version EEPROM characteristics tcy(W) tret Nendu(W)write cycle time retention time write endurance Tamb 22 °C Tamb 22 °C
Stresses above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only. Operation of the device at these or any other conditions above those given in the Characteristics section of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. LCR meter HP 4285, Tamb = 22 °C, Cp-D, = 13.56 MHz, 2 Veff.
Description 8 inch wafer (sawn, laser diced; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECSII format) 8 inch wafer (sawn, laser diced; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECSII format) tape
PLLMC plastic leadless module carrier package; 35 mm wide tape PLLMC plastic leadless module carrier package; 35 mm wide
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