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Details, datasheet, quote on part number:2DEA-2-Q24R
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Datasheet text preview:
Features
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0 DEA 24Q 02
Applications
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s s s
Supports 15 KV IEC 61000-4-2 ESD equipment specification Single device protects as many as 20 lines on exposed pins, communications ports Incorporates 40 bi-directional PN junction diodes Small form factor replaces 20 SOT23 packages
Parallel printer ports, communication ports Hot-swappable designs IC protection
General Information
The Model 2DEA Series is well-suited for space constrained designs where the requirements of international ESD standard specification IEC 61000-4-2 must be met. These highly integrated PN junction diode arrays are especially effective for use in PC notebooks and motherboards, engineering workstations and portable battery-powered devices such as PDAs and cellular phones. Space savings, as compared to popular BAV99 SOT23 based implementations, can yield a 75 % reduction in utilized board area. In addition, significant assembly cost reductions and manufacturing integrity improvements can be realized. Two package options are available. Model 2DEA consists of 20 bi-directional diode pairs in a miniature 24-pin JEDEC QSOP package. The 2DEB consists of 17 bi-directional diode pairs in a traditional wide-body SOIC JEDEC package.
Electrical Specifications
Supply Voltage (VDD - VSS) ..........-0.3 V to +12 V Voltage @ Any Channel (Vin) ...-0.3 V to (VDD+0.5) VSS = GND Channel Clamp Current (lc) (Continuous) .......±15 mA max. Forward Voltage (Vf) @ lf = 1 mA.....0.8 V typ., 0.9 V max. @ lf =12 mA ......1.5 V max. Leakage Current @ VSS < Vin < VDD = 12 V ......0.1 µA typ. @ VSS < Vin < VDD = 12 V .....10 µA max. Diode Capacitance ....5 pF max. Diode Power Rating ......20 mW/diode Power Dissipation @ 25 °C....100 mw ESD Protection..15 KV per IEC 61000-4-2 human body test method
Environmental Specifications Operating Temperature.-55 °C to +125 °C Storage Temp. Range...-65 °C to +150 °C Physical Specifications Standard Packages and Pin Counts QSOP ............24 Pin Wide-Body SOIC ...20 Pin
Dispensing QSOP .....3,500 pcs./13 " reel 56 pcs./tube Wide-Body SOIC......3,500 pcs./13 " reel 37 pcs./tube
Note: IEC 61000-4-2 ESD test performance is measured at the systems level and system designs, enclosure shielding and other conventional ESD control measures usually influence the results of these tests. Testing on the component level serves as an indicator that the system passes a specific compliance step, but does not ensure that the system passes at that level. The Model 2DEA/DEB device, therefore, can support successful implementation of the IEC 61000-4-2 system level ESD standard. Specifications are subject to change without notice.
003 6
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array
Package Schematic
VDD 24 23 22 21 20 VSS 19 18 17 16 15 14 13
How To Order
2 DEA - 2 - Q 24 R
Product Class Thin-Film-on-Silicon Product Function ESD Protection Diode Array DEA = 20 Lines DEB = 17 Lines Standard Standard Package Style Q= QSOP W = Wide-Body SOIC Pin Count Q = 24 W = 20
1
2
3
4
5
67 VSS
8
9
10 11
12 VDD
Typical Part Marking
Represents total content. Layout may vary.
PRODUCT FUNCTION PIN COUNT PIN 1 INDICATOR (MOLDED INDENT) MANUFACTURER'S TRADEMARK DEA002 24Q YYWW PACKAGE STYLE
Dispensing R = Reel T = Tube
Standard Part Numbers
Part Number (Tape & Reel) 2DEA-2-Q24R 2DEB-2-W20R Part Number (Tubes) 2DEA-2-Q24T 2DEB-2-W20T
DATE CODE
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array
QSOP Package Dimensions
A .635 TYP. (.025) 3.81 - 3.99 (.150 - .157)
Wide-Body SOIC Package Dimensions
12.66 - 12.86 (.496 - .505) 1.27 TYP. (0.50)
0.66 (.026) REF
7.40 - 7.60 (.291 - .299)
PIN 1
PIN 1
.21 - .31 (.008 - .012) 1.35 - 1.75 (.053 - .069)
0.38 - 0.48 (.014 - .016) 2.44 - 2.64 (.096 - .104)
0.10 - 0.30 (.004 - .012)
.10 - .25 (.004 - .010)
0.23 - 0.32 (.0091 - .0125)
0-8 °
.19 - .25 (.007 - .010)
0-8°
10.11 - 10.51 (.398 - .414)
5.80 - 6.20 (.228 - .244)
.41 - 1.27 (.016 - .050)
Model
A
2QSP24
8.56 - 8.74
(.337 - .344)
Governing dimensions are in mm. Dimensions in parentheses are in inches and are approximate. JEDEC Reference Number MS-013.
Governing dimensions are in mm. Dimensions in parentheses are in inches and are approximate. JEDEC Reference Number MO-137.
QSOP Package Power Temperature Derating Curve
1.25 WATTS 1.0 .75 .50 .25 0 25 50 75 100 125 150 AMBIENT TEMPERATURE ( ° C ) 2QSP24
Wide-Body SOIC Package Power Temperature Derating Curve
1.25 WATTS 1.0 .75 .50 .25 0 25 50 75 100 125 150 AMBIENT TEMPERATURE ( ° C ) WBSOIC20
Reliable Electronic Solutions
Asia-Pacific: Tel: +886- (0)2 2562-4117 Fax: +886- (0)2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 North America: Tel: +1-909 781-5500 Fax: +1-909 781-5700 www.bourns.com
09/02 Specifications are subject to change without notice.
COPYRIGHT© 2002, BOURNS, INC. LITHO IN U.S.A. REV. 9/02 e/TF0201
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