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Details, datasheet, quote on part number:2FAH-C20R
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Features
New Product Development Integrated Passive Device ESD Protection to IEC61000-4-2 Spec.
2FAH-C20R Series - Integrated Passive & Active Device using CSP
General Information This application specific integrated passive component is designed to provide all of the necessary ESD protection and line resistance required on the data port of a custom portable electronic device. The ESD protection provided by the component enables the data port to withstand ±8 KV Contact / ±15 KV Air Discharge when tested according to the method specified in IEC 61000-4-2. The component incorporates 7 identical channels and is supplied in a 20 pin CSP package which is intended to be mounted directly onto an FR4 printed circuit board. This package will meet typical thermal cycle and bend test specifications without the use of an underfill material.
SOLDER BUMPS SILICON DIE
Figure 1 CSP Format
Electrical & Thermal Characteristics
Electrical Characteristics
(TA = 25 °C unless otherwise noted) Zener Diode Breakdown Voltage @ 1 mA Leakage Current @ 3 V ESD Performance (Note 1) Withstand Contact Discharge Air Discharge Let Through (Note 2) Contact Discharge Air Discharge Channel Specification Resistance Capacitance @ 1 V & 1 MHz
Symbol
VZT IR
Minimum
6
Nominal
7.2
Maximum
8 1
Unit
V µA
±8 ±15 ±150 ±150 R C 90 8.5 100 10.5 110 12.5
kV kV V V pF
Thermal Characteristics
(TA = 25 °C unless otherwise noted) Operating Temperature Storage Temperature Total Power Dissipation @ 70 °C Note: TJ Tstg PD -40 -60 25 25 +85 +125 100 °C °C mW
1. The IEC 61000-4-2 test method will be adapted for component level testing. The device will provide the specified ESD protection performance on the "IN 1-7" pins only. 2. "Let Through" is a measure of the component of an incident ESD transient that the protection device allows through to the down stream circuitry.
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
2FAH-C20R Series - Integrated Passive & Active Device using CSP
Mechanical Characteristics This is a Silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the Silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The grid pitch is 0.5mm. The dimensions for the CSP packaged device are shown in Fig. 2 below.
858 ± 40 (33.78 ± 1.57) 248.5 ± 45 (9.78 ± 1.78) BUMP A1/PIN 1 INDICATOR BOURNS LOGO
A1
B1
C1
D1
A2
B2
C2
D2
500 (19.69)
A3 B3
300 DIA. (11.81)
C3 D3
2597 ± 45 (102.24 ± 1.78)
A4
B4
C4
D4
500 (19.69)
A5 B5 C5 D5
225 ± 20 (8.86 ± 0.79)
348.5 ± 45 (13.72 ± 1.78)
248.5 ± 45 (9.78 ± 1.78)
45 ± 45 (1.78 ± 1.78)
45 ± 45 (1.78 ± 1.78) DIMENSIONS = MICRONS (MILS)
1997 ± 45 (78.62 ± 1.78)
Fig. 2 Device Mechanical Drawing
Reliability Reliability data exists and continues to be gathered on an ongoing basis for Bourns Integrated Passive and Active Devices using CSP packaging. "Package level" testing of the integrity of the solder joint is carried out on an independent Daisy-Chain test device. A 25-Pin Daisy Chain component is available from Bourns for this purpose (part number 2TAD-C25R). This is a 5 x 5 array featuring 0.5mm pitch solder bumps. The Distance to Neutral Point (DNP) on that component is larger than that of the 2FAH-C20R and is thus deemed a worse case for Thermal Cycle testing. "Silicon level" reliability performance will be assured by similarity to other Integrated Passive and Active Devices using CSP product from Bourns. Individual Channel Schematic This section contains the schematic (See Fig. 3 below) for the single channel in the integrated passive device. Note that the electrical parameters of primary interest are (a) DC Resistance and (b) ESD performance. In terms of DC parameters it should be noted that all resistor values have a tolerance of ±10 %. This schematic consists of a series 100ohm resistance and Back to Back Zener 6.5 Volt diodes for ESD protection.
IN 100 OUT
±6.5V
Key Design Parameters DC Channel Resistance: 100 ±10 % DC Channel Capacitance: 12.5 pF Maximum VBR: 6 V Min, 8 V Max @ IBR = 1 mA. IR: 1 uA Max @ VR =3 V.
Fig. 3 Channel Schematic
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
2FAH-C20R Series - Integrated Passive & Active Device using CSP
Block Diagram Figure 4 contains a block diagram of the CSP device. This diagram includes the pin names and basic electrical connections associated with each channel. Marking The device will be laser marked on the backside according to the following Fig. 5 scheme below. Position A1, on the Bump Grid is located at the top left of the die when the die is orientated so that the mark is read in the normal fashion.
PIN A1 LOCATION
IN1 100 ±6.5V
OUT1
12345 FAH Lotcode
IN2 100 ±6.5V
OUT2
A B C D
Fig. 5 Backside Laser Mark
IN3 100 ±6.5V
OUT3
IN4 100 ±6.5V
OUT4
PCB Design and SMT Processing
OUT5 100
IN5
±6.5V
Please consult Bourns' Thin Film on Silicon using CSP Users Guide Application Note for notes on PCB design and SMT processing.
IN6 100
OUT6
How to Order
±6.5V
2 FAH - C20R__
IN7 100 ±6.5V OUT7
Thinfilm Model Chipscale No. of Solder Bumps Packaging Option - R = Tape and Reel Packaged 3000 pcs. / 7 " reel
GROUND
GROUND
Fig. 4 Device Block Diagram
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
2FAH-C20R Series - Integrated Passive & Active Device using CSP
Device Pin Out The Pin-Out for the device is shown in Fig. 6. Note also that the device is shown with bumps facing up.
OUT 3 OUT 4 OUT 5
D
OUT 2 OUT 6
C
OUT 1 OUT 7
B
IN 1 IN 7
GROUND X6
A
IN 2 IN 6
Function IN1 IN2 IN3 IN4 IN5 IN6 IN7 OUT1 OUT2 OUT3
Pin Out B1 A1 A2 A3 A4 A5 B5 C1 D1 D2
Function OUT4 OUT5 OUT6 OUT7 Ground Ground Ground Ground Ground Ground
Pin Out D3 D4 D5 C5 B2 B3 B4 C2 C3 C4
1
IN 3
2
3
IN 4
4
5
IN 5
Fig. 6 (a) - Device Pin Out "Bumps Up" View
Fig. 6 (b) - Pin Listings
Packaging The product will be dispensed in an 8mm x 4mm Tape and Reel format - see Fig. 7 diagram below. The Tape and Reel package will conform to customer specification.
0.3 ± 0.05 (.01 ± .002) 2.0 ± 0.05 (.08 ± .002) 4.0 ± 0.1 (.16 ± .004) 1.5 ± 0.1/-0 (.06 ± .004/-0) DIA. 1.75 ± 0.1 (.07 ± .004)
R
0.3 MAX. (0.01)
8.0 ± 0.3 (.31 ± .01) 3.5 ± 0.05 (.14 ± .002) 2.19 ± 0.05 (.09 ± .002) 4.0 ± 0.1 (.16 ± .004) R 0.25 TYP. (0.001) MILLIMETERS (INCHES)
0.9 ± 0.05 (.04 ± .002)
2.77 ± 0.05 (.11 ± .002)
ORIENTATION OF COMPONENT IN POCKET BACKSIDE FACING UP
DIMENSIONS =
Fig. 7 - Tape and Reel Drawing
Reliable Electronic Solutions
Asia-Pacific: TEL +886- (0)2 25624117 · FAX +886- (0)2 25624116 Europe: TEL +353 214 515 225 · FAX +353 214 515 292 North America: TEL +1-909 781-5492 · FAX +1-909 781-5700
www.bourns.com
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
COPYRIGHT© 2001, BOURNS, INC. LITHO IN U.S.A. IP 5/02 .5M/CS0202 2FAH-C20R REV. F, 8/12/03
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