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Details, datasheet, quote on part number:KMM364C410CS
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| Part: | KMM364C410CS |
| Category: | Memory => DRAM => Async DRAM => Modules => Buffered DIMM |
| Description: | Description = KMM364C410CK 4Mx64 DRAM Dimm Using 4Mx4,4K&2K Refresh,5V ;; Density(MB) = - ;; Organization = 4Mx64 ;; Mode = Fast Page ;; Refresh = 2K/32ms ;; Speed(ns) = 50,60 ;; #of Pin = 168 ;; Component Composition = (4Mx4)x16+Drive ICx2 ;; Production Status = Eol ;; Comments = - |
| Company: | Samsung Semiconductor, Inc. |
| Datasheet: | Download KMM364C410CS datasheet File size : 390 kB |
| Request For quote: | Find where to buy KMM364C410CS
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Datasheet text preview:
DRAM MODULE
KMM364C400CK/CS KMM364C410CK/CS
KMM364C400CK/CS & KMM364C410CK/CS with Fast Page Mode 4Mx64 DRAM DIMM using 4Mx4, 4K & 2K Refresh, 5V
GENERAL DESCRIPTION
The Samsung KMM364C40(1)0C is a 4Mx64bits Dynamic RAM high density memory module. The Samsung KMM364C40(1)0C consists of sixteen CMOS 4Mx4bits DRAMs in SOJ/TSOP-II 300mil package, and two 16bits driver IC in 48pin TSSOP package mounted on a 168-pin glassepoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM. The KMM364C40(1)0C is a Dual In-line Memory Module and is intended for mounting into 168-pin edge connector sockets.
FEATURES
· Part Identification - KMM364C400CK (4096 cycles/64ms Ref., SOJ) - KMM364C400CS (4096 cycles/64ms Ref., TSOP) - KMM364C410CK (2048 cycles/32ms Ref., SOJ) - KMM364C410CS (2048 cycles/32ms Ref., TSOP) · Fast Page Mode Operation · CAS-before-RAS Refresh capability · RAS-only and Hidden refresh capability · TTL compatible inputs and outputs · Single 5V±10% power supply
PERFORMANCE RANGE
Speed -5 -6
tRAC
50ns 60ns
tCAC
18ns 20ns
tRC
90ns 110ns
· JEDEC standard pinout & Buffered PDpin · Buffered input except RAS and DQ · PCB : Height(1000mil), double sided component
PIN CONFIGURATIONS
Pin Front Pin Front 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 VSS DQ0 DQ1 DQ2 DQ3 VCC DQ4 DQ5 DQ6 DQ7 DQ8 VSS DQ9 DQ10 DQ11 DQ12 DQ13 VCC DQ14 DQ15 DQ16 DQ17 VSS RSVD RSVD VCC W0 CAS0 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 CAS2 RAS0 OE0 VSS A0 A2 A4 A6 A8 A10 *A12 VCC RFU RFU VSS OE2 RAS2 CAS4 RSVD W2 VCC RSVD RSVD DQ18 DQ19 VSS DQ20 DQ21 Pin Front 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 DQ22 DQ23 VCC DQ24 RFU RFU RFU RFU DQ25 DQ26 DQ27 VSS DQ28 DQ29 DQ30 DQ31 VCC DQ32 DQ33 DQ34 DQ35 VSS PD1 PD3 PD5 PD7 ID0 VCC Pin 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 Back VSS DQ36 DQ37 DQ38 DQ39 VCC DQ40 DQ41 DQ42 DQ43 DQ44 VSS DQ45 DQ46 DQ47 DQ48 DQ49 VCC DQ50 DQ51 DQ52 DQ53 VSS RSVD RSVD VCC RFU CAS1 Pin 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 Back RSVD *RAS1 RFU VSS A1 A3 A5 A7 A9 A11 *A13 VCC RFU B0 VSS RFU *RAS3 CAS5 CAS7 PDE VCC RSVD RSVD DQ54 DQ55 VSS DQ56 DQ57 Pin 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 Back DQ58 DQ59 VCC DQ60 RFU RFU RFU RFU DQ61 DQ62 DQ63 VSS DQ64 DQ65 DQ66 DQ67 VCC DQ68 DQ69 DQ70 DQ71 VSS PD2 PD4 PD6 PD8 ID1 VCC
PIN NAMES
Pin Names A0, B0, A1 - A11 A0, B0, A1 - A10 DQ0 - DQ71 W0, W2 OE, OE2 RAS0, RAS2 CAS0 ~ CAS7 VCC VSS NC PDE PD1 - 8 ID0 - 1 RSVD RFU Function Address Input (4K Ref) Address Input (2K Ref) Data In/Out Read/Write Enable Output Enable Row Address Strobe Colume Address Strobe Power(+5V) Ground No Connection Presence Detect Enable Presence Detect ID bit Reserved Use Reserved for Future Use
Pins marked * are not used in this module.
PD & ID Table
Pin PD1 PD2 PD3 PD4 PD5 PD6 PD7 PD8 ID0 ID1 50NS 1 1 0 1 0 0 0 1 0 0 60NS 1 1 0 1 0 1 1 1 0 0
NOTE : A11 is used for only KMM364C400CK/CS (4K ref.)
PD Note : PD & ID Terminals must each be pulled up through a register to V C at the next higher C level assembly. PDs will be either open (NC) or driven to V S via on-board buffer circuits. PD : 0 for Vol of Drive IC & 1 for N.C S ID Note : IDs will be either open (NC) or connected directly to V S without a buffer. S ID : 0 for Vss & 1 for N.C
DRAM MODULE
FUNCTIONAL BLOCK DIAGRAM
RAS0 CAS0 W0 OE0 A0 A1-A11(A10) DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 CAS1 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ16 CAS2 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 DQ25 CAS3 DQ27 DQ28 DQ29 DQ30 DQ31 DQ32 DQ33 DQ34 DQ0 DQ1 DQ2 DQ3 DQ0 DQ1 DQ2 DQ3
U6
KMM364C400CK/CS KMM364C410CK/CS
RAS2 CAS4 W2 OE2 B0 A1-A11(A10) DQ0 DQ1 DQ2 DQ3 DQ0 DQ1 DQ2 DQ3
U0
DQ36 DQ37 DQ38 DQ39 DQ40 DQ41 DQ42 DQ43 CAS5
DQ0 DQ1 DQ2 DQ3 DQ0 DQ1 DQ2 DQ3
U8
U1
U9
DQ0 DQ1 DQ2 DQ3 DQ0 DQ1 DQ2 DQ3
U2
DQ45 DQ46 DQ47 DQ48 DQ49 DQ50 DQ51 DQ52 CAS6
DQ0 DQ1 DQ2 DQ3 DQ0 DQ1 DQ2 DQ3
U10
U3
U11
DQ0 DQ1 DQ2 DQ3 DQ0 DQ1 DQ2 DQ3
U4
DQ54 DQ55 DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 CAS7 DQ63 DQ64 DQ65 DQ66 DQ67 DQ68 DQ69 DQ70
DQ0 DQ1 DQ2 DQ3 DQ0 DQ1 DQ2 DQ3
U12
U5
U13
DQ0 DQ1 DQ2 DQ3 DQ0 DQ1 DQ2 DQ3
U14
U7
U15
Vcc Vss
.1 or .22uF Capacitor under each DRAM
To all DRAMs
A0 B0 A1-An W0, 2 OE0, 2
U0-U7 U8-U15 A1-An : U0-U15
DRAM MODULE
ABSOLUTE MAXIMUM RATINGS *
Item Voltage on any pin relative VSS Voltage on VCC supply relative to VSS Storage Temperature Power Dissipation Short Circuit Output Current Symbol VIN, VOUT VCC Tstg PD IOS
KMM364C400CK/CS KMM364C410CK/CS
Rating -1 to +7.0 -1 to +7.0 -55 to +125 16 50 Unit V V °C W mA
* Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for intended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS (Voltage referenced to VSS, TA = 0 to 70°C)
Item Supply Voltage Ground Input High Voltage Input Low Voltage *1 : VCC+2.0V/20ns, Pulse width is measured at VCC. *2 : -2.0V/20ns, Pulse width is measured at VSS. Symbol VCC VSS VIH VIL Min 4.5 0 2.4 -1.0
*2
Typ 5.0 0 -
Max 5.5 0 VCC+1*1 0.8
Unit V V V V
DC AND OPERATING CHARACTERISTICS (Recommended operating conditions unless otherwise noted)
Symbol ICC1 ICC2 ICC3 ICC4 ICC5 ICC6 II(L) IO(L) VOH VOL Speed -5 -6 Dont care -5 -6 -5 -6 Dont care -5 -6 Dont care Dont care KMM364C400CK/CS Min
-
KMM364C410CK/CS Min
-
Max 1440 1280 100 1440 1280 1280 1120 30 1440 1280 40 5 0.4
Max 1760 1600 100 1760 1600 1440 1280 30 1760 1600 40 5 0.4
Unit mA mA mA mA mA mA mA mA mA mA uA uA V V
-
-
-
-
-40 -5 2.4 -
-40 -5 2.4 -
ICC1* : Operating Current * (RAS, CAS, Address cycling @tRC=min) ICC2 : Standby Current (RAS=CAS=W=VIH) ICC3* : RAS Only Refresh Current * (CAS=VIH, RAS cycling @tRC=min) ICC4* : Fast Page Mode Current * (RAS=VIL, CAS cycling : tPC=min) ICC5 : Standby Current (RAS=CAS=W=Vcc-0.2V) ICC6* : CAS-Before-RAS Refresh Current * (RAS and CAS cycling @tRC=min) II(L) : Input Leakage Current (Any input 0VINVcc+0.5V, all other pins not under test=0 V) IO(L) : Output Leakage Current(Data Out is disabled, 0VVOUTVcc) VOH : Output High Voltage Level (IOH = -5mA) VOL : Output Low Voltage Level (IOL = 4.2mA) * NOTE : ICC1 , ICC3, ICC4 and ICC6 are dependent on output loading and cycle rates. Specified values are obtained with the output open. ICC is specified as an average current. In ICC1 and ICC3, address can be changed maximum once while RAS=VIL. In ICC4, address can be changed maximum once within one page mode cycle, tPC.
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