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Part: SPI-315-34
Category:
Description: GAAS Infrared Led Single Phototransistor , Package :
Company: Sanyo Semiconductor Corporation
Datasheet: Download SPI-315-34 datasheet File size : 417 kB
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Datasheet text preview:
Ordering number : EN6028
SPI-315-34
Infrared LED
SPI-315-34
Ultraminiature photoreflector (single-transistor type)
Features
· Infrared LED plus Phototransistor (single) · DIP type · Compact type : 3.4 (L) ! 2.7 (W) ! 1.5 (H) mm · Visible light cut type · Lead length : (L=3.5mm)
Absolute Maximum Ratings at Ta=25°C, 65%RH
Parameter Forward Current Reverse Voltage Power Dissipation Collector-Emitter Voltage Emitter-Collector Voltage Collector Curren Power Dissipation Operating Temperature Storage Temperature Soldering Temperature *1 Symbol IF VR PD VCEO VECO IC PC Topr Tstg Tsol Rating 50 5 70 20 5 20 70 - 20 to +80 --30 to +100 260 Unit mA V mW V V mA mW °C °C °C
Input LED
Output Phototransistor
*1
Soldering conditions : time : max. 3sec; clearance : min. 1mm from lower case edge.
Electro-Optical Characteristics at Ta=25°C, 65%RH
Parameter Forward Voltage Reverse Current Dark Current Collector Output Current Leakage Current Collector Emitter Saturation Voltage Symbol VF IR I CEO IC I LEAK VCE(sat) Condition IF=10mA VR=5V IF=0mA, VCE=10V IF=10mA,VCE=5V *1 IF=10mA,VCE=5V *2 IF=10mA, IC=50µA VCC=5V, RL=100 IC=1mA Min. 1.0 80 Typ. 1.2 5 5 Max. 1.6 10 200 1100 1 0.5 --Unit V µA nA µA µA V µs µs
Input Output
Coupled
Rise Time tr Fall Time tf 1 Location of reflector is shown in Fig. 1. *
*2 *3
No reflector Table of Classification of Collector Output Class Ic (µA) A 1100 to 450 B 600 to 260 C 350 to 150 D 200 to 80
AL V.E. film
Glass plate (t : 1mm)
Fig. 1
Location of Reflector
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
72199 GI, (MI) No.6028 1/6
SPI-315-34
Package dimensions and Pin connection
As stated in the sttached paper. (No.6028 4/6)
A
Lot marking
Color division shall be done as shown in the drawing. (Fig. 2) Year of even number : Front side Year of odd number : Back side Color Part `A' Part `B' Black January July Blue February August Red March September Green April October
Front side B
Fig. 2
Orange May November
Brown June December
Soldering conditions
(1) Temperature (2) Time (3) Clearance : Max. 260°C : Max. 3sec : Min. 1mm from the case edge. (Fig. 3)
Fig. 3
PRECAUTIONS (1) Bending a lead should avoid. However, when bending is necessary, take care the next items. q Bending a lead must be done before soldering. w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that stress for the regin part cause troubles such as gold wire breaking and so on. e A lead must be bend at intervals of 1mm from the case edge. r Do not bend the same position of leads more than twice. (2) The hole pitch of a circuit board must fit to the lead pitch. (3) Take core the following when soldering. q Do not heat a product under any stress (a twist and so on) to leads. w Do not heat a product in the states of operating force to the regin part. (4) Use the flux which contain no chlorine, have no corrosion and do not need washing. (5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
1mm
No.6028 2/6
SPI-315-34
Pin No.
1
C 0.6
4
Pin connection 1. LED Anode 2. LED Cathode 3. Ph. Tr Collector 4. Ph. Tr Emitter
1.6
2
3
0.4
1
2
3
4
4.0
3.4 0.5
2.7
4 -- 0.6
1.5
3.3 0.5 3.5 ± 0.5
2.6
4 -- 0.4
4 -- 0.2
2.0
2 -- 0 to 20°
2 -- 0 to 20°
2 -- ± 10°
2 -- ± 10° Tolerance : ±0.2 Unit : mm
No.6028 3/6
Others parts begin by sp
SP-1 SP-2 SP-3 SP-4 SP-5 SP-6 SP-7 SP-8 SP-9 SP-10 SP-11 SP-12 SP-13 SP-14 SP-15 SP-16 SP-17 SP-18 SP-19 SP-20 SP-21 SP-22 SP-23 SP-24 SP-25 SP-26 SP-27 SP-28 SP-29 SP-30 SP-31 SP-32
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