Details, datasheet, quote on part number: SP4425Q
PartSP4425Q
CategoryInterface and Interconnect
DescriptionElectroluminescent Lamp Driver Low Voltage Applications
CompanySipex Corporation
DatasheetDownload SP4425Q datasheet
  

 

Features, Applications

s Low Voltage, Single Battery Operation (VBATTERY > 1.1 VDC) to AC Inverter for EL Backlit Display Panels s Externally Adjustable Internal Oscillator s Low Current Standby Mode

APPLICATIONS
DESCRIPTION

The is a high voltage output DC-AC converter that can operate from a single 1.5 VDC power supply. The SP4425 is capable of supplying to 220 VPP signals, making it ideal for driving electroluminescent lamps. The device features 1 A (typical) standby current for use in low power portable products. One external inductor is required to generate the high voltage charge and one external capacitor is used to select the oscillator and lamp frequencies. The SP4425 is offered in both an 8-pin narrow SOIC and 8-pin micro SOIC package. For delivery in die form, please consult the factory.

SP4425DS/20 SP4425 Electroluminescent Lamp Driver Copyright 2000 Sipex Corporation

These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. VDD...................................................................................................................5V Input Voltages/Currents HON (pin1)........................................-0.5V to (VDD + 0.5V) COIL (pin3)............................................................100mA Lamp Outputs..............................................................................230VPP Storage to +150C Power Dissipation Per Package 8-pin NSOIC (derate 6.14mW/oC above +70oC).................................500mW 8-pin SOIC (derate 4.85mW/oC above +70oC)..................................390mW

The information furnished herein by Sipex has been carefully reviewed for accuracy and reliability. Its application or use, however, is solely the responsibility of the user. No responsibility for the use of this information is assumed by Sipex, and this information shall not explicitly or implicitly become part of the terms and conditions of any subsequent sales agreement with Sipex. Specifications are subject to change without prior notice. By the sale or transfer of this information, Sipex assumes no responsibility for any infringement of patents or other rights of third parties which may result from its use. No license or other proprietary rights are granted by implication or otherwise under any patent or patent rights of Sipex Corporation.

SPECIFICATIONS

(T= 25C; VDD = 1.5V; Lamp Capacitance 1 00 Series resistance; Coil at 4 Ohms; COSC = 180pF unless otherwise noted); CINT=1800pF

PARAMETER Supply Voltage, VDD Supply Current, ICOIL+IDD Coil Voltage, VCOIL HON Input Voltage, VHON LOW: EL off HIGH: EL on HON Current, EL on Shutdown Current, ISD=ICOIL+IDD INDUCTOR DRIVE Coil Frequency, fCOIL=fLAMPx64 Coil Duty Cycle Peak Coil Current, IPK-COIL EL LAMP OUTPUT EL Lamp Frequency, fLAMP Peak to Peak Output Voltage

(T= 25C; VDD = 3.0V; Lamp Capacitance = 4nF with 100 Series resistance; Coil = 2mH/44ohms; COSC = 180pF, CINT = 470pF unless otherwise noted)

PARAMETER Supply Voltage, VDD Supply Current, ICOIL+IDD Coil Voltage, VCOIL HON Input Voltage, VHON LOW: EL off HIGH: EL on HON Current, EL on Shutdown Current, ISD=ICOIL+IDD INDUCTOR DRIVE Coil Frequency, fCOIL=fLAMPx64 Coil Duty Cycle Peak Coil Current, IPK-COIL EL LAMP OUTPUT EL Lamp Frequency, fLAMP

This data sheet specifies environmental parameters, final test conditions and limits as well suggested operating conditions. For applications which require performance beyond the specified condition and or limits please consult the factory.

NOTES: 1. Dimensions are in Microns unless otherwise noted. 2. Bonding pads are 125x125 typical. 3. Outside dimensions are maximum, including scribe area. 4. Die thickness is 10 mils 1. 5. Pad center coordinates are relative to die center. 6. Die size x 44 mils.


 

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