|Category||RF & Microwaves => Switches|
|Description||GAAS SPDT ic 4 W T/r Switch DC 4 GHZ|
|Company||Skyworks Solutions, Inc.|
|Datasheet||Download AH004R2-93 datasheet
Low DC Power Consumption Low Insertion Loss High Linearity (56 dBm IP3) T/R Switch Small Low Cost "Chip on Board" PackageDescription
The an IC FET SPDT switch in a low cost "chip on board" package. It features extremely high linearity, low insertion loss, with very low DC power consumption. Some standard implementations include antenna changeover, T/R and diversity switching over 2 W. This switch can be used in many analog and digital wireless communication systems.
Parameter Switching Characteristics Condition Rise, Fall or 90/10% RF) On, Off (50% CTL to 90/10% RF) Video -10 V For Two-tone Input Power 13 dBm, VHigh V 0.9 GHz 0.9 GHz 0.9 GHz Frequency Min. Typ. Max. Unit ns mV dBmInput Power for 1 dB Compression Intermodulation Intercept Point (IP3) Control Voltages
4. Video feedthru measured with 1 ns risetime pulse and 500 MHz bandwidth. = 300 kHz.
1. All measurements made a 50 system, unless otherwise specified. 2. Insertion loss changes by 0.003 dB/°C. 3. Insertion loss state.
Alpha Industries, Inc.  241-7000 Fax  241-7906 Email firstname.lastname@example.org www.alphaind.com0 J1J2 Insertion Loss Isolation J1J3 Isolation Insertion Loss
Characteristic RF Input Power (RF In) Control Voltage (VC) Value 6 W Max. > 900 MHz 0/-10 V Control +150°C 35°C/WOperating Temperature (TOP) Storage Temperature (TST) Thermal Resistance (JC)
The "chip on board" package is a ceramic leadless chip carrier with a ceramic lid, which allows for automatic pick and place. The external terminals and backside ground plane are Pt/Pd/Ag, which is highly leach resistant and very tolerant to variations in solder conditions. The glass fingers between contacts prevent the possibility of shorted terminals. The recommended solder attachment a SN6337 (Pb/SN).
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